A semiconductor device is disclosed, which includes: at least one device layer being a crystallized layer for example including: a superlattice layer and/or a layer of group III-V semiconductor materials; and a passivation structure comprising one or more layers wherein at least one layer of the passivation structure is a passivation layer grown in-situ in a crystallized form on top of the device layer, and at least one of the one or more layers of the passivation structure includes material having a high density of surface states which forces surface pinning of an equilibrium Fermi level within a certain band gap of the device layer, away from its conduction and valence bands.

Disclosed are minority carrier based mercury-cadmium telluride (HgCdTe) infrared detectors and arrays, and methods of making, are disclosed. The constructions provided by the invention enable the detectors to be used at higher temperatures, and/or be implemented on less expensive semiconductor substrates to lower manufacturing costs. An exemplary embodiment a substrate, a bottom contact layer disposed on the substrate, a first mercury-cadmium telluride layer having a first bandgap energy value disposed on the bottom contact layer, a second mercury-cadmium telluride layer having a second bandgap energy value that is greater than the first bandgap energy value disposed on the first mercury-cadmium telluride layer, and a collector layer disposed on the second mercury-cadmium telluride layer, wherein the first and second mercury-cadmium telluride layers are each doped with an n-type dopant.

Embodiments relate to photodetectors comprising: a substrate and a bulk-alloy infrared (IR) photo absorption layer disposed on the substrate to absorb photons in an infrared wavelength and having a graded section and an ungraded section. The photodetector comprises a unipolar barrier layer disposed on the bulk-alloy photo absorption layer. The graded section includes a graded alloy composition such that its energy bandgap is largest near the substrate and smallest near the unipolar barrier layer. The embodiments also relate to methods fabricating the photodetectors.

According to an aspect, a detection device includes a plurality of optical sensors arranged on a substrate. Each of the optical sensors includes a first photodiode and a second photodiode that is coupled in series and in an opposite direction to the first photodiode.

An electronic device can include a housing defining an aperture and at least partially defining an internal volume of the electronic device, an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the internal volume, and an optical component disposed in the aperture. The optical component can include a first and second transparent portions disposed above the electromagnetic radiation detector and the electromagnetic radiation emitter, and an opaque portion disposed between the first and second transparent portions and extending a thickness of the optical component. The first transparent portion, the second transparent portion, and the opaque portion can define a flush exterior surface of the electronic device.

A radiation detector includes a stack of layers along a direction Z, the stack comprising: an absorbent layer, a first contact layer, an assembly consisting of at least one intermediate layer, referred to as an intermediate assembly, an upper layer, the first contact layer and the upper layer having a plurality of detection zones and separation zones, a detection zone corresponding to a pixel of the detector, a passivation layer made from a dielectric material, arranged on the upper layer and having openings at the level of the detection zones of the upper layer, the semiconductor layers of the stack being compounds based on elements of groups IIIA and VA of the periodic table of the elements, the second material comprising the VA element antimony and the third material not comprising the VA element antimony.

A graphene device and a method of operating the same are provided. The graphene device includes: an active layer including a plurality of meta atoms spaced apart from each other, each of the meta atoms having a radial shape, and a graphene layer that contacts each of the plurality of meta atoms; and a dielectric layer covering the active layer.

An method for automatically testing an arc flash detection system by periodically or continually transmitting electro-optical (EO) radiation through one or more transmission cables electro-optically coupled to respective EO radiation collectors. A test EO signal may pass through the EO radiation collector to be received by an EO sensor. An attenuation of the EO signal may be determined by comparing the intensity of the transmitted EO signal to an intensity of the received EO signal. A self-test failure may be detected if the attenuation exceeds a threshold. EO signals may be transmitted according to a particular pattern (e.g., a coded signal) to allow an arc flash detection system to distinguish the test EO radiation from EO radiation indicative of an arc flash event.

A radiation tolerant optical detection element includes: a p-type base-body region; a gate insulating film provided on an upper surface of the base-body region; an n-type buried charge-generation region buried in an upper portion of the base-body region; an n-type charge-readout region buried in an upper portion of the base-body region on the inner-contour side of the buried charge-generation region; an n-type reset-drain region buried on the inner-contour side of the charge-readout region; a transparent electrode provided on the gate insulating film above the buried charge-generation region; and a reset-gate electrode provided on a portion of the gate insulating film between the charge-readout region and the reset-drain region.

Bias-switchable dual-band infrared detectors and methods of manufacturing such detectors are provided. The infrared detectors are based on a back-to-back heterojunction diode design, where the detector structure consists of, sequentially, a top contact layer, a unipolar hole barrier layer, an absorber layer, a unipolar electron barrier, a second absorber, a second unipolar hole barrier, and a bottom contact layer. In addition, by substantially reducing the width of one of the absorber layers, a single-band infrared detector can also be formed.