A three-dimensional imaging system and method are provided. The three-dimensional imaging system includes: an ultrashort pulse laser light source configured to generate a detection beam; a supercontinuum spectrum generator configured to generate a supercontinuum spectrum based on the detection beam passing through the supercontinuum spectrum generator; a pulse separation delayer configured to generate a continuous pulse sequence of different wavelengths with a time interval based on the supercontinuum spectrum; a multi-frequency pulse interference fringe generator configured to generate multi-frequency interference fringe patterns of different wavelength ranges with a time interval based on the continuous pulse sequence; and an image acquisition device configured to acquire an optical signal reflected by a sample irradiated by the multi-frequency interference fringe patterns to obtain a three-dimensional topography of the sample.

An imaging element comprises a first communication interface that is incorporated in the imaging element and outputs first image data based on image data obtained by imaging a subject to an external processor, a memory that is incorporated in the imaging element and stores the image data, and a second communication interface that is incorporated in the imaging element and outputs second image data based on the image data stored in the memory to the external processor, in which an output method of the first communication interface and an output method of the second communication interface are different.

A data transmission circuit of an image sensor. In one embodiment, the data transmission circuit includes a plurality of banks coupled in a series. A peripheral bank of the plurality of transmission banks is coupled to a function logic. Each bank includes a plurality of local buffers coupled to a local buffer control and a plurality of global buffers coupled to a global buffer control. The local buffers are settable to their enabled or disabled state by a bank enable command at the local buffer control. The enabled local buffers are configured to transfer local data to shift registers of their respective bank. The disabled local buffers are configured not to transfer the local data to the shift register of their respective bank.

The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity.

Methods, apparatus, systems, and computer-readable media are provided that relate to using one or more vision sensors to capture images of a loaded pallet in association with application of stretch wrap to the loaded pallet by an automated pallet wrapping machine. The images are used to generate an image-based identifier for the loaded pallet that is then used for pallet identification by mobile robots and/or other automated agents in a warehouse or other environment. In some implementations, the images are captured by the vision sensor when the pallet is in the wrapping area of the automated pallet wrapping machine and while the vision sensor and/or the pallet are rotating. In some implementations, the image-based identifier may be assigned to pallet attributes and/or a de-palletizing scheme of the loaded pallet.

The present invention provides an alerting method for monitoring a color shift of a display panel. The alerting method includes: generating a grayscale waveform diagram for an entire frame according to a normal pixel pattern of the display panel, the grayscale waveform diagram having waveform setting values; generating a grayscale waveform diagram for an entire frame according to a pixel pattern of a display panel to be tested, the grayscale waveform having waveform reference values; and obtaining a predetermined difference value between each of the waveform reference values and each of the waveform setting values, and sending out an alerting message when the predetermined difference value exceeds a specified value.

An apparatus configured to acquire a plurality of spectral images of an object includes at least one processor configured to execute a plurality of tasks including a selection task configured to select a recording wavelength band according to an input by a user, and a control task configured to store in a memory information on a spectral image corresponding to the recording wavelength band. The apparatus acquires the plurality of spectral images by imaging the object through a plurality of lens units each configured to form an image of the object, and a plurality of filters each of which is disposed on a corresponding one of optical axes of the plurality of lens units.

A semiconductor-inspection method is performed by a semiconductor-inspection system. In the method, user input is received that specifies a swath across a semiconductor die for inspection. The swath has a width that is less than a width of the semiconductor die and that corresponds to a field of view of the semiconductor-inspection system. The swath of the semiconductor die is inspected based on the user input. Data from inspecting the swath is processed to identify defects in the swath.

Disclosed are an optical interferometry apparatus for detection of dielectric nanoparticles and a method for enhancing visibility of the nanoparticles. An imaging system for detection of dielectric nanoparticles includes at least one light source for illumination, a detector array or a camera for image capture, an objective lens, a sample substrate and a computing unit. The sample substrate is capable of carrying sub-wavelength particles smaller than the diffraction resolution limit of the imaging system, and the imaging system includes a movable means which moves the sample substrate in the axial direction such that depthwise different images are captured at different axial distances from the sample substrate to the objective lens. The computing unit computes a correlation image using the depth images wherein the sub-wavelength particles become resolvable and appear with higher contrast in the correlation image.

Disclosed is a CMOS image sensor with global shutters and a method for fabricating the CMOS image sensor. In one embodiment, a semiconductor device, includes: a light-sensing region; a charge-storage region; a light-shielding structure; and at least one via contact; wherein the charge-storage region is spatially configured adjacent to the light-sensing region in a lateral direction, wherein the light-shielding structure is configured over the charge-storage region in a vertical direction so as to prevent incident light leaking from the light-sensing region to the signal-processing region, wherein the light-shielding structure is configured in an interlayer dielectric (ILD) layer, and wherein the light-shielding structure is simultaneously formed with the at least one via contact.