Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. The rack stand includes a hollow body that may be formed of cartridges. Gas from an airflow source is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. The computer equipment can be modified to permit channeled cooling of the computer equipment.

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. Computer equipment is disclosed for placement in racks paired with cartridges suited to retain and aid in the cooling of the computer equipment. In other embodiments multiple cartridges are made available for known computer dimensions.

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. When multiple instances of computer equipment are managed from a central authority, cooling, heating, and/or cessation of either can be controlled in a way that enhances efficiency. Impediments that control access channels and interior access to computer equipment is toggled by the present invention.

A thermoelectric generator has a heat conducting body that exchanges heat with the environment according to environmental temperature changes, a heat storing body, and a thermoelectric conversion unit and thermal resistance body arranged between the heat conducting body and the heat storing body. One end of the thermal resistance body and one end of the thermoelectric conversion unit are in contact with each other. The other end of the thermal resistance body is in contact with the heat conducting body, and the other end of the thermoelectric conversion unit is in contact with the heat storing body. The surface of the heat storing body is covered by a covering layer having certain heat insulation properties. The temperature difference generated between the heat conducting body and the heat storing body is utilized to extract electric energy from the thermoelectric conversion unit.

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

An apparatus and method perform supersonic cold-spraying to deposit N and P-type thermoelectric semiconductor, and other polycrystalline materials on other materials of varying complex shapes. The process developed has been demonstrated for bismuth and antimony telluride formulations as well as Tetrahedrite type copper sulfosalt materials. Both thick and thin layer thermoelectric semiconductor material is deposited over small or large areas to flat and highly complex shaped surfaces and will therefore help create a far greater application set for thermoelectric generator (TEG) systems. This process when combined with other manufacturing processes allows the total additive manufacturing of complete thermoelectric generator based waste heat recovery systems. The processes also directly apply to both thermoelectric cooler (TEC) systems, thermopile devices, and other polycrystalline functional material applications.

The present invention includes a rack stand for computer servers that ingests cooled air and accepts heated exhaust. Oriented cooled spaces adjacent to heated spaces allows thermoelectric power generation.

A thermoelectric conversion element that includes a laminated body having a plurality of first thermoelectric conversion portions, a plurality of second thermoelectric conversion portions, and an insulator layer. The first thermoelectric conversion portions and the second thermoelectric conversion portions are alternately arranged in a Y-axis direction and bonded to each other in first regions, and the insulator layer is interposed between the first thermoelectric conversion portions and the second thermoelectric conversion portions in second regions. The insulator layer surrounds a periphery of each of the second thermoelectric conversion portions. A ratio (W2/W1) of a thickness (W2) of the first thermoelectric conversion portion to a thickness (W1) of the second thermoelectric conversion portion in the Y-axis direction is greater than 4 and 11 or less.

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body includes silicon or a silicon alloy, wherein the average grain size of the crystal grains forming the polycrystalline body is 1 m or less, and wherein nanoparticles including one or more of a carbide of silicon, a nitride of silicon, and an oxide of silicon are present at a grain boundary of the grains.