A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a connecting board being a metal board and a supporting shell being a plastic member. The supporting shell includes a bottom wall opposite to a disposing opening of the connecting board and a surrounding side wall integrally surrounding and connecting to the bottom wall. The surrounding side wall encloses a portion of the connecting board. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet enclosed by the encapsulating body. The encapsulating body is disposed on the bottom wall and surrounded by the surrounding side wall. The piezoelectric sheet has a sensing surface exposed to the encapsulating body and facing the bottom wall. The fixing members fix the board on the connecting board, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

An end effector assembly for use with an electrosurgical instrument is provided. The end effector assembly has a pair of opposing jaw members. One or more of the jaw members includes a support base, an electrical jaw lead, and a sealing plate coupled to the electrical jaw lead. The sealing plate has a stainless steel layer and one or more piezo electric sensors. The jaw member also includes an insulative plate disposed between the support base and the sealing plate.

An ultrasonic transducer includes a carrier with a first surface and a second surface which are opposite to each other, a piezoceramic element attached on the first surface of the carrier, a first acoustic matching layer with a third surface and a fourth surface which are opposite to each other, the third surface is attached on the second surface of the carrier, wherein the first acoustic matching layer includes a mesh with openings, and the thickness of first acoustic matching layer is smaller than wavelength of an ultrasonic wave emitted by the piezoceramic element in the first acoustic matching layer in an operating frequency, and a total area of the openings of mesh is larger than 30% area of the third surface of first acoustic matching layer, and a second acoustic matching layer disposed on the fourth surface of the first acoustic matching layer.

The present invention relates to a transducer device having a planar array of electroacoustic cells, each including a piezoelectric bilayer unit. The transducer device achieves high transmission sensitivity across a broad bandwidth. The transducer device may be designed to have a broad or a focused directivity pattern, or may be multi-frequency, depending on the particular application and has a range of applications. For example, the transducer device may be used with an implanted passive ultrasonically excitable resonating sensor, to excite the sensor and/or to interrogate the sensor, for example in conjunction with Doppler-based analysis of the resonance frequency of the sensor, and/or to locate an implanted sensor. The invention also relates to a method of manufacturing the device.

To provide a tactile vibration applying device that efficiently outputs vibrations using an electrostatic or piezoelectric actuator. The tactile vibration applying device includes the electrostatic or piezoelectric actuator formed in a flat shape, and expanding and contracting in a thickness direction, a first elastic body having an elastic modulus smaller than an elastic modulus of the actuator in the thickness direction and disposed to contact a surface of the actuator on a side of the first electrode, and a first cover covering a surface of the first elastic body opposite to a surface of the first elastic body contacting the actuator, pressing the actuator and the first elastic body in the thickness direction of the actuator, and holding the first elastic body in a state that the first elastic body is compressed more than the actuator.

Receiver-stimulator with folded or rolled up assembly of piezoelectric components, causing the receiver-stimulator to operate with a high degree of isotropy are disclosed. The receiver-stimulator comprises piezoelectric components, rectifier circuitry, and at least two stimulation electrodes. Isotropy allows the receiver-stimulator to be implanted with less concern regarding the orientation relative the transmitted acoustic field from an acoustic energy source.

Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.

A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.