According to an embodiment, a method of manufacturing an organic electronic device including a stack including a first electrode layer, one or more functional layers, and a second electrode layer, the one or more functional layers and the second electrode layer being formed in this order on the first electrode layer, comprises: a first layer forming step of forming a first layer 24 among the layers included in the stack; and a second layer forming step of forming a second layer on the first layer by using a coating solution containing a material for the second layer and a solvent with boiling point of 160° C. or more, the second layer being in contact with the first layer. In the first layer forming step, the first layer is formed with a thickness t smaller than a desired thickness such that the first layer has the desired thickness T due to an increase in a thickness of the first layer as the second layer is formed.

A mask assembly and an organic light emitting display device manufactured using the mask assembly are capable of realizing an organic light emitting display device having a hole in a display area, the mask assembly including a frame defining a first opening area, a first mask on the frame and defining a plurality of second opening areas that overlap the first opening area, and a second mask fixed to the frame across the plurality of second opening areas, and including a body portion overlapping the first mask, a blocking portion at each respective one of the second opening areas, and a pattern portion between the body portion and the blocking portion, and defining a plurality of holes.

The disclosure discloses a flexible display panel, a method for manufacturing the same and a display device. The flexible display panel includes a plurality of display sub-regions arranged at intervals, a plurality of flexible bridging portions and a plurality of connecting portions; every two adjacent display sub-regions are electrically connected through at least one of the flexible bridging portions; and the every two adjacent display sub-regions are further connected through at least one of the connecting portions; where when the every two adjacent display sub-regions are stretched, the at least one of the connecting portions is broken preferentially and enables the every two adjacent display sub-regions to deform; and the at least one of the flexible bridging portions electrically connects the every two adjacent display sub-regions before the at least one of the connecting portions is broken and after the at least one of the connecting portions is broken.

Provided are a display panel, a preparation method thereof and a display device. The display panel includes a light-emitting substrate and a color filter substrate; the color filter substrate includes: a substrate, a baffle wall layer and a reflective metal layer. The baffle wall layer is located on one side of the substrate and includes multiple baffle wall structures; the reflective metal layer includes a first reflective subsection covering a surface on a side, close to the light-emitting substrate, of the multiple baffle wall structures; the first reflective subsection includes multiple first metal subsections and multiple second metal subsections; and the multiple first metal subsections are independently disposed, and adjacent ones of the multiple second metal subsections along the first direction are connected to each other.

An encapsulation structure, a display panel and a manufacturing method thereof are provided. The display panel includes a base substrate; a device to be encapsulated; an encapsulation film; and an edge encapsulation member; an orthographic projection of the edge encapsulation member on the base substrate overlaps with an orthographic projection of the edge of the encapsulation film on the base substrate; the encapsulation film includes a first film, a second film, and a third film, the second film is interposed between the first film and the third film, and the first film is in contact with the third film at an edge location to form a stacked-contact portion, and at least the stacked-contact portion of the encapsulation film is covered by the edge encapsulation member, and at the edge location, the edge encapsulation member and the second film have an overlapped part in a direction perpendicular to the base substrate.

A method of manufacturing a display apparatus includes: forming a display element layer above a lower substrate, where the display element layer includes first to third display elements; forming an encapsulation layer on the display element layer; forming first partition walls on the encapsulation layer to define first to third color regions, where the first to third color regions overlap the first to third display elements, respectively, in a view in a direction perpendicular to the lower substrate; forming second partition walls on the first partition walls; forming a quantum dot layer, which includes forming a second color quantum dot layer in the second color region and forming a third color quantum dot layer in the third color region; and removing the second partition walls.

A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

An organic light-emitting display device includes a substrate; a thin-film transistor layer disposed on the substrate, and including a thin-film transistor including a gate electrode, a source electrode, and a drain electrode; a color filter layer disposed on the thin-film transistor layer and including a red color filter, a green color filter, and a blue color filter; an organic light-emitting element disposed on the color filter layer; and a plurality of out-coupling enhancing members formed in the thin-film transistor layer, wherein the out-coupling enhancing members are spaced from each other at a predetermined spacing and each of the out-coupling enhancing members extends in a stripe shape, and the out-coupling enhancing members vertically overlap the red color filter.

The present application provides a display panel and a manufacturing method thereof. The display panel includes a pixel defining layer, a light-emitting layer, an encapsulation layer, and a color filter functional layer. The pixel defining layer is provided with a first surface and a second surface opposite to each other, and a groove. The light-emitting layer is disposed in the groove. The encapsulation layer is disposed on the first surface of the pixel defining layer and extends to cover the light-emitting layer. The color filter functional layer is disposed in the encapsulation layer and corresponds to the groove.

The present invention relates to a light emitting device including a light emitting layer having a stacked structure of two or more layers in which the light emitting layer is alternately disposed with a first light emitting material layer and a second light emitting material layer. In addition, the light-emitting material layer is a perovskite layer or an organic material layer, the first light-emitting material layer and the second light-emitting material layer are characterized in that they have different band gaps. By alternately disposing the first light emitting material layer and the second light emitting material layer to have a stacked structure and by controlling the energy level, there is an advantage in that the electroluminescence efficiency can be improved by controlling the electron-hole recombination region of the light emitting device. In addition, there is an advantage that a white light emitting device can be manufactured by controlling the energy levels of the first light emitting material layer and the second light emitting material layer.