Provided are a polymer composite piezoelectric body in which the conversion efficiency between electricity and sound is increased and thus the sound pressure level is improved, an electroacoustic transduction film, and an electroacoustic transducer. The polymer composite piezoelectric body includes a viscoelastic matrix formed of a polymer material having a cyanoethyl group, piezoelectric body particles which are dispersed in the viscoelastic matrix and have an average particle diameter of more than or equal to 2.5 μm, and dielectric particles dispersed in the viscoelastic matrix, in which the dielectric particles are formed of a material different from that of the piezoelectric body particles and have an average particle diameter of less than or equal to 0.5 μm and a relative permittivity of more than or equal to 80.

An end-surface-reflection surface acoustic wave device, which reflects a surface acoustic wave between first and second end surfaces facing each other, includes a support substrate, an intermediate layer, a piezoelectric layer, and an IDT electrode. The first end surface is located at one end portion in a surface-acoustic-wave propagation direction and extends from a main surface of the piezoelectric layer to at least a portion of the intermediate layer. The second end surface is located at the other end portion in the surface-acoustic-wave propagation direction and extends from the main surface of the piezoelectric layer to at least a portion of the intermediate layer. The support substrate includes support substrate portions that are located outside the first and second end surfaces in the surface-acoustic-wave propagation direction.

A crystal resonator includes: lower glass plates on which first electrodes are formed so as to extend from side surfaces to a bottom surface of the lower glass plates; a crystal plate which is provided over the lower glass plates and on which second electrodes to be coupled to the first electrodes are formed on a surface in contact with the lower glass plates; and an upper glass plate which is provided over the crystal plate; wherein the side surfaces of the lower glass plates on which the first electrodes are formed are provided with a protrusion that extends in parallel with a top surface and the bottom surface of the lower glass plates and that extends from one end to the other end of each of the side surfaces, and wherein the first electrodes are formed on the side surfaces that include surfaces of the protrusion.

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

A piezoelectric element includes, on a base, an underlying layer for controlling crystallinity of a piezoelectric layer, and the piezoelectric layer. The piezoelectric layer includes a crystal with an ABO.sub.3-type structure having at least Pb at A sites. In the underlying layer, an interface-with-the-base side is configured including at least Pb and another substance with a different composition rate from that of the piezoelectric layer at the A sites, and a substance with a different composition ratio from that of the piezoelectric layer at B sites. In a layer above the interface-with-the-base side in the underlying layer, the composition rate of the other substance included at the A sites of the underlying layer progressively changes and also the composition ratio of the substance included at the B sites progressively changes, from the interface-with-the-base side toward the interface-with-the-piezoelectric-layer side to approach the composition of the piezoelectric layer.

An assembly comprising at least an electrical component mounted on a substrate. The component includes at least a first electrode and a second electrode. The substrate includes at least a first electrical conductor and a second electrical conductor. The first electrode is electrically connected to the first electrical conductor and the second electrode is electrically connected to the second electrical conductor. In a direction perpendicular to the substrate, the first electrode is located between the first electrical conductor and the second electrode. The second electrode is connected to the second electrical conductor by a connecting element extending between the second electrode and the second electrical conductor.

A structure of an integrated crystal oscillator package has a first quartz crystal resonator, a second quartz crystal resonator, and application-specific integrated circuit chip (ASIC) combined in a package. The ASIC has a switch control for receiving audio formats of 44.1 kHz and 48 kHz with different hi-fidelity (hi-fi). The first quartz crystal resonator has a first clock rate corresponding to the 44.1 kHz frequency and the second quartz crystal resonator has a second clock rate corresponding to the 48 kHz frequency to be switched by the present invention in operation.

A piezoelectric element includes a laminate including first and second piezoelectric layers with respective polarization directions in a thickness direction and an elastic layer provided between the first piezoelectric layer and the second piezoelectric layer, first and second terminal electrodes that are provided on an external surface of the laminate, a first detection electrode provided on a positive polar surface of the first piezoelectric layer, a second detection electrode provided on a negative polar surface of the first piezoelectric layer, a third detection electrode provided on a positive polar surface of the second piezoelectric layer, and a fourth detection electrode provided on a negative polar surface of the second piezoelectric layer. The first detection electrode and the fourth detection electrode are connected to the first terminal electrode. The second detection electrode and the third detection electrode are connected to the second terminal electrode.

The invention relates to an ultrasonic sensor device (1) for a motor vehicle, comprising an ultrasonic sensor (2), which has a membrane (5) for emitting and/or receiving ultrasonic waves, and comprising a stiffening unit (15) for attachment to a trim element (27) of the motor vehicle and for stiffening the trim element (27), wherein the stiffening unit (15) has a through-opening (17) for the membrane (5) of the ultrasonic sensor (2), wherein the stiffening unit (15) is formed from at least two separate stiffening elements (18 to 21) for attachment to a trim element (27).

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.