An image sensor having photosites forming an array (K×L) of K rows and L columns, including a first set of integrator circuits, with a first regulation by analog weighting in blocks of n×n′ photosites, said photosites belonging to n adjacent columns and to n′ adjacent rows, and a second set of integrator circuits, with a second regulation by analog weighting in blocks of m×m′ photosites, said photosites belonging to m adjacent columns and to m′ adjacent rows, n adjacent columns of a first set of columns of the array being connected to n×n′ integrator circuits of the first set, m adjacent columns of a second set of columns of the array being connected to m×m′ integrator circuits of the second set, n columns of the first set alternating with m columns of the second set to form the array of photosites.

A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell includes two pixels. Upper and lower photoelectric converters and, transfer transistors and connected to the upper and lower photoelectric converters, respectively, a reset transistor, and an amplifying transistor form the two pixels. A full-face signal line is connected to the respective drains of the reset transistor and the amplifying transistor. Controlling the full-face signal line, along with transfer signal lines and a reset signal line, to read out signals realizes the simplification of the wiring in the pixel, the reduction of the pixel size, and so on.

An imaging sensor comprising: an imaging chip in which a plurality of pixel are arranged in a matrix; and a signal processing chip that is each provided for one or more pixel columns or one or more pixel rows, has a device that performs signal processing on a pixel signal output from a pixel, and is stacked with the imaging chip is provided. For example, the device that performs signal processing is an A/D converter that converts a pixel signal output from the pixel into a digital signal, and when a pixel signal output from the pixel is converted into a digital signal, at least two or more A/D converters among the A/D converters are controlled in parallel.

An endoscope apparatus including: an image pickup device; a detection device that detects whether or not an image region at which a part of an object region is edged along a direction parallel to the scan lines in a state that is different to a case where a plurality of the scan lines are simultaneously exposed exists in a frame image due to differences of exposure timings for each of the scan lines of the image pickup device based on an image feature amount in the frame image that is obtained from the image data for each of the scan lines that is outputted from the image pickup device; and an exposure control device that changes an exposure time of each of the scan lines by the image pickup device simultaneously for all of the scan lines if the detection device detects the image region.

Disclosed here is a TV system with an integrated wireless power transmitter. The wireless power transmitter enables the TV system to provide a power source in the form of pockets of energy. A wireless power receiver may be coupled to the electrical devices to receive an electrical power source and transfer it to the electrical device. The receivers in the devices may capture energy from the pockets of energy formed by the wireless transmitter component in the TV system in order to power an electrical device.

A solid-state imaging device, in which a plurality of overlapping substrates are included and the plurality of substrates are electrically connected to each other, includes a pixel circuit, a first readout circuit configured to read out signals from the photoelectric conversion units, a signal-processing circuit configured to perform signal processing on signals read out from the photoelectric conversion units, an output circuit configured to output signals processed by the signal-processing circuit to the outside, a first wiring configured to be provided to correspond to each of the four circuits and to supply a first voltage to each of the four circuits, a second wiring configured to be provided to correspond to each of the four circuits and to supply a second voltage different from the first voltage to each of the circuits, and a capacitor that is electrically connected with the first wiring and the second wiring.

A solid-state imaging device including: a pixel array unit in which a plurality of pixels outputting an analog pixel signal are arranged in a two-dimensional matrix form; a ramp signal generation unit configured to generate and output a ramp wave; a clock generation unit configured to generate and output multiphase clocks; and a signal-processing unit, wherein the signal-processing unit including: a plurality of analog-to-digital conversion circuits, and a plurality of repeater circuits, wherein each of the plurality of analog-to-digital conversion circuits includes: a comparison unit, and a latch unit, wherein each of the plurality of the analog-to-digital conversion circuits outputs the digital value according to the state of the phase held by each latch circuit, and wherein each of the plurality of the repeater circuits corresponding to the same set are arranged side by side, and the repeater circuits are connected in series.

An imaging apparatus includes a circuit board, a solid-state image sensing device disposed on an upper surface of the circuit board, a lens disposed above and spaced from the solid-state image sensing device, and a lens barrel disposed on the upper surface of the circuit board and that houses the tens. The lens barrel has a leg section which is at least a part of the lens barrel other than a part of the lens barrel housing the lens, and the leg section is connected to the circuit board with an adhesive applied in a large application amount to have a thickness.

Methods and apparatus for implementing a camera having a depth which is less than the maximum length of the outer lens of at least one optical chain of the camera are described. In some embodiments a light redirection device, e.g., a mirror, is used to allow a relatively long optical chain with a relatively large non-circular outer lens. In some embodiments the light redirection device has a depth, e.g., front of camera to back of camera dimension, which is less than the maximum length of the aperture of the outer lens in the aperture's direction of maximum extent. Multiple optical chains with non-circular outer lenses arranged in different directions may and in some embodiments are used to capture images with the captured images being combined to generate a composite image.

A fingerprint sensing module, including a photosensitive element layer and a color filter layer, is provided. The photosensitive element layer has multiple photosensitive regions, and includes a substrate and multiple photosensitive pixels. The photosensitive pixels have multiple photosensitive patterns overlapping the photosensitive regions. The photosensitive pixels include multiple first photosensitive pixels overlapping multiple first photosensitive regions and multiple second photosensitive pixels overlapping multiple second photosensitive regions. A percentage value of a number of the second photosensitive pixels to a number of the photosensitive pixels is less than 30%. An orthographic projection area of each of the first photosensitive regions is different from an orthographic projection area of each of the second photosensitive regions. The color filter layer has multiple openings overlapping the first photosensitive pixels and multiple first color filter patterns overlapping the second photosensitive pixels.