H01L41/047

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
20170338397 · 2017-11-23 ·

A multilayer ceramic electronic component is provided in which wet spreading of a metal bump material can be suppressed and a position of the metal bump can be controlled with high accuracy. The multilayer ceramic electronic component includes a ceramic body having first and second main surfaces and first to fourth lateral surfaces between the main surfaces. Moreover, first and second opposing internal electrodes are provided inside the ceramic body and led out to one or more of the second lateral surfaces. A first electrode is provided on the first main surface and contains a ceramic material and a first external electrode that is connected to the first internal electrode, extends on the first electrode. In addition, a second external electrode is connected to the second internal electrode and extends onto the first main surface.

BACKING MEMBER
20170338398 · 2017-11-23 ·

A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the leads includes a wiring portion, and a terminal portion connected to one end of the wiring portion. A width dimension and a depth dimension of the wiring portion are smaller than a width dimension and a depth dimension of the terminal portion, and an interval between adjacent ones of the wiring portions of the leads is wider than an average particle size of the filler.

ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME

An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.

ULTRASONIC TRANSDUCER OPERABLE IN A SURFACE ACOUSTIC WAVE (SAW) MODE
20170326590 · 2017-11-16 · ·

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

OPERATION OF AN ULTRASONIC SENSOR

In a method of using an ultrasonic sensor comprising a two-dimensional array of ultrasonic transducers, a plurality of ultrasonic signals are transmitted according to a beamforming pattern at a position of the two-dimensional array. The beamforming pattern focuses the plurality of ultrasonic signals to location above the two-dimensional array, wherein the beamforming pattern identifies ultrasonic transducers of the two-dimensional array that are activated during transmission of the ultrasonic signals, and wherein at least some ultrasonic transducers of the beamforming pattern are phase delayed with respect to other ultrasonic transducers of the beamforming pattern. At least one reflected ultrasonic signal is received at the position according to a receive pattern, wherein the receive pattern identifies at least one ultrasonic transducers of the two-dimensional array that is activated during the receiving. The transmitting and the receiving are repeated at a plurality of positions of the two-dimensional array.

MULTILAYER FUNCTIONAL FIBER AND METHOD OF MAKING

A method is provided for making a multilayer functional fiber, where the method includes: providing a scaffold fiber; disposing a first electrode layer enclosing the scaffold fiber; disposing a functional layer enclosing the first electrode layer, the functional layer having a functional characteristic varying as a function of longitudinal position along the functional layer; disposing a second electrode layer enclosing the functional layer; and disposing a cladding layer enclosing the second electrode layer. In another aspect, a multilayer functional fiber is provided produced by, for instance, the above-noted method.

Piezoelectric sensor

The present invention provides a piezoelectric sensor that has elastic properties in a surface direction thereof, and can smoothly follow stretching of a body to be measured to accurately measure movement of the body to be measured, and detect movement in a surface direction of a surface of the body to be measured on which the piezoelectric sensor is disposed. The piezoelectric sensor of the present invention includes: a piezoelectric sheet including a porous synthetic resin sheet; a signal electrode layer that is layered on a surface of the piezoelectric sheet and contains conductive fine particles and a binder resin having elastic properties; and a ground electrode layer that is layered on another surface of the piezoelectric sheet and contains conductive fine particles and a binder resin having elastic properties.

PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC THIN FILM TRANSFER PROCESS
20220352863 · 2022-11-03 ·

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.

POROUS PIEZOELECTRIC MATERIAL WITH DENSE SURFACE, AND ASSOCIATED METHODS AND DEVICES
20170317269 · 2017-11-02 ·

A method for producing a porous piezoelectric polymer film with a dense surface, includes depositing a polymer solution onto a substrate to form a polymer film including a solvent; evaporating a portion of the solvent to form the dense surface away from the substrate; forming water droplets in interior of the polymer film; and substantially evaporating the water droplets and remaining solvent to form porous interior. A piezoelectric composition includes a piezoelectric material with a porous interior and a dense surface for interfacing with an electrode. A piezoelectric device includes a first electrode; a porous piezoelectric film with a dense surface and porous interior, wherein the porous piezoelectric film is deposited on the first electrode and the dense surface is away from the first electrode; and a second electrode deposited on the dense surface for, together with the first electrode, providing an electrical interface for the porous piezoelectric film.

PIEZOELECTRIC DEVICE

A piezoelectric device includes a substrate that is flexible and thermally deformable, and a composite piezoelectric body disposed on the substrate. Output in accordance with deformation of the composite piezoelectric body is obtained. The composite piezoelectric body includes a piezoelectric layer containing an organic binder containing piezoelectric particles, a first electrode layer stacked on a first surface side of the piezoelectric layer, and a second electrode stacked on a second surface side of the piezoelectric layer. The substrate is insert molded and integrated with a molded resin body having a curved shape.