A piezoelectric drive device includes: a vibrating body having a first surface and a second surface provided with a recessed portion; and a piezoelectric element provided on the first surface. The recessed portion and the piezoelectric element have an overlap region when viewed in a normal direction of the second surface.

Provided is a method of manufacturing a MEMS device including forming, in a metal layer, an opening that enables a first space and a second space to communicate with each other by exposing the metal layer to an etching solution in a state where the metal layer is left at a boundary between the first space and the second space, and covering an inner surface of an opening of each of an adhesive layer and the metal layer by forming a protective layer from an inner surface of the first space to an inner surface of the second space after the opening of the metal layer is formed.

An integrated heat dissipation system for a haptic piezoelectric keyboard of an information handling system comprising a base chassis formed of a C-cover affixed to a D-cover to house the haptic piezoelectric keyboard assembly, a processor, and a heat dissipating layer and the heat dissipating layer thermally coupled to a haptic piezoelectric keyboard assembly and the processor to direct heat away from the keys of the piezoelectric keyboard of the C-cover and toward a vertical edge of the base chassis, where the piezoelectric keyboard assembly comprises a plurality of piezoelectric sensors disposed across a support plate, and a contact foil layer, for detecting deformation of one of the plurality of piezoelectric sensors and registering a keystroke, affixed to the plurality of piezoelectric sensors and the support plate and provide a haptic feedback control signal to generate a haptic response to the keys of the piezoelectric keyboard.

A backlit haptic keyboard of an information handling system may comprise a contact foil placed between a coversheet and a support layer, operatively coupling an LED controller to an LED via metallic traces printed upon a top surface of the contact foil and operatively coupling a piezoelectric element to a keyboard controller via metallic traces printed upon a bottom surface of the contact foil. The system may further comprise the LED placed between the coversheet and the contact foil, and a piezoelectric element placed between the contact foil and support layer to receive an applied mechanical stress at a key and generate an electric actuation signal. A keyboard controller of the information handling system may receive an electric actuation signal from the piezoelectric element via the bottom metallic traces and send an electrical haptic response control signal to the piezoelectric element to cause it to generate haptic feedback at the key.

A piezoelectric thin-film element includes a diaphragm plate on a substrate; a lower electrode on the diaphragm plate; a piezoelectric film on the lower electrode, the piezoelectric film containing Pb; and an upper electrode on the piezoelectric film. The diaphragm plate is a laminate in which a silicon oxide layer, a silicon nitride layer, and an amorphous layer containing a metal oxide to trap Pb of the piezoelectric film are laminated in turn on the substrate. The amorphous layer has a thickness of preventing Pb of the piezoelectric film from reaching the silicon nitride layer.

Provided are resonators, a resonator system including the resonators, and a method of manufacturing the resonators. The resonator includes a vibration beam configured to vibrate in response to an external signal, a sensing unit configured to detect the movement of the vibration beam, and a lumped mass unit including a base unit that contacts the vibration beam and a wing unit arranged separately from the vibration beam on the base unit.

Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.

A semiconductor device includes a buffer layer formed with a semiconductor adapted to produce piezoelectric polarization, and a channel layer stacked on the buffer layer, wherein a two-dimensional hole gas, generated in the channel layer by piezoelectric polarization of the buffer layer, is used as a carrier of the channel layer. In a complementary semiconductor device, the semiconductor device described above and an n-type field effect transistor are formed on the same compound semiconductor substrate. Further, a semiconductor device manufacturing method includes forming a compound semiconductor base portion, forming a buffer layer on the base portion, forming a channel layer on the buffer layer, forming a date on the channel layer, and forming a drain and source with the gate therebetween on the channel layer.

Receiver-stimulator with folded or rolled up assembly of piezoelectric components, causing the receiver-stimulator to operate with a high degree of isotropy are disclosed. The receiver-stimulator comprises piezoelectric components, rectifier circuitry, and at least two stimulation electrodes. Isotropy allows the receiver-stimulator to be implanted with less concern regarding the orientation relative the transmitted acoustic field from an acoustic energy source.

Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.