A polymer is formed by a reaction of phenolic epoxy resin or bisphenol epoxy resin and carboxylic acid, wherein the phenolic epoxy resin has a chemical structure of

##STR00001##

wherein W is H, alkyl group, or halogen. R.sup.1 is methylene, methylene diphenyl, dimethylene benzene, tetrahydrodicyclopentadiene, or

##STR00002##

n=1 to 8. The bisphenol epoxy resin has a chemical structure of

##STR00003##

wherein Z is H or alkyl group; R.sup.4 is methylene, methylmethylene, dimethylmethylene, ethylmethylmethylene, bi(trifluoromethyl)methylene, fluorenylidene, or sulfonyl group; and p=1 to 10. The carboxylic acid has a chemical structure of HOOCAr(X).sub.m, HOOCR.sup.2, or a combination thereof, wherein Ar is benzene or naphthalene; X is hydroxy group, alkoxy group, or alkyl group, and at least one X is hydroxy group; m=1 to 3, wherein R.sup.2 is C.sub.3-7 alkyl group.

A thermoset composition includes an epoxy prepolymer, an amine hardener, a reactive diluent, and an accelerator for crosslinking reactions. A method for making the degradable and recyclable epoxy resin includes mixing an epoxy prepolymer, an amine hardener, a reactive diluent, and an accelerator to form a mixture, degassing the mixture, and curing the mixture to for a resin.

The invention relates to radiation curable silicone-epoxy resins, coating compositions containing said resins and to the use of these coating compositions for producing protection or dielectric layers in semiconductor elements.

This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (VOC).

The invention provides a unique thermoset viscoelastomeric reaction product and a container combination comprised of the supportive base equipped with a thermoset viscoelastomer reaction product possessing unexpectedly superior adhesive and cohesive efficacy rendering it especially useful as an adhesive insert in a container combination. The thermoset insert bonds to any suitable supportive structure. The unique viscoelastomeric reaction product inserts adhesively immobilize items placed thereupon and adhesively or permanently bonds to most conventional containers. The tenacious cohesive and adhesive features of the insert allows for inverted stowage of stowed items. Due to the confining adhesive and cohesive attributes of the insert, structural supports of a flexible or solid base without a conventional confining structure provide a unique container combination for the stowed items. Containers equipped with the unique insert also surprisingly provide an aseptic environment especially useful for hygienic applications.

The present invention provides a polyorganosiloxane compound having a low viscosity, a process for the manufacture of such polyorganosiloxane compounds, polyorganosiloxane compositions comprising said polyorganosiloxane compound and another polyorganosiloxane compound which is different from the polyorganosiloxane compound, aqueous emulsions comprising the polyorganosiloxane compound, and a method of surface treatment using the polyorganosiloxane compound.

Disclosed are a modified epoxy resin immobilized enzyme, a preparation method therefor and an application thereof. Herein, the preparation method includes the following steps: modifying an epoxy resin, adding a polyethyleneimine to a modified epoxy resin for further modification, and then adding an enzyme to be immobilized and a glutaraldehyde for immobilization, to obtain the modified epoxy resin immobilized enzyme. The epoxy resin is modified, the polyethyleneimine is added to the modified epoxy resin for the further modification, and an aldehyde group in the resin and an amino group in the polyethyleneimine are covalently bound to each enzyme, then it is activated by the bifunctional reagent glutaraldehyde.

Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The described compositions can also be applicable to rosin derivatives and fatty acid derivatives.

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, Y representsOCO, O or S, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.