The present invention provides a display panel, a manufacturing method thereof and a display apparatus. The display panel includes a substrate, a light-emitting element, and a pixel defining layer. The light-emitting element includes a cathode, an anode and a light-emitting layer, the pixel defining layer defines a plurality of openings, the light-emitting layer is disposed in the openings and covers a predetermined area on a side of the pixel defining layer facing towards the openings, and hydrophilicity of the pixel defining layer at each position of the predetermined area is substantially identical.

Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display area, a mounting hole located in the display area, and an encapsulation region located between the display area and the mounting hole. The encapsulation region includes an insulating layer, an encapsulation pixel definition layer arranged on the insulating layer, and a partition structure layer arranged on the encapsulation pixel definition layer. The encapsulation pixel definition layer includes multiple spaced protrusions, the partition structure layer includes multiple spaced columns, the columns are arranged on the protrusions, a functional layer is arranged on the multiple spaced columns, and the functional layer is broken by the columns.

The present disclosure provides a display backplane, a method for manufacturing the same and a full-screen fingerprint identification display device. The display backplane includes a substrate; a circuit layer disposed on a surface of the substrate; a light emitting device layer disposed on a surface of the circuit layer away from the substrate; and a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer.

A method of manufacturing a display panel includes providing an insulating substrate that includes a hole area, a display area that surrounds the hole area, and a peripheral area adjacent to the display area, forming a semiconductor pattern in the display area, forming an insulating layer, forming contact holes in the insulating layer that expose portions of the semiconductor pattern, and forming a module hole by etching a portion of the insulating layer and a portion of the insulating substrate that overlap the hole area.

Disclosed are a display substrate and a manufacturing method therefor, and a display panel and a display device. The arrangement of a first isolation portion and a second isolation portion at least disconnects a first isolated portion from one of a second isolated portion and a third isolated portion; therefore, the effect of isolating a cathode can be enhanced when an isolated layer is the cathode multiplexed into a self-capacitance electrode; and when the isolated layer is an inorganic film encapsulation layer contained in a bezel area, cracks generated by cutting or for other reasons may be prevented from extending to a display area.

A display substrate motherboard has display areas and at least one cutting area located at least among the display areas. The display substrate motherboard includes a base substrate, first barrier groups disposed on the base substrate, an inert material layer and a first inorganic insulating layer. Each first barrier group is located on at least one side of a corresponding display area and includes two first barriers. A region between the two first barriers is located in a cutting area. The inert material layer is disposed in the region. The first inorganic insulating layer is disposed on a side of the first barrier groups away from the base substrate, and is further located in the display areas. An orthogonal projection of the first inorganic insulating layer on the base substrate is non-overlapping with an orthogonal projection of the inert material layer on the base substrate.

A display apparatus and a method for manufacturing the display apparatus are provided. The display apparatus includes: a flexible panel which includes a display region and a non-display region, where the non-display region includes a bending sub-region and a back sub-region connected to the bending sub-region and arranged opposite to the display region, a multiplexer is arranged in the back sub-region; and a shielding electrode layer located on a side of the multiplexer away from the back sub-region, an orthographic projection of the multiplexer onto a plane where the shielding electrode layer is located being within the shielding electrode layer.

The present disclosure provides a display panel, a manufacture method therefor, and a display device. The display panel of the present disclosure has: a base substrate having a display area and a peripheral area surrounding the display area; first sub-pixels, second sub-pixels and third sub-pixels disposed in the display area; and a separating insulated layer disposed at a side of the base substrate, an orthographic projection of the separating insulated layer on the base substrate at least covering the display area; wherein the first sub-pixels are disposed at a side of the separating insulated layer away from the base substrate, and the second sub-pixels and the third sub-pixels are disposed between the separating insulated layer and the base substrate.

The present disclosure provides a transparent display device, a simulation method, and a manufacturing method. The transparent display device includes a base substrate and a plurality of pixels arranged in an array form on the base substrate. Each pixel includes a transparent region and a display region, and a scattering structure for scattering light is arranged along a boundary between the transparent region and the display region.

A display assembly includes a cover plate, a film assembly, a flexible display panel and a circuit board. The flexible display panel includes a panel body and a bending portion connected to a side of the panel body. The cover plate, the film assembly and the panel body are sequentially stacked. The circuit board is disposed on a side of the panel body away from the film assembly, and the bending portion is electrically connected to the circuit board. The display assembly further includes a first bonding portion, the first bonding portion is disposed at a first side edge of the film assembly to bond at least one of the cover plate and the film assembly to the bending portion, and the first side edge of the film assembly is an edge of the film assembly proximate to the bending portion.