A piezoelectric component that has a piezoelectric element including a piezoelectric ceramic layer and a sintered metal layer on at least a first main surface of the piezoelectric ceramic layer and containing a non-precious metal, and a protective layer containing an elastic body covering first and second opposed main surfaces of the piezoelectric element. The piezoelectric ceramic layer contains 90 mol % or more of a perovskite compound that contains niobium, an alkali metal, and oxygen. A thickness of the piezoelectric element is 100 μm or less.

A sensor system that combines the sensing application of surface acoustic wave (SAW) sensor and sensor signal transfer though the enclosure wall via acoustic means. The sensor system includes SAW sensor placed inside the enclosure and at least one pair of bulk acoustic wave (BAW) transducers, one mounted inside and second outside the enclosure wall, allowing the interrogation of SAW sensor from outside the enclosure. The external BAW transducer converts interrogation electrical pulse into acoustic pulse which travels though the enclosure wall to the internal BAW transducer. The internal BAW transducer converts the interrogation electrical pulse to electrical pulse and transfers it to SAW sensor. The response of the SAW transducer containing series of electric pulses is converted to the series of acoustic pulses by internal BAW transducer which propagates though enclosure wall. The external BAW transducer converts the series of acoustic pulses into series of electrical pulses and is received by the interrogation circuit for processing.

A method of manufacturing a semiconductor device includes: forming a first substrate includes a membrane stack over a first dielectric layer, the membrane stack having a first electrode, a second electrode over the first electrode and a piezoelectric layer between the first electrode and the second electrode, a third electrode over the first dielectric layer, and a second dielectric layer over the membrane stack and the third electrode; forming a second substrate, including: a redistribution layer (RDL) over a third substrate, the RDL having a fourth electrode; and a first cavity on a surface of the RDL adjacent to the fourth electrode; forming a second cavity in one of the first substrate and the second substrate; and bonding the first substrate to the second substrate.

The present application provides a human joint energy harvesting apparatus for capturing the biomechanical energy of a joint to generate electrical energy. The generated electrical energy may provide a real-time power supply to the wearable electronics. The apparatus employs a linear slide rail mechanism and cooperates with the user's first limb and second limb to form a slider-crank mechanism, which converts the rotating motion of the joint into a linear motion of the linear slide rail mechanism. The bending beam converts the linear motion of the linear slide rail mechanism into a bending motion. A piezoelectric film may be bonded to the upper and lower surfaces of the bending beam. During walking, the bending beam is deformed, causing the piezoelectric film to be stretched or compressed to generate electrical energy. To harvest more energy, the bending beam used in the apparatus is designed to be subjected to forced motion and free vibration, and a proof mass is attached to it. The present application also provides a wearable electronic device equipped with the human joint energy harvesting apparatus.

A piezoelectric sensor and a manufacturing method therefor, and a detection apparatus, which relate to the technical field of sensing. The piezoelectric sensor includes: an array substrate: a first capping layer located on the array substrate and including a first portion and a second portion, wherein the first portion covers the array substrate, a cavity is provided between the second portion and the array substrate, and the second portion is provided with a first opening: a first electrode located above the first capping layer and above the cavity, a piezoelectric thin film located on the first electrode, and a second electrode located on the piezoelectric thin film.

A piezoelectric energy harvesting device is provided. The piezoelectric energy harvesting device includes a piezoelectric material, which includes an inner surface having a concave shape, and an outer surface having a bottom surface. The piezoelectric energy harvesting device further includes a ball positioned on the inner surface. The bottom surface acts as a ground, the inner surface acts as a positive node, and the inner surface, the outer surface, and the ball are configured so that movement of the ball causes mechanical stress to the piezoelectric material, producing an electrical current.

A force-measuring device (FMD) assembly for a portable electronic apparatus includes a mid-frame including a base portion, a sidewall portion, and a transition region between the base portion and the sidewall portion, and force-measuring devices coupled to the inner surface of the sidewall portion. The sidewall portion and the transition region are elongate along a longitudinal axis. FMDs are coupled to the inner surface at respective contact regions of the sidewall portion and are separated from each other along the longitudinal axis. Each of the FMDs includes strain-sensing element(s). Each of the FMDs corresponds to a respective sense region of the sidewall portion. The transition region includes a respective elongate slit or trough for each of the sense regions. The respective elongate slit or trough is elongate along the longitudinal axis. Adjacent elongate slits or troughs are separated by a respective rib.

An energy conversion device for conversion of various energy forms into electricity. The energy forms may be chemical, photovoltaic or thermal gradients. The energy conversion device has a first and second electrode. A substrate is present that has a porous semiconductor or dielectric layer placed thereover. The substrate itself can be planar, two-dimensional, or three-dimensional, and possess internal and external surfaces. These substrates may be rigid, flexible and/or foldable. The porous semiconductor or dielectric layer can be a nano-engineered structure. A porous conductor material is placed on at least a portion of the porous semiconductor or dielectric layer such that at least some of the porous conductor material enters the nano-engineered structure of the porous semiconductor or dielectric layer, thereby forming an intertwining region.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

The present inventors have recognized that an electrical switch for opening doors in buildings, calling elevators, and the like can be improved to require less physical contact, larger activation area, and multiple activation methods, with increased reliability, by utilizing a piezoelectric sensor specifically arranged between rigid, parallel mounting plates in which one of the plates (an inner plate) is rigidly fixed to prevent movement while the other plate (an outer plate) is accessible for receiving physical contact. By rigidly fixing the inner plate, such as by mounting to a wall or bollard, the sensor can react with sensitivity upon an application of less pressure on the outer plate. Such pressure compresses the sensor between the plates to produce an electrical signal. A controller receiving the signal can, in turn, execute to open a door, call an elevator and/or activate a light or sound to provide feedback.