A light redirecting film defining a longitudinal axis, and including a base layer, an ordered arrangement of a plurality of microstructures, and a reflective layer. The microstructures project from the base layer, and each extends across the base layer to define a corresponding primary axis. The primary axis of at least one of the microstructures is oblique with respect to the longitudinal axis. The reflective layer is disposed over the microstructures opposite the base layer. When employed, for example, to cover portions of a PV module tabbing ribbon, or areas free of PV cells, the films of the present disclosure uniquely reflect incident light.

A p.sup. type semiconductor substrate 20 has a first principal surface 20a and a second principal surface 20b opposed to each other and includes a photosensitive region 21. The photosensitive region 21 is composed of an n.sup.+ type impurity region 23, a p.sup.+ type impurity region 25, and a region to be depleted with application of a bias voltage in the p.sup. type semiconductor substrate 20. An irregular asperity 10 is formed in the second principal surface 20b of the p.sup. type semiconductor substrate 20. An accumulation layer 37 is formed on the second principal surface 20b side of the p.sup. type semiconductor substrate 20 and a region in the accumulation layer 37 opposed to the photosensitive region 21 is optically exposed.

A photovoltaic device comprises a back reflective coating structure to provide back scattering of light that passes through the photovoltaic device, an absorber structure containing chalcogenide materials, and a top scattering antireflective structure deposited on the top subcell. Illustratively, a multi-junction structure comprises a bottom subcell deposited on the back reflective coating structure, the bottom subcell having a lower band gap, higher index material embedded therein, to provide lateral propagation of light that passes through the photovoltaic device, and a top subcell deposited on the bottom subcell. The multi-junction structure can comprise chalcogenide materials, in which case the top subcell is embedded with an intermediate band gap absorber material.

The semiconductor device comprises a semiconductor substrate (2), a transition layer (5) in or on the semiconductor substrate, the transition layer allowing propagation of incident radiation (7) according to a refractive index, and a photonic component (4) facing the transition layer. A surface (6) of the transition layer is structured such that the effective refractive index is gradually changed through the transition layer with changing distance from the photonic component.

A silicon solar cell has doped amorphous silicon contacts formed on a tunnel silicon oxide layer on a surface of a silicon substrate. High temperature processing is unnecessary in fabricating the solar cell.

A method of making a germanium perovskite/crystalline germanium thin-film tandem solar cell including the steps of depositing a textured oxide buffer layer on glass, depositing a SnGe film from a eutectic alloy on the buffer layer; and depositing perovskite elements on the SnGe film, thus forming a perovskite layer based on the Ge from the SnGe film, incorporating the Ge into the perovskite layer.

A solar cell is discussed. The solar cell includes a silicon substrate; a front passivation layer positioned on a front surface of the silicon substrate; an n-doped layer positioned on the front surface of the silicon substrate; an anti-reflection layer positioned on the n-doped layer; a p-doped region positioned on a rear surface of the silicon substrate; an n-doped region positioned on the rear surface of the silicon substrate and spaced apart from the p-doped region; a rear passivation layer positioned on the rear surface of the silicon substrate, the rear passivation layer including: a first portion positioned between the p-doped region and the silicon substrate; a second portion positioned between the n-doped region and the silicon substrate, the second portion being space apart from the first potion; and a third portion disposed between the first portion and the second portion; a first electrode directly contacted to the p-doped region; and a second electrode directly contacted to the n-doped region.

A coated glazing comprising: a transparent glass substrate, wherein a surface of the substrate is directly or indirectly coated with at least one layer based on a transparent conductive coating (TCC) and/or at least one layer based on a material with a refractive index of at least 1.75, and wherein said surface has an arithmetical mean height of the surface value, Sa, of at least 0.4 nm prior to said coating of said surface.

A method of producing an optoelectronic semiconductor chip includes providing a growth substrate and a semiconductor layer sequence grown on the growth substrate with a main extension plane including a p-conductive layer, an active zone and an n-conductive layer, removing the semiconductor layer sequence in regions to form at least one aperture extending through the p-conductive layer and the active zone into the n-conductive layer of the semiconductor layer sequence, depositing a protective layer on a side of the semiconductor layer sequence facing away from the growth substrate, depositing an aluminum layer containing aluminum across the entire surface on a side of the semiconductor layer sequence facing away from the growth substrate, removing the growth substrate, and forming a mesa by removing the semiconductor layer sequence at the regions of the protective layer, wherein the protective layer is subsequently freely externally accessible at least in places.

A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.