Embodiments of the subject application disclose various imaging control methods and apparatuses for a digital zoom image and various imaging devices. One of imaging control methods for a digital zoom image comprises: acquiring a digital zoom parameter; determining an actual imaging area of an image sensor according to the acquired digital zoom parameter; adjusting a pixel density distribution of the image sensor, to cause an average pixel density of the actual imaging area after adjustment to become greater than those of other areas of the image sensor; and acquiring, by using the actual imaging area with the adjusted average pixel density, an image of a scene to be photographed. The technical solutions provided in the embodiments of the subject application cause that as many as possible pixels of the image sensor gather at an actual imaging area corresponding to a digital zoom parameter to participate in image collection, thereby improving efficiency of image collection and the definition of a collected image.

An optical apparatus captures images of a wide-angle scene with a single camera having a continuous panomorph zoom distortion profile. When combined with a processing unit, the hybrid zoom system creates an output image with constant resolution while allowing continuous adjustment in the magnification and field of view of the image without interpolation like a digital zoom system or without any moving parts like an optical zoom system.

An alignment method for manufacturing a mask integration framework is disclosed. The alignment method includes establishing an absolute coordinate system by taking a center of a metal framework as an origin of coordinates, the center of the metal framework coinciding with a center of an array substrate serving as a reference, controlling the array substrate to move, such that an offset of coordinates of a pixel point under the absolute coordinate system with respect to a predetermined theoretical value is smaller than or equal to a predetermined error value, and transmitting the coordinates of the pixel point under the absolute coordinate system, after the array substrate moves, to a tension device. An alignment system for manufacturing mask integration framework is also disclosed.

An image reading apparatus includes an image reading chip configured to read an image. The image reading chip includes a first pixel unit which generates a first pixel signal, a second pixel unit which generates a second pixel signal, a first amplification unit which amplifies the first pixel signal, and outputs a first amplification signal, a second amplification unit which amplifies the second pixel signal, and outputs a second amplification signal, and a third amplification unit that amplifies each of the first amplification signal and the second amplification signal, and outputs an amplified signal. The image reading chip has a shape which includes a first side and a second side shorter than the first side. The third amplification unit is disposed between the first amplification unit and the second amplification unit in a direction along the first side.

A rewiring region is provided in a region other than a pixel region on a front face (pixel formation surface) FA of an imaging element. A mold part is formed around the imaging element other than on the front face FA. Rewiring layers that connect an external terminal and a pad provided in the rewiring region are formed via insulating layers on a side of the pixel formation surface of the imaging element and the mold part. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

An image sensing system includes a panel and an image sensing circuit. The panel includes a plurality of sensing pixels, a plurality of sensing lines and at least one first current source. Each of the plurality of sensing lines is coupled to a line of sensing pixels among the plurality of sensing pixels. Each of the at least one first current source is coupled to one of the plurality of sensing lines. The image sensing circuit, coupled to the panel, includes at least one second current source, each of which is coupled to one of the plurality of sensing lines. Wherein, a first sensing line among the plurality of sensing lines is coupled to a first current source among the at least one first current source and coupled to a second current source among the at least one second current source.

A pixel portion includes a plurality of first pixel rows and a plurality of second pixel rows each being arranged so as to be adjacent to the first pixel row. Among the first pixel row and the second pixel row arranged so as to be adjacent to each other, during at least a part of a period from an end of the electric charge accumulation period in the second pixel row until an end of an output period in which signals from pixels in the first pixel row are output, electric charges accumulated in photoelectric conversion units of pixels in the second pixel row are reset.

Power consumption of an imaging element which outputs only a region of interest (ROI) at high resolution is reduced. In a two-dimensional pixel array in which pixel rows arranged in a predetermined direction are arranged in a direction perpendicular to the predetermined direction, the imaging element performs imaging at high resolution for a first pixel row including a predetermined region and performs imaging at low resolution for a second pixel row other than this. The first image processing unit generates an image of a predetermined region on the basis of an imaging signal of the first pixel row. A pixel adding unit performs an adding process between pixels on the imaging signal of the first pixel row to make resolution the same as resolution of the imaging signal of the second pixel row. The second image processing unit generates an image of an entire region on the basis of the imaging signal of the second pixel row and the imaging signal of the first pixel row subjected to the adding process.

To acquire a color image. A solid-state image pickup device according to an embodiment includes a plurality of light receiving portions, each of which receives light of a specific wavelength to generate an electric charge corresponding to an amount of the received light, a detector that detects a photoelectric current based on an electric charge generated in at least one of the plurality of light receiving portions, a generator that generates a voltage signal based on the electric charge generated in each of the plurality of light receiving portions, and a driving circuit that causes the generator to generate voltage signals based on electric charges generated in at least two of the plurality of light receiving portions, respectively, on the basis of a detection result of the photoelectric current by the detector.

Provided is an imaging device including row drive unit having a first storage unit that stores and outputs a first signal for a readout from the pixels on an associated row, a second storage unit that stores and outputs a second signal for an operation for causing the photoelectric conversion element on an associated row to be reset to a charge accumulation state, and a third storage unit that stores and outputs a third signal for maintaining the photoelectric conversion element on an associated row in a charge accumulation state or a reset state based on the first signal output from the first storage unit and the second signal output from the second storage unit.