A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.

A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

A phosphor converted white light emitting device comprises a solid-state light emitter (LED) operable to generate blue light with a dominant wavelength in range 440 nm to 470 nm; yellow to green-emitting phosphor operable to generate light with a peak emission wavelength in a range 500 nm to 550 nm; and a red-emitting manganese-activated fluoride phosphor such a manganese-activated potassium hexafluorosilicate phosphor (K.sub.2SiF.sub.6:Mn.sup.4+). The yellow to green and red-emitting phosphors are incorporated as a mixture and dispersed throughout a light transmissive material with an index or refraction of 1.40 to 1.43. In some embodiments the light transmissive comprises a dimethyl-based silicone. The device can further comprise an orange to red-emitting phosphor operable to generate light with a peak emission wavelength of 580 nm to 620 nm.

An optoelectronic device includes a substrate having a first side, a second side opposite to the first side; a first optoelectronic unit formed on the first side of the substrate; a second optoelectronic unit formed on the first side of the substrate; a third optoelectronic unit formed on the first side of the substrate; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad formed on the first side of the substrate and electrically insulated from the third optoelectronic unit; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.

A light emitting device includes a plurality of light emitting diode stacks and a cooler. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler. A light emitting device includes a plurality of light emitting diode stacks, a cooler, and a power supply. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler, the power supply is configured to power the plurality of light emitting diode stacks, and the power supply is mounted to the cooler on an opposite side of the cooler relative to the plurality of light emitting diode stacks.

An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

An element substrate includes an insulating substrate, electrode wiring located on the insulating substrate, a heat-dissipating member in contact with the insulating substrate, a flexible substrate electrically connected to the electrode wiring, a temperature detecting element located on the flexible substrate, and an adhesive layer. The adhesive layer is located between the temperature detecting element and an extending portion in the heat-dissipating member and between a facing surface of the flexible substrate and the extending portion in the heat-dissipating member.