H01L35/30

THERMOELECTRIC COOLING PEDESTAL FOR SUBSTRATE PROCESSING SYSTEMS

A temperature-controlled pedestal includes a pedestal, a temperature sensor to sense N temperature in N zones, and N temperature control devices arranged in the N zones, respectively. A voltage source selectively supplies power to the N temperature control devices. A controller is configured to cause the voltage source to control a temperature in the N zones by a) determining a hottest one of the N zones based on the N temperatures; b) if the hottest one of the N zones is not already cooling, increasing cooling to the hottest one of the N zones using one of the N temperature control devices; c) decreasing cooling to the N zones when a temperature of the N zones is less than a first temperature setpoint; and d) repeating a) to c) until all of the N zones have a temperate less than or equal to the first temperature setpoint.

TUBULAR HEAT EXCHANGER WITH THERMOELECTRIC POWER GENERATION FUNCTION AND ITS MANUFACTURING METHOD AND THERMOELECTRIC POWER GENERATION DEVICE USING THE SAME

A tubular heat exchanger with a thermoelectric power generation function includes an inner tube 4 in which coolant flows, a thermoelectric power generation module 5 attached to an outer peripheral surface of the inner tube 4, an outer tube 3 attached to an outer peripheral surface of the thermoelectric power generation module 5, and heat collection fins 6 provided on an outer peripheral surface of the outer tube 3. The thermoelectric power generation module 5 generates thermoelectric power using the outer peripheral surface of the inner tube 4 as a low temperature source and an inner peripheral surface of the outer tube 3 as a high temperature source. The inner peripheral surface of the outer tube 3 closely contacts the outer peripheral surface of the thermoelectric power generation module 5.

THERMOELECTRIC MATERIAL, AND THERMOELECTRIC ELEMENT AND DEVICE INCLUDING SAME

Provided are a thermoelectric material, and a thermoelectric element and a thermoelectric module, each including the thermoelectric material. The thermoelectric material, according to some embodiments includes an n-doped metal halide compound having a zero-dimensional (0D) electronic system. The thermoelectric material has a significantly low electrical thermal conductivity and improved electron conductivity and thus may enhance thermoelectrical performance.

Power supply system and tracked vehicle
11398732 · 2022-07-26 · ·

In a power supply system comprising an electric generator, a DC intermediate circuit, at least one rechargeable electrical energy storage, which is connected to the DC intermediate circuit, a rectifier via which the electrical generator is connectable to the DC intermediate circuit, and at least a first inverter, the DC side of which is supplied with direct current from the DC intermediate circuit and the AC side of which is connectable to an electrical load, and further comprising a control device which regulates the generator in dependence on the load of the electrical load, it is provided that the control device is designed to switch between a first and a second operating mode of the power supply system, wherein in the first operating mode the electrical energy generated by the electrical generator is supplied via the rectifier to the DC intermediate circuit, and in the second operating mode the generator is connected to the load in parallel with the inverter.

THERMOELECTRIC GENERATOR
20210408352 · 2021-12-30 ·

A thermoelectric generator includes a heat reception portion, a heat release portion, a thermoelectric generation module that is arranged between the heat reception portion and the heat release portion, and a heat transfer mechanism that includes a first connection portion configured to be connected to the thermoelectric generation module and a second connection portion configured to be connected to at least one of the heat reception portion and the heat release portion, the heat transfer mechanism being at least partially resiliently deformed.

HEAT SINK SHIELD AND THERMOELECTRIC FAN WITH HEAT SINK SHIELD
20210408353 · 2021-12-30 ·

A thermoelectric fan including: a heat collector; a thermoelectric generator (TEG) thermally coupled to the heat collector; a heat sink thermally coupled to the TEG and positioned to provide a temperature differential across the TEG; a motor in electrical communication with the TEG; a fan blade coupled to the motor and configured to generate a first airflow through the heat sink; and a heat sink shield configured to shield the heat sink from a second airflow, the second airflow having a higher temperature than the first airflow. The second airflow may be generated by the fan blade interacting with the first airflow. A heat sink shield for a thermoelectric fan wherein the heat sink shield is configured to attach to the thermoelectric fan and configured to at least partially shield the heat sink from a vorticity vector field and related air flows generated by the fan blade.

Thermoelectric generator sleeve
11211540 · 2021-12-28 ·

A thermoelectric generator sleeve is adapted to be attached to a base of an electrical socket, which has one or more light bulbs (Incandescent, Fluorescent, LED, etc.). The heat created by the light bulbs is absorbed by the thermoelectric generator sleeve that allows the efficient conversion of heat energy into electrical energy by using thermoelectric generators. The aesthetically designed spatial configuration of the thermoelectric generators provides efficient thermal energy conversion and storage for the converted heat energy. Additional electronic circuitry to regulate the energy produced is holistically integrated into the thermoelectric generator sleeve to provide added functionality and safety.

THERMOELECTRIC STRUCTURE AND METHOD
20210399187 · 2021-12-23 ·

A circuit includes a thermoelectric structure and an energy device. The thermoelectric structure includes a wire and p-type and n-type regions positioned on a front side of a substrate, the wire configured to electrically couple the p-type region to the n-type region, a first via configured to thermally couple the p-type region to a first power structure on a back side of the substrate, and a second via configured to thermally couple the n-type region to a second power structure on the back side of the substrate. The energy device is electrically coupled to each of the first and second power structures.

DEPILATOR
20210393014 · 2021-12-23 ·

The present disclosure discloses a depilator including a cold compressing portion, a heat sink assembly and a heat conducting plate which are located away from the cold compressing portion. The heat conducting plate includes a main heat absorbing portion and a heat outputting portion. The main heat absorbing portion is in contact with the cold compressing portion, to absorb heat of the cold compressing portion. The heat outputting portion is in contact with the heat sink assembly, to conduct the heat to the heat sink assembly. The depilator defines a cooling channel. The depilator comprises a housing; the housing defines at least one cooling inlet and at least one cooling outlet; the cooling channel is formed between the at least one cooling inlet and the at least one cooling outlet; the heat of the heat sink assembly is dissipated through the cooling channel and the at least one cooling outlet.

Heat conversion apparatus

A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.