Patent classifications
H01L41/083
Bumpless build-up layer package with pre-stacked microelectronic devices
The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of fabricating microelectronic packages, wherein a first microelectronic device having through-silicon vias may be stacked with a second microelectronic device and used in a bumpless build-up layer package.
BAW component, lamination for a BAW component, and method for manufacturing a BAW component
A BAW component, a lamination for a BAW component, and a method for manufacturing a BAW component are provided. A lamination for a BAW component includes a first layer with a first piezoelectric material and a second layer with a second piezoelectric material that is different than the first piezoelectric material. The first and the second piezoelectric material can be Sc doped AlN and AlN, respectively.
Ultrasound vibration device, method of manufacturing ultrasound vibration device, and ultrasound medical apparatus
An ultrasound vibration device is provided with a stacked transducer in which a plurality of piezoelectric single crystal element layers are stacked between two metal blocks. Since each of the two metal blocks and the plurality of piezoelectric single crystal element layers is fusion-bonded relative to a stack direction by bonding metal having a melting point corresponding to half a Curie point of the plurality of piezoelectric single crystal element layers or below, it is possible to use non-lead material, reduce a processing cost and realize inexpensiveness.
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
A multilayer ceramic electronic component is provided in which wet spreading of a metal bump material can be suppressed and a position of the metal bump can be controlled with high accuracy. The multilayer ceramic electronic component includes a ceramic body having first and second main surfaces and first to fourth lateral surfaces between the main surfaces. Moreover, first and second opposing internal electrodes are provided inside the ceramic body and led out to one or more of the second lateral surfaces. A first electrode is provided on the first main surface and contains a ceramic material and a first external electrode that is connected to the first internal electrode, extends on the first electrode. In addition, a second external electrode is connected to the second internal electrode and extends onto the first main surface.
Piezoelectric sensor
The present invention provides a piezoelectric sensor that has elastic properties in a surface direction thereof, and can smoothly follow stretching of a body to be measured to accurately measure movement of the body to be measured, and detect movement in a surface direction of a surface of the body to be measured on which the piezoelectric sensor is disposed. The piezoelectric sensor of the present invention includes: a piezoelectric sheet including a porous synthetic resin sheet; a signal electrode layer that is layered on a surface of the piezoelectric sheet and contains conductive fine particles and a binder resin having elastic properties; and a ground electrode layer that is layered on another surface of the piezoelectric sheet and contains conductive fine particles and a binder resin having elastic properties.
Method for inspecting piezoelectric element
Provided is a method for inspecting a piezoelectric element in which voltage is applied to a piezoelectric element and evaluation of the electrical characteristics of the piezoelectric element is performed. The method includes a first step in which the piezoelectric element is held on a flat plate-shaped slightly adhesive sheet and a second step in which voltage is applied to the piezoelectric element held on the slightly adhesive sheet and evaluation of the electrical characteristics of the piezoelectric element is performed.
ULTRASONIC TRANSDUCER TECHNIQUES FOR ULTRASONIC SURGICAL INSTRUMENT
A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.
Multi-Layer Shear Mode PZT Microactuator for a Disk Drive Suspension, and Method of Manufacturing Same
A microactuator for a suspension is described. The microactuator includes a multi-layer PZT device having a first face and an opposite second face. Each layer of the multi-layer PZT device is configured to operate in its d15 mode when actuated by an actuation voltage. The layers are configured as a stack such that each layer is configured to act in the same direction when actuated such that the first face moves in shear relative to the second face.
THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF
A manufacturing method of an epitaxial thin film piezoelectric element includes: providing a substrate; forming a bottom electrode layer on the substrate by epitaxial growth process; forming a first piezoelectric layer that has c-axis orientation on the bottom electrode layer by epitaxial growth process; forming a second piezoelectric layer that has c-axis orientation and different phase structure from the first piezoelectric layer on the first piezoelectric layer by epitaxial growth process; and forming a top electrode layer on the second piezoelectric layer. The thin film piezoelectric element has good thermal stability, low temperature coefficient and high piezoelectric constant.
Fingerprint recognition module, driving method thereof, manufacturing method thereof and display device
The present disclosure provides a fingerprint recognition module, a driving method thereof, a manufacturing method thereof, and a display device. The fingerprint recognition module includes a receiving electrode layer, a piezoelectric material layer, and a driving electrode layer. The receiving electrode layer includes a plurality of receiving electrodes arranged in an array along a first direction and a second direction. The piezoelectric material layer is disposed on a side of the receiving electrode layer. The driving electrode layer is disposed on a side of the piezoelectric material layer remote from the receiving electrode layer and includes a plurality of driving electrodes arranged along the second direction. Each driving electrode is a strip electrode extending along the first direction, and overlaps with multiple receiving electrodes arranged along the first direction.