Thermoelectric energy harvesting systems in accordance with embodiments of the invention enable energy harvesting. One embodiment includes a thermoelectric energy harvesting (TEH) system comprising a TEH comprising a thin-film array-based TEH source; start-up mode circuitry comprising: an upper branch comprising: a mode switch configured to allow selection of the upper branch; an inductive-load ring oscillator (ILRO); a charge pump configured to receive an input from the ILRO and output current, where output current is utilized to charge an upper branch capacitor; a lower branch comprising: an inductor; an active diode configured to transfer energy stored in the inductor to an output capacitor; maximum-power-point tracking (MPPT) mode circuitry, where the MPPT loop comprises: a mode control unit; a gate controller; a clock generator configured to generate at least one control signal; an analog-domain MPPT unit configured to receive the at least one generated control signal.

A thermoelectric conversion module, includes: a thermoelectric conversion device; a first container; a fin that is thermally connected to one side of the thermoelectric conversion device, has a higher thermal conductivity than the first container, and extends in a direction away from the thermoelectric conversion device in the first container; a first heat dissipation member that is thermally connected to the one side of the thermoelectric conversion device, has a higher thermal conductivity than the fin, and extends up to a side far from the thermoelectric conversion device of the fin in the first container; and a first heat storage material that is disposed in the first container and thermally connected to the fin and the first heat dissipation member.

A thermoelectric conversion module has a plurality of cold side substrates, a plurality of first electrodes, a plurality of thermoelectric conversion elements, a plurality of second electrodes, X-axis connectors, and Y-axis connectors. The second electrodes are disposed on the cold side substrates six at a time. Between adjacent cold side substrates, two of X-axis connectors as inter-substrate connectors or Y-axis connectors are disposed. One of the plurality of inter-substrate connectors is connected from one of the first electrodes positioned on one of the cold side substrates to one of the second electrodes positioned on another one of the cold side substrates. The other inter-substrate connector is connected from the other one of the first electrodes on the another one of the cold side substrates to the second electrode on the one cold side substrate.

A thermoelectric conversion device including an n-type thermoelectric converter, a p-type thermoelectric converter, a high temperature-side electrode with which one end of the n-type thermoelectric converter and one end of the p-type thermoelectric converter are put into contact, a first low temperature-side electrode in contact with another end of the n-type thermoelectric converter, and a second low temperature-side electrode in contact with another end of the p-type thermoelectric converter, wherein in the n-type thermoelectric converter, the side in contact with the high temperature-side electrode is composed of a carrier generation semiconductor containing Mg.sub.2Sn, and in the n-type thermoelectric converter, the side in contact with the first low temperature-side electrode is composed of a carrier transfer semiconductor containing Mg.sub.2Si.sub.1-xSn.sub.x, wherein 0.6≦x≦0.7, and a first n-type dopant.

A system, a thermoelectric generator, and a method for generating electricity are provided. The system includes a thermoelectric generator, a cooling system, and a heating system. The cooling system includes a cold side module configured to hold a predetermined volume of air, a subterranean heat exchanger including an underground conduit, the underground conduit having a first end configured to receive ambient air and a second end coupled to the inlet of the cold side module, and an air exhaust coupled to the outlet of the cold side module and having one or more valves configured to control an airflow from the subterranean heat exchanger towards the air exhaust. The heating system includes a first solar concentrator to collect light rays, a hot side module, and a fiber optic cable to transport the collected light rays to the hot side module.

Described is an integrated vertical structure for infrared sensors, Peltier cooling, and thermoelectric generator applications consisting of a thermally insulating layer which is kept at a distance to a substrate by at least two spacers. In addition, the spacers have conductor structures which serve as thermoelectric elements.

A method realizes manufacturing the integrated thermoelectric structure, a method realizes the operation of the integrated thermoelectric structure as a detector, a further method realizes the operation of the integrated thermoelectric structure as a thermoelectric generator, and a method realizes the operation of the integrated thermoelectric structure as a thermoelectric Peltier element.

Flexible thermoelectric generators and methods of manufacturing are disclosed. In one embodiment, a flexible thermoelectric generator includes a plurality of pillars, a first and a second plurality of flexible interconnects, and a flexible material. The plurality of pillars having a first side and a second side. The first plurality of flexible interconnects electrically connecting pairs of the plurality of pillars on the first side. The second plurality of flexible interconnects electrically connecting the pairs of plurality of pillars on the second side. The first and the second plurality of flexible interconnects alternate among the pairs of plurality of pillars to form an electrical circuit having a first end and a second end. The flexible material covering the first and second plurality of flexible interconnects and having an external surface. The flexible material is configured to conduct thermal energy from the external surface to the plurality of pillars.

A system, apparatus, and method that increases the throughput and output fidelity of a three-dimensional printer by providing a temperature controlled build platform that binds to viscous materials which the three-dimensional printer deposits on the build platform during the fabrication process and subsequently releases the finished product when the build platform is sufficiently cooled. The system provides computer controlled electronic means to modify the temperature gradient of the build platform variably during the build process to assure the quality and fidelity of a printed part produced by the three dimensional printer. The temperature control apparatus includes a set of thermoelectric cells that heat and cool portions of the build plate under software control. The temperature control apparatus also provides conductive materials including a plurality of heat pipes and a plurality of radiative devices that efficiently conduct heat to and from the build plate.

A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.

A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.