The present invention relates to a ceramic substrate with a heat sink and a manufacturing method thereof. The ceramic substrate comprises: a ceramic substrate including a metal layer on at least one surface of a ceramic base; and a heat sink that is bonded to one surface of the ceramic substrate and has a multi-layer structure that refrigerant enters and exits. The present invention has an integrated structure in which the heat sink having a multi-layer structure that refrigerant enters and exits is bonded to the ceramic substrate, and thus is capable of effectively dissipating heat generated from a semiconductor chip.

Provided is a means capable of selectively improving thermal conductivity in a surface direction of a heat conduction sheet. A heat conduction film is configured by disposing a scale-like carbon material formed of a plurality of graphene layers and a binder such that adjacent scale-like carbon materials are in contact with each other and a long axis of the scale-like carbon material is oriented in plane direction of the film, and further making at least a part of a minor diameter of the binder or a minor diameter of a void formed by the scale-like carbon material and the binder smaller than a minor diameter of the scale-like carbon material.

Light-emitting diode (LED) devices and more particularly coefficient of thermal expansion (CTE) structures in submounts of LEDs are disclosed. Thermal expansion structures include arrangements of vias within submounts that provide variable CTE values across submount surfaces and/or within thicknesses of submounts. Vias may comprise air-filled vias and/or vias filled with various materials that provide variable CTE values. Vias may further be formed with variable thicknesses within submounts to further tailor CTE values. Submounts may include flexible submounts adept for mounting to irregular surfaces with vias structure to provide CTE compensation. Further aspects are described in the context of chip-scale packaging.

A method for manufacturing an optical member includes: preparing a first light-transmissive member and a first molded body made of an inorganic material and surrounding at least one or more lateral surfaces of the first light-transmissive member; firing the first molded body at a first temperature to obtain a first light-reflective member; bonding an upper surface of the first light-transmissive member to a lower surface of a second light-transmissive member; forming, on an upper surface of the first light-reflective member, a second molded body made of an inorganic material and surrounding at least one or more lateral surfaces of the second light-transmissive member; and firing the second molded body at a second temperature lower than the first temperature to obtain a second light-reflective member.

The present disclosure relates to techniques for providing a liquid metal alloy in a light-emitting diode device that can both heal cracks formed in solder joints on the light-emitting diode (LED) device as well as improve thermal energy dissipation from the LED chips to improve the performance, reduce wear, and prolong the life of the LED chips. In an embodiment, a light-emitting diode device can include a liquid metal alloy containing gallium next to a solder joint, and when one or more cracks form, the liquid metal alloy can enter the cracks and solidify, healing the cracks. The liquid metal alloy can also be placed adjacent to, and in contact with the LED chip to transfer energy away from the LED chips.