According to various embodiments, a PMUT device may include a wafer, an active layer including a piezoelectric stack, an intermediate layer having a cavity therein where the intermediate layer is disposed between the wafer and the active layer such that the cavity is adjoining the piezoelectric stack. A via may be formed through the active layer and the intermediate layer to the wafer. A metallic layer may be disposed over the active layer and over surfaces of the via. The intermediate layer may include an interposing material surrounding the cavity, and may further include a sacrificial material surrounding the via. The sacrificial material may be different from the interposing material. The metallic layer may include a first member at least substantially overlapping the piezoelectric stack, a second member extending from the first member to the cavity, and a third member extending into the active layer to contact an electrode therein.

A magneto-electric converter capable of converting a variation in magnetic field into a potential difference between two electrical terminals includes a support layer comprising two electrical terminals; a stack disposed on the support layer of a first layer made from a magnetostrictive material defining the reference plane and of a second layer made from a piezoelectric material having a polarization axis in the plane defined by the second layer, parallel to the reference plane; the second layer comprising electrodes; and a means for electrical connection of the electrodes to the electrical terminals.

This piezoelectric element includes a lower electrode formed on a substrate, a piezoelectric layer formed on the lower electrode, and an upper electrode formed on the piezoelectric layer. The upper electrode includes a first upper electrode layer made of a metal oxide including an amorphous portion at least at a boundary with the piezoelectric layer and a second upper electrode layer formed on the first upper electrode layer.

A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

A vibration sensor according to an embodiment includes a substrate, a convex member, and a piezoelectric element. The substrate includes a first principal surface and a second principal surface. The substrate transmits vibration. The convex member is fixed on the first principal surface. The piezoelectric element is disposed within a second fixing region on the second principal surface. The second fixing region corresponds to, in a planar view, a first fixing region of the substrate on which the convex member is fixed.

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

Microelectromechanical systems (MEMS) mesh-membrane nebulizers are described. The MEMS mesh-membrane nebulizers may include a piezoelectric MEMS mesh membrane. The piezoelectric MEMS mesh membrane may include a piezoelectric active layer patterned with openings for making droplets. One electrode of the piezoelectric MEMS mesh membrane may serve as an electrode for electroplating. Activation of the piezoelectric MEMS mesh membrane may generate droplets suitable for delivery of medicines or other uses.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

A film comprising a piezoelectric polymer has an upper surface and a lower surface. The film has an active region comprising the piezoelectric polymer, which extends from the upper surface of the film to the lower surface of the film. The film also comprises an adhesive sheet, which defines part of the upper or lower surface of the film. Circuit sheets may be bonded to the upper and lower surfaces in a lamination process to produce a laminated piezoelectric device.

An acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.