In one embodiment, an integrated circuit includes an array of active structures, an array of dummy structures and multiple well-tap structures. The array of dummy structures surrounds the array of active structures. The well-tap structures may be interposed between the array of active structures and the array of dummy structures. In one embodiment, each of the well-tap structures may include a well, a diffusion region and a gate-like structure. The well may be formed in a substrate and is of a first doping type. The diffusion region may be formed in the well and is also of the first doping type. The gate-like structure may be formed above the substrate and adjacent to the diffusion region.

A semiconductor device includes a substrate having a first conductivity type, a high-voltage well having a second conductivity type and disposed in the substrate, a high-voltage doped region having the first conductivity type and disposed in the high-voltage well, a drain region disposed in the high-voltage well and spaced apart from the high-voltage doped region, a source region disposed in the high-voltage doped region, a first gate structure disposed above a first side portion of the high-voltage doped region between the source region and the drain region, and a second gate structure disposed above a second and opposite side portion of the high-voltage doped region.

An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.

There is formed a first concave portion that extends inside a semiconductor substrate from a main surface thereof. An insulating film is formed over the main surface, over a side wall and a bottom wall of the first concave portion so as to cover an element and to form a capped hollow in the first concave portion. A first hole portion is formed in the insulating film so as to reach the hollow in the first concave portion from an upper surface of the insulating film, and to reach the semiconductor substrate on the bottom wall of the first concave portion while leaving the insulating film over the side wall of the first concave portion. There is formed a second hole portion that reaches the conductive portion from the upper surface of the insulating film. The first and second hole portions are formed by the same etching treatment.

Embodiments of the invention include a method for fabricating a nano-ribbon transistor device and the resulting structure. A nano-ribbon transistor device including a substrate, a nano-ribbon channel, a core region in the center of the nano-ribbon channel, a gate formed around the nano-ribbon channel, a spacer formed on each sidewall of the gate, and a source and drain region epitaxially formed adjacent to each spacer is provided. The core region in the center of the nano-ribbon channel is selectively etched. A dielectric material is deposited on the exposed portions of the nano-ribbon channel. A back-bias control region is formed on the dielectric material within the core of the nano-ribbon channel and on the substrate adjacent to the nano-ribbon transistor device. A metal contact is formed in the back-bias control region.

An n-channel DEMOS device a pwell finger defining a length and a width direction formed within a doped surface layer. A first nwell is on one side of the pwell finger including a source and a second nwell on an opposite side of the pwell finger includes a drain. A gate stack is over a channel region the pwell finger between the source and drain. A field dielectric layer is on the surface layer defining a first active area including a first active area boundary along the width direction (WD boundary) that has the channel region therein. A first p-type layer is outside the first active area at least a first minimum distance from the WD boundary and a second p-type layer is doped less and is closer to the WD boundary than the first minimum distance.

A semiconductor device comprises a field effect transistor in a semiconductor substrate having a first main surface. The field effect transistor comprises a source region, a drain region, a body region, and a gate electrode at the body region. The gate electrode is configured to control a conductivity of a channel formed in the body region, and the gate electrode is disposed in gate trenches. The body region is disposed along a first direction between the source region and the drain region, the first direction being parallel to the first main surface. The body region has a shape of a ridge extending along the first direction, the body region being adjacent to the source region and the drain region. The semiconductor device further comprises a source contact and a body contact, the source contact being electrically connected to a source terminal, the body contact being electrically connected to the source contact and to the body region.

A semiconductor device is provided. The device may include a semiconductor layer; and a doped well disposed in the semiconductor layer and having a first conductivity type. The device may also include a drain region, a source region, and a body region, where the source and body regions may operate in different voltages. Further, the device may include a first doped region having a second conductivity type, the first doped region disposed between the source region and the doped well; and a second doped region having the first conductivity type and disposed under the source region. The device may include a third doped region having the second conductivity type and disposed in the doped well; and a fourth doped region disposed above the third doped region, the fourth doped region having the first conductivity type. Additionally, the device may include a gate and a field plate.

A semiconductor substrate has a main surface with an n type offset region having a trench portion formed of a plurality of trenches extending in a direction from an n.sup.+ drain region toward an n.sup.+ source region. The plurality of trenches each have a conducting layer therein extending in the main surface in the direction from the n.sup.+ drain region toward the n.sup.+ source region.

An integrated circuit (IC) includes a first semiconductor device on a glass substrate. The first semiconductor device includes a first semiconductive region of a bulk silicon wafer. The IC includes a second semiconductor device on the glass substrate. The second semiconductor device includes a second semiconductive region of the bulk silicon wafer. The IC includes a through substrate trench between the first semiconductive region and the second semiconductive region. The through substrate trench includes a portion disposed beyond a surface of the bulk silicon wafer.