A semiconductor device for restraining snapback is provided. The semiconductor device includes IGBT and diode regions. In a view of n-type impurity concentration distribution along a direction from a front surface to a rear surface, a local minimum value of an n-type impurity concentration is located at a border between cathode and buffer regions. A local maximum value of n-type impurity concentration is located in the buffer region. At least one of the buffer and cathode regions includes a crystal defect region having crystal defects in a higher concentration than a region therearound. A peak of a crystal defect concentration in a view of crystal defect concentration distribution along the direction from the front surface to the rear surface is located in a region on the rear surface side with respect to a specific position having the n-type impurity concentration which is a half of the local maximum value.

A power semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a pair of conductive bodies, a third semiconductor layer of the second conductivity type, and a fourth semiconductor layer of the first conductivity type. The second semiconductor layer is provided on the first semiconductor layer on the first surface side. The pair of conductive bodies are provided via an insulating film in a pair of first trenches extending across the second semiconductor layer from a surface of the second semiconductor layer to the first semiconductor layer. The third semiconductor layer is selectively formed on the surface of the second semiconductor layer between the pair of conductive bodies and has a higher second conductivity type impurity concentration in a surface of the third semiconductor layer than the second semiconductor layer.

Apparatus and methods for PIN diode switches for radio frequency electronic systems are provided herein. In certain configurations, a packaged switch including a packaging substrate including a die paddle and a thermally conductive substrate attached to the die paddle, one or more PIN diode switches attached to the thermally conductive substrate, and a driver chip attached to the die paddle and configured to generate a plurality of bias voltages operable to control biasing of the one or more PIN diode switches. The driver chip includes a switching regulator configured to generate a first bias voltage of the plurality of bias voltages and a charge pump configured to generate a second bias voltage of the plurality of bias voltages.

A junction field-effect transistor (JFET) with a gate region that includes two separate sub-regions having material of different conductivity types and/or a Schottky junction that substantially suppresses gate current when the gate junction is forward-biased, as well as complementary circuits that incorporate such JFET devices.

A p-type anode layer (2) is provided on an upper surface of an n-type drift layer (1). An n-type cathode layer (3) is provided on a lower surface of the n.sup.-type drift layer (1). An n-type buffer layer (4) is provided between the n.sup.-type drift layer (1) and the n-type cathode layer (3). A peak impurity concentration in the n-type buffer layer (4) is higher than that in the n.sup.-type drift layer (1) and lower than that in the n-type cathode layer (3). A gradient of carrier concentration at a connection between the n.sup.-type drift layer (1) and the n-type buffer layer (4) is 20 to 2000 cm.sup.4.

A semiconductor device according to an embodiment includes a normally-off transistor having a first drain, a first source electrically connected to a source terminal, and a first gate electrically connected to a gate terminal, a normally-on transistor having a second gate, a second source electrically connected to the first drain, and a second drain electrically connected to a voltage terminal, a first capacitor provided between the gate terminal and the second gate, a first diode having a first anode electrically connected to the first capacitor and the second gate, and a first cathode electrically connected to the first source, a coil component provided between the voltage terminal and the second drain, and a second diode having a second anode electrically connected to the first drain and the second source, and a second cathode electrically connected to the coil component and the voltage terminal.

A silicon carbide semiconductor device includes a transistor region, a diode region, a gate line region, and a gate pad region. The gate pad region and the gate line region are each disposed to be sandwiched between the diode region and the diode region, and a gate electrode on the gate pad region and the gate line region is formed on an insulating film formed on an epitaxial layer. Thus, breakdown of the insulating film in the gate region can be prevented without causing deterioration in quality of the gate insulating film, upon switching and avalanche breakdown.

According to one embodiment, in a semiconductor device, The first semiconductor region is provided between the first and the second electrode. The second semiconductor region is provided between the first semiconductor region and the second electrode. The first and second connection region are electrically connected to the second electrode, reaches the first semiconductor region. The first insulating film is provided between the first connection region and the second semiconductor region and between the first connection region and the first semiconductor region. The second insulating film is provided between the second connection region and the second semiconductor region and between the second connection region and the first semiconductor region. The third connection region is provided between the first connection region and the second connection region, the third connection region is electrically connected to the second electrode, reaches the first semiconductor region or reaches the second semiconductor region.

A semiconductor device includes a first identification mark that is identifiable by a photoluminescence method, and a second identification mark that is identifiable using visible light.

A semiconductor device includes a semiconductor layer having a first surface and a second surface, a first electrode on the first surface, a second electrode on the second surface, a first semiconductor region of a first conductivity type in the semiconductor layer, a second semiconductor region of a second conductivity type in an element region of the semiconductor layer between the first semiconductor region and the first electrode, a third semiconductor region of the second conductivity type between the second semiconductor region and the first electrode, and a fourth semiconductor region of the second conductivity type in a termination region of the semiconductor layer inwardly of the first surface. A distance between the fourth semiconductor region and the second surface is greater than a distance between the second semiconductor region and the second surface.