A vehicle camera system includes a camera that includes an image sensor, a filter mask, and a control and evaluation device, to which the image sensor outputs an image signal with frames that correspond to different exposure times. The image sensor includes an arrangement of sensor pixels outputting pixel signals, and the filter mask includes an arrangement of filter pixels situated in front of respective ones of the sensor pixels, where different filter pixels have different transmission behavior. The control and evaluation device compares to each other pixel signals (a) contained in the frames of different exposure times, and (b) output by sensor pixels which record light filtered differently by the filter pixels.

Provided is an image sensing device including a photoelectric element configured to receive a reset signal at a first end and connected to a sensing node at a second end, a reset transistor configured to reset a floating diffusion at a first voltage, a capacitor disposed between the floating diffusion and the sensing node, a driving transistor configured to generate a pixel signal from a charge generated by the photoelectric element based on a second voltage, and a selection transistor configured to provide the pixel signal to an external device, wherein while the selection transistor is turned on, the reset transistor is turned off at a first time point, and the sensing node is reset by the reset signal at a second time point that is later than the first time point.

A write control unit selects, in a row or column direction, N storing units from N×N storing units for storing pixel data of N (N≧2) read lines of image pickup devices and writes the data in sets of N pixels thereto, and switches a selection direction for selecting the storing units each time writes of the data of N lines are completed. A read control unit selects, in a direction different from the selection direction, N storing units and starts parallel reads of the data of N lines during writes of the data of every N-th line. Each storing unit to be first selected in the writes of the data of every N-th line performs write and read operations using different terminals, and each of the remaining storing units performs write and read operations using a common terminal.

A solid-state imaging device includes a photoelectric conversion unit, a light shielding unit and a transfer transistor. The photoelectric conversion unit generates charges by photoelectrically converting light. The light shielding unit is formed by engraving a semiconductor substrate on which the photoelectric conversion unit is formed, so as to surround an outer periphery of the photoelectric conversion unit. The transfer transistor transfers charges generated in the photoelectric conversion unit. During a charge accumulation period in which charges are accumulated in the photoelectric conversion unit, a potential that repels the charges is supplied to the light shielding unit and a gate electrode of the transfer transistor. During a charge transfer period in which charges are transferred from the photoelectric conversion unit, a potential that repels the charges is supplied to the light shielding unit and a potential that attracts the charges is supplied to the gate electrode of the transfer transistor.

An image capturing apparatus comprises an image capturing unit that includes an image sensor that has an effective pixel region and a reference pixel region which outputs a reference signal for correcting an output signal of the effective pixel region. In a case where a predetermined condition is satisfied, a reduction unit reduces a data amount of reference pixel region data that corresponds to the reference pixel region in an image data obtained by the image capturing unit. A recording unit records the image data after the processing performed by the reduction unit.

A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.

An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges to be accumulated in the photoelectric converter. The sensor also includes a microlenses which are located so that one microlens is arranged for each pixel group. The wiring patterns are located at a side of the first face, and the plurality of microlenses are located at a side of the second face. Light-incidence faces of the regions of the photoelectric converters of each pixel group are arranged along the second face such that the light-incidence faces are apart from each other in a direction along the second face.

An imaging apparatus including a pixel, a current source, and a signal processing circuit. The pixel outputs signal charge, obtained by imaging, as a pixel signal. The current source is connected to a transmission path for the pixel signal and has a variable current. The signal processing circuit performs signal processing on a signal depending on an output signal to the transmission path and performs control so that a current of the current source is changed in accordance with the result of signal processing.

An imaging sensor includes multiple light-receiving elements, which are for multiple colors, configured to conduct photoelectric conversion and multiple power supply lines configured to supply a power supply voltage from a power supply source to the light-receiving elements. The light-receiving elements of each of the colors are aligned in one direction. Portions extending between the power supply source and the respective light-receiving elements of the multiple power supply lines are substantially identical in shape on at least a per-color basis.

In a state that a plurality of capacitances are connected between input and output nodes of an amplifier, a short circuit is established between the input and output nodes of the amplifier. In a state that at least one of the capacitances is isolated from the input and output nodes of the amplifier, the plurality of capacitances are connected to the input and output nodes of the amplifier, in a case that an output from the amplifier is larger than a threshold.