An optical assembly includes an image sensor, a lens module disposed over the image sensor in a first direction, a transparent glue layer, and a transparent dry adhesive layer formed of a different material than the transparent glue layer. Each of the transparent glue layer and the transparent dry adhesive layer are disposed between the image sensor and the lens module in the first direction. Each of the transparent glue layer and the transparent dry adhesive layer are optically coupled in series with the image sensor and the lens module. A method for forming an optical assembly includes joining an image sensor and a lens module using a transparent glue layer and a transparent dry adhesive layer formed of a different material than the transparent glue layer.

An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

The present technology relates to an imaging device, and an electronic apparatus that contribute to downsize a module. A substrate to which an image sensor is mounted, a frame that fixes a lens, and the lens are included. The substrate, the frame, and the lens seals the image sensor. There are provided a plurality of lenses, and the lens fixed to the frame is a lens positioned nearest to the image sensor among a plurality of lenses. There may be further provided a lens barrel that holds the lenses, and the lenses other than the lens are positioned near the image sensor among the plurality of lenses are held by the lens barrel. The present technology is applicable to the imaging device.

A constructed photodetector, an optical receiver, and a receiver unit in an optical communication system are disclosed. One example of the disclosed constructed photodetector includes an optoelectronic element having an active area that converts light having a wavelength of interest into electrical signals and a substrate on a face that opposes the active area, where the substrate is non-transparent to light having the wavelength of interest. The constructed photodetector further includes a lens-chip that is at least partially transparent to light having the wavelength of interest, where the lens-chip includes a first side and an opposing second side, where the first side of the lens-chip includes an integrated lens, and where the second side of the lens-chip includes one or more electrical traces. The constructed photodetector further includes at least one connector that provides a physical and electrical connection between the optoelectronic element and the lens-chip.

Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

The semiconductor device comprises a semiconductor substrate (2), a transition layer (5) in or on the semiconductor substrate, the transition layer allowing propagation of incident radiation (7) according to a refractive index, and a photonic component (4) facing the transition layer. A surface (6) of the transition layer is structured such that the effective refractive index is gradually changed through the transition layer with changing distance from the photonic component.

A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

The invention relates to an optoelectronic device (1) comprising a detector for receiving radiation and a frame (3). Said frame is provided with an opening (30), in which the detector is located. The frame extends vertically between a radiation penetration face (300) and a rear face (301). The opening has a lateral face (4) running obliquely to the vertical direction. The oblique lateral face from the top view of the radiation penetration face has a first sub-section (41) and a second sub-section (42). The first sub-section is designed as a reflector for the radiation that is to be received by the detector and the second sub-section guides radiation that is incident on the second sub-section in the vertical direction away from the detector.

Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.