A novel display apparatus that is highly convenient or reliable is provided. Alternatively, a novel input/output device that is highly convenient or reliable is provided. The display apparatus is configured in the following manner: the periphery of end surfaces of a plurality of display panels is processed by laser light and the display panels are joined together so that unevenness is not generated at a boundary between the adjacent display panels and the outermost surface of the display apparatus is flat.

The present application provides a display panel and a manufacturing method thereof, wherein a projection of a light-absorbing layer in the display panel on a base substrate covers a projection of a gap between a first electrode and a second electrode on the base substrate, so as to absorb ambient light directly or indirectly irradiated on a channel region through the gap between a first electrode and a second electrode, so that the channel region on a first metal layer is well protected, which greatly reduces the problem of performance degradation of the channel region of an active layer caused by irradiation of the external ambient light.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.

According to an embodiment of the invention, the organic EL device (100) comprises: an element substrate (20) having a substrate (1) and a plurality of organic EL elements (3) supported by the substrate; a thin film encapsulation structure (10) formed above the plurality of organic EL elements and having at least one compound layered body (10S) constituted by a first inorganic barrier layer (12), an organic barrier layer (14) in contact with the upper surface of the first inorganic barrier layer and having a plurality of solid sections spread out discretely, and a second inorganic barrier layer (16) in contact with the upper surface of the first inorganic barrier layer and the upper surfaces of the plurality of solid sections of the organic barrier layer; an organic planarization layer (42) provided above the thin film encapsulation structure and formed from a photosensitive resin; and a touch sensor layer (50) disposed above the organic planarization layer.

A display device includes a display region including a plurality of first regions, and a plurality of second regions arranged with a certain gap between the plurality of first regions, wherein each of the plurality of first regions includes a transistor, a first organic layer, a wiring, a first organic insulating layer on the wiring and the transistor, a display element on the first organic insulating layer, a first sealing layer on the display element and stacked in order with a first inorganic insulating layer, a second organic insulating layer and a second inorganic insulating layer, each of the plurality of second regions includes the wiring, a second organic layer on the wiring, a second sealing layer stacked in order with the first inorganic insulating layer and the second inorganic insulating layer, and a thickness of the second organic layer is smaller than the thickness of the first organic layer.

The present disclosure provides a display device, a display apparatus, and a method for manufacturing a display device. The display device comprises a mainboard, a display panel disposed on the mainboard, and a fingerprint recognition sensor. The fingerprint recognition sensor is disposed on the mainboard, and the fingerprint recognition sensor is located between the mainboard and the display panel. A groove is formed on a surface of the display panel facing the mainboard, and an orthographic projection of the groove on the mainboard corresponds to a position of the fingerprint recognition sensor. The groove is configured to form an air gap between the fingerprint recognition sensor and the display panel.

The resent disclosure provides an OLED substrate, a photo mask, and a method of manufacturing the OLED substrate. In one embodiment, an OLED substrate includes: a base substrate; an anode layer on the base substrate; a pixel defining layer on the anode layer, the pixel defining layer having a pattern opening area, the pattern opening area including a plurality of pixel openings arranged in an array manner; and a light-emitting layer formed on the pixel defining layer by evaporation; wherein the pattern opening area has an inward contraction structure with respect to a regular pixel opening area structure in which a plurality of pixel openings are arranged in a manner of an regular array where rows in the regular array are equally spaced from each other and are parallel to each other and columns in the regular array are equally spaced from each other and are parallel to each other.

A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.

An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.