A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.

One electrical lead from an LED package is soldered to an inner electrically conductive member positioned and electrically isolated from an outer electrically conductive member by electrically insulating material while a second electrical lead and a neutral lead from the LED are soldered to the outer electrically conductive member so that heat is transferred from an LED die within the LED package to the outer electrically conductive member and then to a thermally conductive outer casing with a thermal path that minimizes thermal resistance.

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.

A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The substrate has a first main surface, a second main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material and a pair of connection terminals. The light emitting element is mounted on the first main surface of the substrate. The sealing member is in contact with at least a part of a side surface of the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface. The heat dissipation terminal is arranged generally in the center on the second main surface of the substrate and has a recess portion as viewed along a direction normal to the second main surface.

The invention relates to a method of manufacturing optoelectronic devices including light-emitting diodes, including the steps of: a) forming a first integrated circuit chip including light-emitting diodes; b) bonding a second integrated chip to a first surface of the first chip; c) decreasing the thickness of the first chip on the side opposite to the first surface to form a second surface opposite to the first surface; d) bonding, to the second surface, a cap including a silicon wafer provided with recesses opposite the light-emitting diodes; e) decreasing the thickness of the second chip; f) decreasing the thickness of the silicon wafer before step d) or after step e), each recess being filled with a photoluminescent material; and g) sawing the structure obtained at step f) into a plurality of separate optoelectronic devices.

Disclosed are a light emitting device package. The light emitting device package includes a body having recess; a first lead frame including a first and second portions on a first region of the body; a second lead frame including a third and fourth portions on a second region of the body; a third lead frame between the first and second lead frame. The body has a length of the first direction greater than a width of the second direction, wherein the second portion of the first lead frame extends toward the second lead frame and has a small width, and wherein the fourth portion of the second lead frame extends toward the first lead frame. A first light emitting device is disposed on the first portion of the first lead frame and a second light emitting device is disposed on the third portion of the second lead frame.

Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

The present invention is concerned with a hair removal device having a light emission unit having a substrate and a plurality of first LED dies that are mounted on the substrate on an area of at least 0.2 cm.sup.2, in particular of at least 1 cm.sup.2, the first LED dies having a peak emission wavelength in the far red or infrared wavelength range of between 700 nm and 980 nm, wherein the hair removal device is arranged to emit a treatment light pulse having a pulse length in the range of between 60 ms and 120 ms and the first LED dies have a radiant flux such that a radiant fluence on the skin of a user in the range of between 3 J/cm.sup.2 and 7 J/cm.sup.2 is achieved by application of the treatment light pulse.

The present invention is concerned with a skin treatment device, in particular a hair removal device, having a light emission unit comprising a substrate and a plurality of first LED dies mounted on the substrate on an area of at least 0.2 cm.sup.2, in particular of at least 1 cm.sup.2, wherein the skin treatment device is arranged to activate the first LED dies to emit a treatment light pulse having a pulse length in particular in the range of between 10 ms and 300 ms and the first LED dies have a radiant flux such that a radiant fluence on the skin of a user of at least 1 J/cm.sup.2 is achieved by application of the treatment light pulse, wherein the light emission unit has at least two selectable active areas of first LED dies, where the selectable active areas have different sizes, and at least three second LED dies are mounted on the substrate at locations suitable for visibly indicating each of the selectable active areas.

A protective covering configured for use with a mobile electronics device, including a front wall and a plurality of side walls defining a primary cavity. A back wall is disposed within the primary cavity separating the primary cavity into a protective covering electronics housing cavity and a mobile electronic device housing cavity. One or more apertures are disposed within the front wall. A light source is disposed within the protective covering electronics housing cavity, wherein at least a portion of the light source is disposed outside of the protective covering electronics housing cavity and through at least one of the one or more apertures in the front wall. A heat sink is disposed within the protective covering electronics housing cavity and in contact with the light source.