An optoelectronic device includes a substrate having a first side, a second side opposite to the first side; a first optoelectronic unit formed on the first side of the substrate; a second optoelectronic unit formed on the first side of the substrate; a third optoelectronic unit formed on the first side of the substrate; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad formed on the first side of the substrate and electrically insulated from the third optoelectronic unit; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.

The invention relates to a method of manufacturing optoelectronic devices including light-emitting diodes, including the steps of: a) forming a first integrated circuit chip including light-emitting diodes; b) bonding a second integrated chip to a first surface of the first chip; c) decreasing the thickness of the first chip on the side opposite to the first surface to form a second surface opposite to the first surface; d) bonding, to the second surface, a cap including a silicon wafer provided with recesses opposite the light-emitting diodes; e) decreasing the thickness of the second chip; f) decreasing the thickness of the silicon wafer before step d) or after step e), each recess being filled with a photoluminescent material; and g) sawing the structure obtained at step f) into a plurality of separate optoelectronic devices.

A carrier for an LED is disclosed. In an embodiment, the carrier includes a main body, wherein the carrier has an upper side on which a first contact area for attaching an LED is arranged, and wherein a protective device for protecting the LED from electrostatic discharges is integrated in the main body.

The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a resin layer surrounding the light emitting device, a PSR (photo solder resist) layer disposed between the first and second lead frames and the second lead frame and a sidewall disposed at the peripheral area of the light emitting device and including an inclined plane formed on at least one side surface thereof.

Disclosed is a light emitting apparatus which includes at least one light emitting device; a substrate under the light emitting device; a bonding member between the light emitting device and the substrate; and an adhesion member under the substrate, wherein the adhesion member includes at least one of benzotriazole and hydroxy group.

An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm.sup.2/cm.sup.2 or more. An LED illumination apparatus including the LED illumination module is also provided.

A method of manufacturing a wavelength conversion member with improved capability of releasing heat from a fluorescent material is provided. The method of manufacturing the wavelength conversion member includes: disposing a fluorescent material paste containing a fluorescent material and a binder on a surface of a light-transmissive body; orienting face-down the surface where the fluorescent material paste is disposed, to settle the fluorescent material in the fluorescent material paste on a side opposite to another side of the fluorescent material paste, the another side being in contact with the light-transmissive body; and curing the binder in a state where the fluorescent material has been settled, to form a fluorescent material layer.

According to one embodiment of the present invention, the light emitting device includes an LED element, a side wall which surrounds the LED element, a phosphor layer which is fixed to the side wall with an adhesive layer therebetween, and is positioned above the LED element, and a metal pad as a heat dissipating member. The side wall includes an insulating base which surrounds the LED element and a metal layer which is formed on a side surface at the LED element side of the base, and is in contact with the metal pad and the adhesive layer. The adhesive layer includes a resin layer that includes a resin containing particles which have higher thermal conductivity than the resin or a layer that includes solder.