A metal-semiconductor contact structure is provided. The metal-semiconductor contact structure includes a doped silicon-based semiconductor layer and a metal electrode in contact with each other. A contact region between the doped silicon-based semiconductor layer and the metal electrode includes a first conductive region and a second conductive region. In the first conductive region, the metal electrode is recessed towards an inner direction of the doped silicon-based semiconductor layer to form a pit island, a silicon-based eutectic in conductive connection with the doped silicon-based semiconductor layer is provided in the pit island, and a conductive crystal in conductive connection with the silicon-based eutectic is provided. A conductive aggregate including a glass phase material and metal conductive particles is provided in the second conductive region, and the metal conductive particles have a same kind of the metal element as the conductive crystal.

Photovoltaic devices having transparent contact layers are described herein.

Provided are a back contact solar cell, a method for preparing a back contact solar cell, and a battery assembly. The back contact solar cell includes: a semiconductor substrate having a light receiving surface and a shady surface opposite to the light receiving surface, a first polarity structure formed in the first polarity region, and a second polarity structure formed in the second polarity region. The light receiving surface is a textured surface, and a surface of the first polarity region and a surface of the second polarity region are polished surfaces. According to the back contact solar cell of the present disclosure, a shady surface of the semiconductor substrate is combined with a passivation contact technology to form a hybrid back contact cell. Meanwhile, the shady surface of the semiconductor substrate is processed as a polished surface.

A metal-semiconductor contact structure and a preparation method thereof, a solar cell and a photovoltaic module are provided. The metal-semiconductor contact structure includes a metal electrode and a semiconductor layer in contact with each other. The metal electrode has a metal element, and the semiconductor layer has a semiconductor element and a doping element for doping the semiconductor layer. A contact interface between the metal electrode and the semiconductor layer has a hole and a conductive structure. The conductive structure includes a conductive eutectic adjacent to the semiconductor layer, and a conductive crystal extending from the conductive eutectic into the hole. The conductive eutectic includes a eutectic formed by the metal element and the semiconductor element, and the conductive crystal includes a crystal formed by crystallization of the metal element.

According to the embodiments provided herein, a method for sputtering a TCO material onto a substrate includes process conditions that produce a textured topography at the interfaces of various layers. The textured topography can include an average roughness from about 5 to about 40 nm. The process conditions can include providing oxygen in the sputtering environment at a flow rate of from 0 to about 30 sccm; or heating the substrate to at least 200; or increasing the magnetic field strength to above 40 mT. The textured topography creates interfacial transition areas which have hybrid physical properties compared to their constituent materials.

A method for manufacturing a photodetector and a method for manufacturing an image sensor includes forming a first electrode on a support; filtering a quantum dot dispersion liquid containing quantum dots having a maximal absorption in terms of absorbance in a wavelength range of 900 to 1700 nm, a ligand, and a solvent, and forming a semiconductor film containing quantum dots on the first electrode by using the filtered quantum dot dispersion liquid; and forming a second electrode on the semiconductor film.

Photovoltaic devices, and methods of fabricating photovoltaic devices. The photovoltaic devices may include a first electrode, at least one quantum dot layer, at least one semiconductor layer, and a second electrode. The first electrode may include a layer including Cr and one or more silver contacts.

Disclosed herein are devices, systems, and methods for processing a solar cell precursor. The processing may include forming a transparent, electrically conductive first layer over the solar cell precursor. The processing may also include forming a transparent, electrically conductive second layer over the solar cell precursor, preferably in physical contact with the first layer. The first layer may comprise at least indium, zinc, and oxygen and the second layer may comprise oxygen and a greater proportion of indium than the first layer.

According to an embodiment, a barrier film having excellent gas barrier properties and excellent weather resistance and durability is provided. A barrier film according to the embodiment is a barrier film including: an inorganic barrier layer; and a sealing layer disposed to be in contact with a surface of the barrier layer, in which the sealing layer contains a two-dimensional material, and a zeta potential of a surface of the inorganic barrier layer in water at pH 6 and a zeta potential of a surface of the sealing layer in water at pH 6 have opposite signs.

A solar cell, comprising a silicon cell main body (110), a first transparent conductive oxide layer (120), a second transparent conductive oxide layer (130), an insulating passivation layer (160), and a second electrode (150), wherein the insulating passivation layer (160) covers edges of the back face of the silicon cell main body (110), and at the edges of the back face of the silicon cell main body (110), the second transparent conductive oxide layer (130) and the first transparent conductive oxide layer (120) are arranged spaced apart from each other by means of the insulating passivation layer (160) arranged therebetween.