Patent classifications
H10D89/911
Integrated Switch and Self-Activating Adjustable Power Limiter
A fast response time, self-activating, adjustable threshold limiter including a limiting element LE, a first coupling element CE.sub.1 electrically connected from a signal node of LE to a control input of LE, and a second coupling element CE.sub.2 electrically connected from the control input of LE to a nominal node of LE. An initial bias (control) voltage is also supplied to the control input of LE to dynamically control the limiting threshold for the limiter. Embodiments include usage of self-activating adjustable power limiters in combination with series switch components in a switch circuit in lieu of conventional shunt switches.
Self-Activating Adjustable Power Limiter
A fast response time, self-activating, adjustable threshold limiter including a limiting element LE, a first coupling element CE.sub.1 electrically connected from a signal node of LE to a control input of LE, and a second coupling element CE.sub.2 electrically connected from the control input of LE to a nominal node of LE. An initial bias (control) voltage is also supplied to the control input of LE to dynamically control the limiting threshold for the limiter. Embodiments include usage of self-activating adjustable power limiters in combination with series switch components in a switch circuit in lieu of conventional shunt switches.
ELECTROSTATIC DISCHARGE AND PASSIVE STRUCTURES INTEGRATED IN A VERTICAL GATE FIN-TYPE FIELD EFFECT DIODE
Field effect diode structures utilize a junction structure that has an L-shape in cross-section (a fin extending from a planar portion). An anode is positioned at the top surface of the fin, and a cathode is positioned at the end surface of the planar portion. The perpendicularity of the fin and the planar portion cause the anode and cathode to be perpendicular to one another. A first gate insulator contacts the fin between the top surface and the planar portion. A first gate conductor contacts the first gate insulator, and the first gate insulator is between the first gate conductor and the surface of the fin. Additionally, a second gate insulator contacts the planar portion between the end surface and the fin. A second gate conductor contacts the second gate insulator, and the second gate insulator is between the second gate conductor and the surface of the planar portion.
Semiconductor device in a level shifter with electrostatic discharge (ESD) protection circuit and semiconductor chip
The present examples relate to a semiconductor chip having a level shifter with an electrostatic discharge (ESD) protection circuit and a device applying to multiple power supply lines with high and low power inputs to protect the level shifter from the static ESD stress. More particularly, the present examples relate to using a feature to protect a semiconductor device in a level shifter from the ESD stress by using ESD stress blocking region adjacent to a gate electrode of the semiconductor device. The ESD stress blocking region increases a gate resistance of the semiconductor device, which results in reducing the ESD stress applied to the semiconductor device itself.
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
The present invention provides an ESD protection circuit electrically connected between a high voltage power line and a low voltage power line, and the ESD protection circuit includes a bipolar junction transistor (BJT) and a trigger source. A collector of the BJT is electrically connected to the high voltage power line, and an emitter and a base of the BJT are electrically connected to the low voltage power line. The trigger source is electrically connected between the base of the BJT and the high voltage power line.
Display device
A display device includes a display panel which is configured to display an image, and includes a cell identification section configured to indicate an identification number of the display panel, and a pad section at least partly disposed on the cell identification section and being at least partly overlaid with the cell identification section, a printed circuit board configured to drive the display panel, and a chip-on-glass package electrically configured to connect the display panel with the printed circuit board.
Array substrate with high qualified rate and manufacturing method thereof
An array substrate and a manufacturing method thereof are disclosed. The present disclosure relates to the technical field of display, whereby the qualified rate of the array substrate can be improved, and the manufacturing cost thereof can be reduced significantly. The array substrate includes a first wiring, a first insulating layer, and a second wiring from bottom up in sequence. The second wiring crosses over the first wiring. A crossed-over part of the second wiring consists of a plurality of branches, with an interspace formed between every two adjacent branches, so as to obtain a comb structure. At least one of the branches is nearer to the first wiring relative to other branches. The array substrate of the present disclosure can be used in liquid crystal TV, liquid crystal display, mobile phone, tablet personal computer, and other display devices.
Field emission devices and methods of making thereof
In one embodiment of the present invention, an electronic device includes a first emitter/collector region and a second emitter/collector region disposed in a substrate. The first emitter/collector region has a first edge/tip, and the second emitter/collector region has a second edge/tip. A gap separates the first edge/tip from the second edge/tip. The first emitter/collector region, the second emitter/collector region, and the gap form a field emission device.
Method for manufacturing a semiconductor component having a common mode filter monolithically integrated with a protection device
In accordance with an embodiment, a semiconductor component, includes a common mode filter monolithically integrated with a protection device. The common mode filter includes a plurality of coils and the protection device has a terminal coupled to a first coil and another terminal coupled to a second coil.