A thermoelectric transducer includes a substrate, a thermoelectric film on the substrate, a first electrode on the substrate, and a second electrode on the substrate, the second electrode being different from the first electrode in work function. The first electrode and the second electrode are in contact with the same side of the thermoelectric film. The outer edge of the thermoelectric film is located inner than the outer edge of the substrate.

A thermoelectric power generation system includes a solar panel array on a first side of a tower to absorb solar radiation and generate electrical energy and waste heat and a panel on a second side, opposite the first side, of the tower. A plurality of thermoelectric elements of the tower are interposed between the solar panel array and the panel. The plurality of thermoelectric elements converts conductive heat flow of the waste heat from the solar panel directed toward the panel to electrical energy. A conductive base supports the tower and to conduct heat away from the panel.

A thermoelectric power generation module mounting substrate includes: a printed substrate having a heat transfer through-hole penetrating a first surface and a second surface opposite to the first surface, and being in contact with a housing on the second surface; and a thermoelectric power generation module mounted on the printed substrate in contact with the first surface.

A method includes forming a plurality of first semiconductor mesa structures at a first semiconductor substrate. The first semiconductor substrate has a first conductivity type. The method further includes forming a plurality of second semiconductor mesa structures at a second semiconductor substrate. The second semiconductor substrate has a second conductivity type. The method further includes providing a glass substrate between the first semiconductor substrate and the second semiconductor substrate. The method includes connecting the first semiconductor substrate to the second semiconductor substrate so that at least a portion of the glass substrate is located laterally between the first semiconductor mesa structures of the plurality of first semiconductor mesa structures and the second semiconductor mesa structures of the plurality of second semiconductor mesa structures.

To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.

A thermoelectric generation module has a cooling surface formed on one of a front side and a rear side and a heating surface formed on the other thereof. The thermoelectric generation module includes: a plurality of thermoelectric elements; a pair of flexible boards holding the thermoelectric elements therebetween and respectively defining the cooling surface and the heating surface; a plurality of interelement electrodes respectively provided on opposed surfaces of the flexible boards and configured to electrically connect the thermoelectric elements to each other; a lead wire configured to be electrically connected to an interelement electrode to which a terminal element located at an end of an electrical arrangement is connected; and a reinforcing pattern interposed between the flexible boards and being closer to the drawn-out lead wire with respect to the terminal element.

An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.

The present disclosure is directed to an engine component for a gas turbine engine, the engine component including a substrate that includes a composite fiber and defines a surface. An energy harvesting fiber is positioned within the substrate.

The present invention relates to a method for manufacturing a thermoelectric module which utilises the concept of solid-liquid interdiffusion bonding for both forming the metallization, interconnection and bonding between the thermoelectric elements and the electric contacts and the forming of a hermetically sealing of the thermoelectric module.

A thermoelectric generator unit includes: a case having a heating surface and a cooling surface; first to fourth thermoelectric generator modules housed in the case, the thermoelectric generator modules including a plurality of thermoelectric elements; a multilayer substrate including: a first layer including an interelement electrode for forming an output circuit configured to connect the thermoelectric elements; a second layer provided with a plurality of through holes penetrating therethrough from front to back; and a third layer including a plurality of bypass patterns electrically continuous with the through holes; and lead pins that penetrate through the case inward and outward, the lead pins having base ends connected to both ends of the output circuit on a surface of the first layer, the output circuit being defined in each of the thermoelectric generator modules.