An image sensor comprises a pixel array of pixel cells. A pixel cell comprises a photodiode, a reset transistor, a transfer transistor, at least one source follower transistor, a sample and hold circuit, an active reset transistor, and a readout transistor. A readout circuitry reads out image data from each columns of pixel cells. A column differential amplifier in the readout circuitry feeds back a column reset drive voltage to each pixel cells arranged in the same column. Signal data of each pixel cells in the same column are read out globally when all the active reset transistors are switched off. Determined by switching configurations of each active reset transistors of pixel cells in the same column, noise data of each pixel cells in the same column are read out either globally or row-by-row. Final image data is achieved by applying the method of correlated double sampling (CDS).

In an image sensor including a pixel array having a plurality of pixels, each of the plurality of pixels includes: a first photodiode; a second photodiode having a larger light-receiving area than the first photodiode; a first floating diffusion node where charge generated in the first photodiode is accumulated; a second floating diffusion node where charge generated in the second photodiode is accumulated; a first capacitor accumulating charge overflowing from the first photodiode; a first driving transistor configured to generate an output signal corresponding to a voltage of the second floating diffusion node; and a second capacitor storing an amount of overflow charges according to an overflow operation for accumulating the overflowing charge and storing an amount of reset charges according to a reset operation for resetting the first floating diffusion node.

In dynamic vision sensor (DVS) or change detection sensors, the chip or sensor is configured to control or modulate the event rate. For example, this control can be used to keep the event rate close to a desired rate or within desired bounds. Adapting the configuration of the sensor to the scene by changing the ON-event and/or the OFF-event thresholds, allows having necessary amount of data, but not much more than necessary, such that the overall system gets as much information about its state as possible.

An IC structure includes a substrate region having a first doping type and including an upper surface, first and second regions within the substrate region, each of the first and second regions having a second doping type opposite the first doping type, and a gate conductor including a plurality of conductive protrusions extending into the substrate region in a direction perpendicular to a plane of the upper surface. The conductive protrusions are electrically connected to each other, and at least a portion of each conductive protrusion is positioned between the first and second regions.

A solid-state image sensor is provided. The solid-state image sensor includes a plurality of photoelectric conversion elements. The solid-state image sensor also includes a color filter layer disposed above the photoelectric conversion elements. The color filter layer has a plurality of color filter segments. The solid-state image sensor further includes a partition grid disposed between the color filter segments. Moreover, the solid-state image sensor includes a patterned structure disposed on the color filter layer. The patterned structure has a plurality of patterned segments. The solid-state image sensor also includes a transparent layer disposed on the color filter layer and the partition grid. The transparent layer surrounds the patterned segments. At least one patterned segment is disposed on the partition grid.

An image sensor device includes a digital pixel that includes a photo detector, a comparator, and a memory circuit, a pixel driver that controls the digital pixel, and a digital logic circuit that performs a digital signal processing operation on a digital signal output from the digital pixel. The photo detector and a first portion of the comparator are formed in a first semiconductor die, a second portion of the comparator, the memory circuit, and the pixel driver are formed in a second semiconductor die under the first semiconductor die, and the digital logic circuit is formed in a third semiconductor die under the second semiconductor die.

Digital camera systems and methods are described that provide a color digital camera with direct luminance detection. The luminance signals are obtained directly from a broadband image sensor channel without interpolation of RGB data. The chrominance signals are obtained from one or more additional image sensor channels comprising red and/or blue color band detection capability. The red and blue signals are directly combined with the luminance image sensor channel signals. The digital camera generates and outputs an image in YCrCb color space by directly combining outputs of the broadband, red and blue sensors.

A solid-state imaging device includes a plurality of pixels each of which includes a photoelectric conversion unit that generates charges by photoelectrically converting light, and a transistor that reads a pixel signal of a level corresponding to the charges generated in the photoelectric conversion unit. A phase difference pixel which is at least a part of the plurality of pixels is configured in such a manner that the photoelectric conversion unit is divided into a plurality of photoelectric conversion units and an insulated light shielding film is embedded in a region for separating the plurality of photoelectric conversion units, which are divided, from each other.

The cost and power consumption of an imaging apparatus are reduced by facilitating detection of an incident angle of a light beam transmitted through a grating substrate. An image sensor converts an optical image captured by pixels arranged on an imaging surface and outputs the converted image signal. A modulator is configured to modulate intensity of light; and an image processing circuit performs image processing of the output image signal. The modulator has a grating substrate, a grating pattern formed on a back surface side of the grating substrate arranged in proximity to the light receiving surface of the image sensor; and a grating pattern formed on a front surface facing the back surface. Each of the grating patterns is constituted of a plurality of concentric circles. The modulator performs intensity modulation on the light transmitted through the grating pattern and outputs the modulated light to the image sensor.

An imaging device includes an imaging unit that generates image data on the basis of a first power voltage, an image processing unit that performs image processing on the image data on the basis of a second power voltage, a reference voltage generating unit that generates a first reference voltage on the basis of the first power voltage, and a first flag generating unit that generates a first flag signal for the second power voltage on the basis of a comparison of the second power voltage and the first reference voltage and outputs the first flag signal.