The present invention relates to an LED package including rare-earth metal oxide particles and, more particularly, to an LED package including an LED chip selected from among a blue LED chip, a green LED chip and a red LED chip, and an LED encapsulant having a compound represented by Chemical Formula 1 below in a polymer resin.

M.sub.a(OH).sub.b(CO.sub.3).sub.cO.sub.d [Chemical Formula 1]

In Chemical Formula 1, M is Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn, Mn, Bi or Ac, a is 1 or 2, b is 0 to 2, c is 0 to 3, and d is 0 to 3, wherein b, c, and d are not simultaneously zero, and b and c are either simultaneously zero or simultaneously not zero.

An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

According to one embodiment of the present invention, the light emitting device includes an LED element, a side wall which surrounds the LED element, a phosphor layer which is fixed to the side wall with an adhesive layer therebetween, and is positioned above the LED element, and a metal pad as a heat dissipating member. The side wall includes an insulating base which surrounds the LED element and a metal layer which is formed on a side surface at the LED element side of the base, and is in contact with the metal pad and the adhesive layer. The adhesive layer includes a resin layer that includes a resin containing particles which have higher thermal conductivity than the resin or a layer that includes solder.

A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50 C.; and curing the molding compound.

A semiconductor light emitting device comprises a supporting substrate that has light reflecting characteristics; a wavelength conversion layer that is disposed on the supporting substrate, and contains semiconductor nanoparticles developing a quantum size effect; an optical semiconductor laminate that is disposed on the wavelength conversion layer and has light emitting characteristics; and a photonic crystal layer that is disposed on the optical semiconductor laminate, and that has first portions having a first refractive index and second portions having a second refractive index different from the first refractive index, the first portions and the second portions being arranged in a two-dimensional cyclic pattern.

A method for fabricating an LED light bar and an LED light bar are provided. The method includes: providing a transparent base, wherein at least one framework region for fixing LED chips is arranged on the transparent base, at least one milling groove parallel to the framework region is arranged at each of two sides of each framework region; arranging one or more LED chips on the at least one framework region; covering an upper surface and a lower surface of the transparent base where the LED chips are arranged with a packaging adhesive mixed with fluorescent powder, and filling up the milling groove with the packaging adhesive; and cutting the transparent base along the milling groove, to obtain an LED light bar surrounded by the adhesive.

A method of manufacturing a light-emitting device includes providing a resin sheet that includes a lattice-patterned reflective material-containing portion and film-shaped phosphor-containing portions covering lattice openings of the reflective material-containing portion, placing the resin sheet on a substrate mounting a plurality of light-emitting elements such that each of the plurality of light-emitting elements is surrounded by the reflective material-containing portion and is covered on the top with the phosphor-containing portion, after placing the resin sheet on the substrate, softening the resin sheet by heating such that the phosphor-containing portions are adhered to the respective upper surfaces of the plurality of light-emitting elements and the reflective material-containing portion or the phosphor-containing portions is/are adhered to the side surfaces of the plurality of light-emitting elements, and curing the resin sheet and then cutting the substrate and the resin sheet to singulate individual light-emitting devices.

Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

A light emitting device includes a light emitting structure including a plurality of compound semiconductor layers. A current spreading layer is provided under the light emitting structure, and a plurality of wavelength conversion structures is provided in the current spreading layer. An electrode layer is provided under the current spreading layer, and an electrode is provided on the light emitting structure.

Proposed is a phosphor capable of effectively inhibiting the occurrence of adverse influence of a sulfur-based gas while improving water resistance of the phosphor and effectively inhibiting the corrosion of a metallic member. A phosphor is proposed, which includes particles or a layer provided on the surface of a sulfur-containing phosphor, which contains sulfur in a host material, and containing a crystalline metal borate containing an IIA-Group element, boron, and oxygen.