H10D86/411

Display device

According to one embodiment, a display device includes a first line which is arranged across a display portion, and includes a first end portion and a second end portion located at a non-display portion such that the display portion is located between the first and second end portions, a first switch electrically connected to the first end portion, a second switch electrically connected to the second end portion, a first terminal electrically connected to the first end portion via the first switch, and a second terminal electrically connected to the second end portion via the second switch.

Stretchable pixel array substrate
12230645 · 2025-02-18 · ·

A stretchable pixel array substrate, including a base and a component layer, is provided. The base has multiple first openings and multiple second openings. Each of the first openings has a first opening extending direction. Each of the second openings has a second opening extending direction. The first opening extending direction and the second opening extending direction are different. The first openings and the second openings are alternately arranged in a first direction and a second direction to define multiple islands and multiple bridges of the base. The component layer is disposed on the base and includes multiple island portions and multiple bridge portions. The island potions have multiple pixel structures and are respectively disposed on the islands of the base. The bridge portions have conductive wires and are respectively disposed on the bridges of the base. The conductive wires are electrically connected to the pixel structures.

DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME

A display device includes a display layer comprising pixels, each of the pixels having at least one thin-film transistor, a connection line electrically connected to the at least one thin-film transistor, the connection line being exposed on a lower surface of the display layer through a first contact hole formed in the display layer, a barrier layer disposed on the lower surface of the display layer and including a second contact hole connected to the first contact hole, a lead line disposed on a lower surface of the barrier layer and electrically connected to the connection line through the second contact hole, a pad part disposed on the lower surface of the barrier layer and electrically connected to the lead line, and a lower film overlapping the lower surface of the barrier layer and the lead line.

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
20250056883 · 2025-02-13 ·

Each of terminal electrodes including first and second terminal electrodes of a first thin-film transistor, and third and fourth terminal electrodes of a second thin-film transistor is provided with a lower metal layer, a middle metal layer, and an upper metal layer stacked sequentially. The middle metal layer has a lower electrical resistance and a lower melting point than the lower metal layer and the upper metal layer. At an end of each of the terminal electrodes, the end face of the lower metal layer and the end face of the middle metal layer are flush with each other, and the upper metal layer is provided so as to cover the end faces flush with each other.

Display apparatus and method of manufacturing the same

A display apparatus is disclosed that includes contact holes formed to expose at least a portion of a conductive layer or a semiconductor layer without damage to the surface of the conductive layer or the semiconductor layer, and a method of manufacturing the display apparatus. The display apparatus includes a substrate, a conductive mound arranged on the substrate, a first insulating mound arranged on the substrate, and a semiconductor layer including a first region arranged on the conductive mound, and a second region arranged on the first insulating mound. The second region of the semiconductor layer substantially covers an upper surface of the first insulating mound.

Display substrate and method for manufacturing the same, and display device

A display substrate includes a first display region and a second display region. The display substrate may include: a first base substrate; a second base substrate; a first barrier layer and a light emitting unit. The first base substrate includes a first through region penetrating the first base substrate, and the first barrier layer includes a second through region penetrating the first barrier layer. The second base substrate includes a first substrate sub-portion located in the first display region, the first substrate sub-portion penetrates the second through region, and at least a portion of the first substrate sub-portion is located in the first through region. The display substrate includes a recessed portion. The second base substrate includes a first surface located in the first display region and a second surface located in the second display region, and the first surface and the second surface are formed as a flat surface.

Transparent display substrates, transparent display panels and display devices

A transparent display substrate, a transparent display panel and a display device. The display substrate includes at least one pixel unit. The at least one pixel unit includes at least three sub-pixel groups emitting light of different colors. The sub-pixel groups includes at least two sub-pixels, and the sub-pixels include a first electrode, a light-emitting structure block located on the first electrode, and a second electrode located on the light-emitting structure block. In the at least one pixel unit, two first electrodes of two adjacent sub-pixels in a sub-pixel group are electrically connected by a first connecting portion, two first electrodes of two sub-pixels in another of the sub-pixel groups are electrically connected by a second connecting portion. The second connecting portion at least partially surrounds sides of the sub-pixels in other sub-pixel groups. The first connecting portion and the second connecting portion are located in a same layer.

Direct bandgap substrates and methods of making and using

An indirect bandgap thin film semiconductor circuit can be combined with a compound semiconductor LED such as to provide an active matrix LED array that can have high luminous capabilities such as for a light projector application. In another example, a highly efficient optical detector is achievable through the combination of indirect and direct bandgap semiconductors. Applications can include display technologies, light detection, MEMS, chemical sensors, or piezoelectric systems. An LED array can provide structured illumination, such as for a light and pattern source for projection displays, such as without requiring spatial light modulation (SLM). An example can combine light from separate monolithic light projector chips, such as providing different component colors. An example can provide full color from a single monolithic light projector chip, such as including selectively deposited phosphors, such as to contribute individual component colors to an overall color of a pixel.

Flexible display panel

Embodiments of the present invention disclose a flexible display panel. The flexible display panel at least comprises an display area, a fanout area and a driver circuit area, wherein the fanout area is positioned between the display area and the driver circuit area to connect the display area with the driver circuit area, and the fanout area comprises at least one zig-zag fanout wire, each of which comprises a plurality of fanout wire segments divided by bending points. In the technical solutions of the present invention, by utilizing a zig-zag wiring manner, damage to metal wires when bending is reduced, bending resistance of the fanout area is improved and damage to the screen when bending the flexible display panel is avoided or reduced.

Semiconductor on insulator substrate with back bias

A semiconductor on insulator substrate includes an electrically conductive layer disposed between an electrically insulating handle layer and the semiconductor layer to facilitate the application of a back bias. The connection of the electrically conductive layer to a reference voltage reduces the effects of trapped or fixed charges associated with the handle layer on the threshold voltage of a transistor formed on the semiconductor layer. Silicon-based devices formed on glass, plastic, and quartz substrates are among the devices that can benefit from the application of a back bias.