A semiconductor light-emitting device includes: a substrate having a wiring electrode; a semiconductor light-emitting element mounted on the wiring electrode and having a light-emitting functional layer with an upper surface exposed; a wavelength conversion plate mounted on the light-emitting functional layer and being made of a sintered body including fluorescent material particles and binder particles; and an adhesive layer including a resin medium for adhering a light-incident surface of the wavelength conversion plate to a light output surface of the light-emitting functional layer, and resin particles dispersed in the resin medium. The light-incident surface can expose a sintered surface of the sintered body with a concave portion, and the resin particles are fitted in the concave portion and compressively deformed. The semiconductor light-emitting device is capable of reducing the heat generated from the wavelength conversion plate and of maintaining the high light output.

A method for preparing a wavelength converting film is disclosed. The method comprising mixing at least one phosphor, a polysiloxane and optionally an organic solvent, thereby preparing a mixture, placing the mixture on a substrate, pre-curing the mixture on the substrate, thereby preparing a wavelength converting film. Furthermore, a wavelength converting film is disclosed, a method for preparing a light-emitting device and a light-emitting device.

An illumination device includes a light source that emits primary light and a wavelength conversion element that converts at least a portion of the primary light from the light source. The wavelength conversion element includes a phosphor layer having phosphors that absorb at least a portion of the primary light from the light source to emit secondary light, which is polarized, and polymers having birefringence. The phosphors have an anisotropic structure and are aligned generally along a first direction, and the polymers have polymer molecules that are aligned generally along the first direction. An angle formed by a direction of a transition dipole moment of each of the phosphors to a delayed phase axis of each of the polymer molecules with respect to the secondary light emitted from the phosphors towards the polymer molecules is 0 to 45.

The present invention relates to a light-emitting diode (LED) structure, which comprises an LED unit. The LED unit is doped with a plurality of fluorescent powders in at least an arbitrary layer on one side of a light-emitting layer. Alternatively, the LED unit includes a plurality of fluorescent powder particles arranged on at least a light-emitting surface of the LED unit. No gel is adopted for disposing or packaging fluorescent powders. Thereby, gel yellowing caused by long-term high-temperature heating of the LED structure will not occur. The yellowing phenomenon will affect the light-emitting efficiency of LED and induce color deviation.

A multi-layer glass phosphor powder sheet and its preparation method, and a light-emitting device. The preparation method for the multi-layer glass phosphor powder sheet includes: mixing a first optical functional material, a glass powder and an organic carrier to obtain a first slurry, and mixing a second optical functional material, the glass powder and the organic carriers to obtain a second slurry; coating the first slurry on a first substrate, and drying it at a first temperature so that at least some of the organic carrier is volatilized, to obtain a first functional layer, the first temperature being lower than a softening point of the glass powder; coating the second slurry on the surface of the first functional layer, to obtain a second functional layer; and sintering the first substrate on which the functional layers are coated at a second temperature, to obtain the multi-layer glass phosphor powder sheet.

An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.

An LED filament and an LED light bulb applying the same are disclosed. The LED filament includes LED chips, conductive electrodes disposed corresponding to the LED chips, and a light conversion coating. The LED chips are electrically connected together and the conductive electrodes are electrically connected with the LED chips. The light conversion coating includes an adhesive and a plurality of phosphors. The light conversion coating coats on at least two sides of the LED chips and the conductive electrodes. The light conversion coating exposes a portion of two of the conductive electrodes. Accordingly, the LED filament is capable of emitting light similar to that a point light source does and the LED light bulb may emit omnidirectional light.

A phosphor sheet-forming resin composition uses a low-cost resin material having high light fastness and low visible light absorption and is capable of providing a phosphor sheet at low cost with deterioration of a phosphor due to moisture being suppressed. The phosphor sheet-forming resin composition contains a film-forming resin composition and a powdery phosphor that emits fluorescence when irradiated with excitation light. The film-forming resin composition contains a hydrogenated styrene-based copolymer, and uses a sulfide-based phosphor as the phosphor. Examples of the hydrogenated styrene-based copolymer include hydrogenated products of styrene-ethylene-butylene-styrene block copolymers. CaS:Eu is used as a preferred sulfide-based phosphor.

A composite material for fluorescent quantum dot micro-nano packaging. The composite material comprises fluorescent quantum dots, a mesoporous particle material having a nanometer lattice structure, and a barrier layer, wherein the fluorescent quantum dots are distributed in the mesoporous particle material, and the barrier layer is coated on the outer surface of the mesoporous particle material. In the composite material according to the invention, the quantum dot aggregation can be effectively retarded, with the barrier layer coated on the surface the water-oxygen micromolecule erosion is prevented, the compatibility and stability of the composite fluorescent particles is improved, and the service life of the composite material for fluorescent quantum dot micro-nano packaging is thus greatly improved.

In one embodiment, the transparent growth substrate of an LED die is formed to have light scattering areas, such as voids formed by a laser. In another embodiment, the growth substrate is removed and replaced by another substrate that is formed with light scattering areas. In one embodiment, the light scattering areas are formed over the light absorbing areas of the LED die, to reduce the amount of incident light on those absorbing areas, and over the sides of the substrate to reduce light guiding. The replacement substrate may be formed to include reflective particles in selected areas. A 3D structure may be formed by stacking substrate layers containing the reflective areas. The substrate may be a transparent substrate or a phosphor tile that is affixed to the top of the LED.