H10F77/122

PHOTOELECTRONIC DEVICE USING HYBRID STRUCTURE OF SILICA NANO PARTICLES - GRAPHENE QUANTUM DOTS AND METHOD OF MANUFACTURING THE SAME

Disclosed are a photoelectronic device using a hybrid structure of silica nanoparticles and graphene quantum dots and a method of manufacturing the same. The photoelectronic device according to the present disclosure has a hybrid structure including graphene quantum dots (GODs) bonded to surfaces of silica nanoparticles (SNPs), thereby increasing energy transfer efficiency.

Optoelectronic device comprising nanostructures of hexagonal type crystals

An optoelectronic device comprising: a first conductive layer, a second conductive layer, an active layer between the first conductive layer and the second conductive layer, wherein the active layer comprises a submicrometer size structure of hexagonal type crystals of an element or alloy of elements selected from the carbon group.

System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects
09622650 · 2017-04-18 · ·

Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.

Foil-based metallization of solar cells

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

Method for etching multi-layer epitaxial material

A single-step wet etch process is provided to isolate multijunction solar cells on semiconductor substrates, wherein the wet etch chemistry removes semiconductor materials nonselectively without a major difference in etch rate between different heteroepitaxial layers. The solar cells thus formed comprise multiple heterogeneous semiconductor layers epitaxially grown on the semiconductor substrate.

Method of manufacturing a monolayer graphene photodetector and monolayer graphene photodetector

In various embodiments of the present disclosure, there is provided a method of manufacturing a monolayer graphene photodetector, the method including forming a graphene quantum dot array in a graphene monolayer, and forming an electron trapping center in the graphene quantum dot array. Accordingly, a monolayer graphene photodetector is also provided.

Photodiode structures

Photodiode structures and methods of manufacture are disclosed. The method includes forming a waveguide structure in a dielectric layer. The method further includes forming a Ge material in proximity to the waveguide structure in a back end of the line (BEOL) metal layer. The method further includes crystallizing the Ge material into a crystalline Ge structure by a low temperature annealing process with a metal layer in contact with the Ge material.

ION IMPLANTATION AND ANNEALING FOR THIN-FILM CRYSTALLINE SOLAR CELLS
20170104122 · 2017-04-13 ·

A back contact back junction thin-film solar cell is formed on a thin-film semiconductor solar cell. Preferably the thin film semiconductor material comprises crystalline silicon. Base regions, emitter regions, and front surface field regions are formed through ion implantation and annealing processes.

GERMANIUM METAL-CONTACT-FREE NEAR-IR PHOTODETECTOR

A Ge-on-Si photodetector constructed without doping or contacting Germanium by metal is described. Despite the simplified fabrication process, the device has responsivity of 1.24 A/W, corresponding to 99.2% quantum efficiency. Dark current is 40 nA at 4 V reverse bias. 3-dB bandwidth is 30 GHz.

SEMICONDUCTOR LIGHT RECEIVING DEVICE

A semiconductor light receiving device includes a substrate, a semiconductor fine line waveguide provided on the substrate, and a light receiving circuit that is provided on the substrate and that absorbs light propagating through the semiconductor fine line waveguide. The light receiving circuit includes a p type first semiconductor layer, a number of second semiconductor mesa structures provided on the p type first semiconductor layer in such a manner that an n type second semiconductor layer is provided on top of an i type second semiconductor layer, a p side electrode connected to the p type first semiconductor layer in a location between the second semiconductor mesa structures, and an n side electrode connected to the n type second semiconductor layer. The refractive index and the optical absorption coefficient of the second semiconductor layers are greater than the refractive index and the optical absorption coefficient of the first semiconductor layer.