There is described a foil transducer for a valve, comprising at least one firmly arranged holding part, at least one displaceable force transmission part, an electroactive foil composite structure and at least two electrodes. The electroactive foil composite structure has an actuating direction in which the electroactive foil composite structure is extended on actuation. The actuating direction lies in a plane spanned by the electroactive foil composite structure. Furthermore, a valve is described.

A ink jet print head includes an actuator substrate having an ink flow path including a pressure chamber, a movable membrane forming layer including a movable membrane disposed on the pressure chamber and defining a ceiling surface portion of the pressure chamber, a piezoelectric element formed on the movable membrane and including a lower electrode, a piezoelectric film formed on the lower electrode and an upper electrode formed on the piezoelectric film, with the pressure chamber, the movable membrane and the upper electrode having a rectangular shape elongated in one direction in plan view as viewed from a direction normal to the movable membrane, the lower electrode including a main electrode section constituting the piezoelectric element and an extension section extending from the main electrode section along a surface of the movable membrane forming layer, and a dimension measuring pattern related to the pressure chamber.

A method of forming an electronic structural element having a stack including first and second electrode layers arranged alternatively with material layers is disclosed. A stack is formed with the first electrode layers projecting beyond a first lateral side of the stack and the second electrode layers spaced radially inward from the first lateral side. A first contacting structure that contacts each first electrode layer is applied directly to the first side of the stack, which contacting structure embeds such the projecting first electrode layers in an electrically conductive manner. A second contacting structure is formed by exposing the first and second electrode layers at a second side of the stack, forming, by an additive method, a solvent-free insulating structure that electrically insulates the first electrode layers, and applying an electrically conductive material over the solvent-free insulating structure to form the second contacting structure that contacts each second electrode layer.

A method for producing a multi-layer electrode system includes providing a carrier substrate having a recess in a top side of the carrier substrate. At least one wall of the recess is inclined in relation to a bottom side of the carrier substrate, which is opposite to the top side. The method also includes applying a multi-layer stack, which includes at least a first electrode layer, a second electrode layer, and a piezoelectric layer arranged between the first electrode layer and the second electrode layer, to the top side of the carrier substrate. At least the wall and a bottom of the recess are covered by at least a portion of the multi-layer stack.

A method can be used for producing a fully active stack. A stack has the sides A, B, C and D running along the stacking direction. The method includes combining and temporarily making contact with the internal electrodes that make contact with the respective side on one of the sides B or D, such that the internal electrodes that make contact with the respective side can be electrically driven selectively. The electrically driven internal electrodes are electrochemically coated on the sides A and C. The stack is singulated to form a fully active stack with the electrochemically coated internal electrodes on the sides A and C. A method for producing a multilayer component comprising the fully active stack and a fully active multilayer component producible according to the method are furthermore proposed.

A multilayer piezoelectric element includes a ceramic body formed by a piezoelectric ceramic, and having first and second end face facing a longitudinal direction, first and second principal faces facing a thickness direction perpendicular to the longitudinal direction. A pair of external electrodes cover the first and second end faces, extend from the first and second end faces onto the first principal face via ridge parts connecting the end faces with the principal faces, and project in the thickness direction on the first principal face. Multiple internal electrodes are stacked inside the ceramic body and are connected alternately to the pair of external electrodes along the thickness direction. A surface electrode is provided on at least one of the first and second principal faces, and connected to the external electrode different from the one to which the internal electrode adjacent in the thickness direction is connected.

The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, bonding wires, an ultrasonic probe, and packaging material. The control chip is arranged on the substrate. The control chip is connected to the substrate by the bonding wires using a wire bonding technology. The ultrasonic probe is arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The pair of external electrodes cover a pair of end faces and extend from the pair of end faces along a pair of principal faces and a pair of side faces. The multiple internal electrodes are stacked inside the ceramic base body along the thickness direction, and are connected alternately to one or the other of the pair of external electrodes along the thickness direction. The surface electrodes extend from the pair of external electrodes along the pair of principal faces, and are each divided in the longitudinal direction at a position near, of the pair of external electrodes, the external electrode to which the internal electrode adjacent to the principal face is connected.

A manufacturing method for an ultrasonic fingerprint sensor is provided. The method may include: preparing a sintered ceramic element under incomplete sintering conditions; forming a processed ceramic element by cutting a first surface of the sintered ceramic element along a first direction in pre-designated intervals up to such a depth that leaves a remainder region at a second surface and cutting the second surface of the sintered ceramic element along a second direction perpendicular to the first direction in pre-designated intervals up to such a depth that leaves a remainder region at the first surface; sintering the processed ceramic element under complete sintering conditions; filling an insulation material into troughs formed in the processed ceramic element by the cutting processes; and polishing the first surface and second surface to remove the remainder regions such that piezoelectric rods are exposed while arranged in an array form.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The ceramic base body is formed by a piezoelectric ceramic. The pair of external electrodes cover a pair of end faces. The multiple internal electrodes are stacked inside the ceramic base body along a thickness direction crossing at right angles with a longitudinal direction, and connected alternately to the pair of external electrodes in the thickness direction. The surface electrodes are provided on a pair of principal faces, respectively, and are each connected to the external electrode different from the one to which the internal electrode adjacent in the thickness direction is connected. The pair of external electrodes have a higher porosity than the surface electrodes.