The invention relates to a process for fabricating a solar cell. The process comprises depositing a layer of amorphous silicon on a substrate using physical vapour deposition, said substrate being a layer of a dielectric disposed on a silicon wafer. The amorphous silicon is then annealed so as to generate a layer of polycrystalline silicon on the substrate.

The invention relates to a process for fabricating a solar cell. The process comprises depositing a layer of amorphous silicon on a substrate using physical vapour deposition, said substrate being a layer of a dielectric disposed on a silicon wafer. The amorphous silicon is then annealed so as to generate a layer of polycrystalline silicon on the substrate.

A preparation method of a heterojunction solar cell includes following steps: depositing a first passivation layer on a first surface of a silicon substrate by using a gas source, a base material of the first passivation layer being hydrogenated amorphous silicon; during depositing hydrogenated amorphous silicon of the first passivation layer, allowing the gas source to gradually incorporate carbon dioxide, and controlling a proportion of carbon dioxide in the gas source to gradually increase with increase of a thickness of the first passivation layer which has been deposited.

A preparation method of a heterojunction solar cell includes following steps: depositing a first passivation layer on a first surface of a silicon substrate by using a gas source, a base material of the first passivation layer being hydrogenated amorphous silicon; during depositing hydrogenated amorphous silicon of the first passivation layer, allowing the gas source to gradually incorporate carbon dioxide, and controlling a proportion of carbon dioxide in the gas source to gradually increase with increase of a thickness of the first passivation layer which has been deposited.

A solar cell includes: a substrate including a first surface and a second surface arranged opposite to each other and a plurality of lateral surfaces adjacent to and located between the first surface and the second surface; a plurality of pyramid base shaped textured structures being constructed on the second surface and each of the lateral surfaces, wherein a minimum side length of each of top surfaces of the pyramid base shaped textured structures arranged on the lateral surfaces is L1, a maximum side length of each of top surfaces of the pyramid base shaped textured structures arranged on the second surface is L2, and L1>L2; a doped conductive layer arranged on the first surface; and a passivated contact layer including a polysilicon doped conductive layer, the passivated contact layer being arranged on the second surface.

A heterojunction battery, a preparation method therefor, and an application thereof are provided. The heterojunction battery includes a substrate, a first intrinsic amorphous silicon layer, an N-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a first transparent conductive oxide layer, a second intrinsic amorphous silicon layer, a P-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a second transparent conductive oxide layer, and a dielectric film. The heterojunction battery further includes a metal mesh. The metal mesh penetrates through the dielectric film and is fixedly connected to the first transparent conductive oxide layer and the second transparent conductive oxide layer, respectively. The metal mesh is composed of multiple first metal wires and multiple second metal wires. The first metal wires are perpendicular to the second metal wires.

A heterojunction battery, a preparation method therefor, and an application thereof are provided. The heterojunction battery includes a substrate, a first intrinsic amorphous silicon layer, an N-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a first transparent conductive oxide layer, a second intrinsic amorphous silicon layer, a P-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a second transparent conductive oxide layer, and a dielectric film. The heterojunction battery further includes a metal mesh. The metal mesh penetrates through the dielectric film and is fixedly connected to the first transparent conductive oxide layer and the second transparent conductive oxide layer, respectively. The metal mesh is composed of multiple first metal wires and multiple second metal wires. The first metal wires are perpendicular to the second metal wires.

The present invention relates to a shingled solar cell panel for producing a string in which a plurality of strips are partially overlapped with each other, and for electrically connecting the string and the string, and a method for producing the same, the method comprises providing a wafer made of a HIT in which a plurality of conductive layers are formed on upper and lower portions thereof, respectively, forming an adhesive layer by applying a conductive adhesive on the upper conductive layer, dividing the wafer on which the adhesive layer is formed into a plurality of strips, forming a string by overlapping a lower conductive layer of another strip on an area where an adhesive layer is provided among the divided strips. Accordingly, the upper conductive layer and the lower conductive layer of each of the plurality of strips can be configured to be electrically bonded via only the adhesive layer to provide a shingled solar cell panel at low cost.

The present invention relates to a shingled solar cell panel for producing a string in which a plurality of strips are partially overlapped with each other, and for electrically connecting the string and the string, and a method for producing the same, the method comprises providing a wafer made of a HIT in which a plurality of conductive layers are formed on upper and lower portions thereof, respectively, forming an adhesive layer by applying a conductive adhesive on the upper conductive layer, dividing the wafer on which the adhesive layer is formed into a plurality of strips, forming a string by overlapping a lower conductive layer of another strip on an area where an adhesive layer is provided among the divided strips. Accordingly, the upper conductive layer and the lower conductive layer of each of the plurality of strips can be configured to be electrically bonded via only the adhesive layer to provide a shingled solar cell panel at low cost.

A method for treating a photovoltaic module, the method including in succession a first procedure of exposing at least one photovoltaic cell of the photovoltaic module to electromagnetic radiation, during which the temperature of the photovoltaic cell increases until reaching a temperature, referred to as performance enhancement temperature, that is greater than or equal to 100 C.; a second procedure of exposing the photovoltaic cell to electromagnetic radiation, during which the temperature of the photovoltaic cell is maintained between T.sub.s5 C. and T.sub.s+5 C., where T.sub.s is the performance enhancement temperature, the second exposure procedure having a duration greater than or equal to 5 s; and a procedure of cooling the photovoltaic cell until a temperature of less than 100 C. is reached.