A piezoelectric element includes a piezoelectric layer, a first electrode layer, a second electrode layer, and a coupling electrode. At least a portion of the second electrode layer faces the first electrode layer with the piezoelectric layer interposed therebetween. The second electrode layer includes a coupling area. The coupling area meets a through hole in a region of the second electrode layer not facing the first electrode layer. The coupling electrode is on the coupling area. Between the coupling area and the surface of the second electrode layer on the piezoelectric layer side excluding the coupling area, the difference in position is about 5 nm or less.

The present invention relates to a method of producing a ceramic substrate, the method including: joining a metal layer to each of opposite surfaces of a ceramic base material; forming, on the metal layers, a first electrode layer and a second electrode layer having a larger volume than the first electrode layer; calculating the volumes of the first and second electrode layers; and controlling a thickness of the second electrode layer, thereby controlling warpage which may occur due to a difference between the volumes of the first and second electrode layers. The present invention can reduce the defect rate of a ceramic substrate by controlling warpage that may occur due to the difference in volume taken up by the metal layers on the opposite surfaces of the base material.

A quartz crystal resonator that includes an AT-cut quartz crystal blank including a first main surface and a second main surface that face each other and each of which has long sides extending in an X-axis direction of the quartz crystal blank and short sides extending in a Z′-axis direction of the quartz crystal blank, and a first side surface and a second side surface that are located adjacent to the long sides of the first main surface and the second main surface; a first excitation electrode and a second excitation electrode; and an extension electrode that extends from the first main surface to the second main surface along the first side surface and that is electrically connected to the first excitation electrode. Each the first and second side surfaces have a first m-plane face and a second m-plane face.

A display module and a fabrication method thereof, and a display device, and relates to the field of display technologies, to synchronously implement a display function and a surface tactile reproduction function. The display module includes: a base substrate, a plurality of piezoelectric structures positioned on a first side of the base substrate, and at least one isolation portion positioned on the first side of the base substrate and configured to separate any two adjacent piezoelectric structures. A pixel hole is arranged in at least one of three positions, i.e., a position of the piezoelectric structure, a position of the isolation portion, and a position between the piezoelectric structure and the isolation portion. The display module also includes a plurality of pixel structures, and each of the plurality of pixel structures is positioned in one of the pixel holes.

An etching method for forming a vertical structure is provided. The etching method may include: positioning a mask on a substrate, wherein the mask includes an opening pattern and a compensation pattern, and the compensation pattern is disposed at a corner of two adjacent sides of the opening pattern and includes a concave compensation pattern that is indented from one of the two adjacent sides; and forming the vertical structure on the substrate through the opening pattern of the mask by a dry etching process.

The present disclosure provides a manufacturing method for a piezoelectric ceramic chip, a piezoelectric ceramic chip assembly and a display device. The manufacturing method includes: transferring a piezoelectric ceramic layer and a bottom electrode covering the piezoelectric ceramic layer formed on a substrate to a base plate, forming an insulating layer with an opening on the base plate, so that edges of the piezoelectric ceramic layer and the bottom electrode are covered by the insulating layer, and the piezoelectric ceramic layer is exposed from the opening; etching the base plate by immersing the base plate in an etching solution for etching a material of the bottom electrode; and forming a top electrode in the opening of the insulating layer, so that the top electrode is spaced apart from the insulating layer.

According to various embodiments, a PMUT device may include a wafer, an active layer including a piezoelectric stack, an intermediate layer having a cavity therein where the intermediate layer is disposed between the wafer and the active layer such that the cavity is adjoining the piezoelectric stack. A via may be formed through the active layer and the intermediate layer to the wafer. A metallic layer may be disposed over the active layer and over surfaces of the via. The intermediate layer may include an interposing material surrounding the cavity, and may further include a sacrificial material surrounding the via. The sacrificial material may be different from the interposing material. The metallic layer may include a first member at least substantially overlapping the piezoelectric stack, a second member extending from the first member to the cavity, and a third member extending into the active layer to contact an electrode therein.

An inkjet printing head 1 includes an actuator substrate 2 having pressure chambers (cavities) 7, a movable film formation layer 10 including movable films 10A disposed above the pressure chambers 7 and defining top surface portions of the pressure chambers 7, and piezoelectric elements 9 formed above the movable films 10A. Each piezoelectric element 9 includes a lower electrode 11 formed above a movable film 10A, a piezoelectric film 12 formed above the lower electrode 11, and an upper electrode 13 formed above the piezoelectric film 12. The piezoelectric film 12 includes an active portion 12A with an upper surface in contact with a lower surface of an upper electrode 13 and an inactive portion 12B led out in a direction along a front surface of the movable film formation layer 10 from an entire periphery of a side portion of the active portion 12A and having a thickness thinner than that of the active portion 12A.

A vibration detection element includes substrates, support members, and an oscillator, and may be used as a biosensor and/or for liquid inspection by analysis of oscillator resonant frequency change. The substrates have a space portion, and the support members protrude from the surfaces of the respective substrates into the space portion. The oscillator is disposed between the support members and is capable of vibrating in the space portion. The support members may each include multiple supports which prevent the oscillator from contacting the substrate surfaces. During manufacturing the oscillator may be transferred from the support member of a glass flow path substrate to a silicon flow path substrate by placement of the silicon substrate support member against the oscillator and subsequent removal of the adhesive from the glass substrate support member.

Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.