The present disclosure provides a semiconductor structure and a method of manufacturing the same. The semiconductor structure includes a sensing device, a solar cell, and an interconnecting structure. The solar cell is disposed above the sensing device and is electrically connected to the sensing device. The interconnecting structure is disposed between the sensing device and the solar cell and has a first surface facing the solar cell and a second surface facing the sensing devices. The interconnecting structure comprises a first energy storage component and a second energy storage component. The first energy storage component is disposed closer to the first surface of the interconnecting structure than the second energy storage component.

A method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: having a first wafer having solar cell structures on a starting substrate and a second wafer having drive circuits formed, so that either one of the first wafer or the second wafer has a plurality of independent diode circuits and capacitor-function laminated portions; obtaining a bonded wafer by bonding so that the solar cell structures, the diode circuits, the capacitor-function laminated portions, and the drive circuits are superimposed; wiring; and dicing the bonded wafer; thus creating a method for producing an electronic device including a drive circuit, a solar cell structure, and a capacitor-function portion in one chip and having a suppressed production cost; and such an electronic device.

A method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: having a first wafer having solar cell structures on a starting substrate and a second wafer having drive circuits formed, so that either one of the first wafer or the second wafer has a plurality of independent diode circuits and capacitor-function laminated portions; obtaining a bonded wafer by bonding so that the solar cell structures, the diode circuits, the capacitor-function laminated portions, and the drive circuits are superimposed; wiring; and dicing the bonded wafer; thus creating a method for producing an electronic device including a drive circuit, a solar cell structure, and a capacitor-function portion in one chip and having a suppressed production cost; and such an electronic device.

An augmented reality system can include a waveguide having an edge surface that extends between opposing light-guiding surfaces. The waveguide can guide light toward the edge surface. The waveguide can include a reflectivity-reducing film, such as an absorptive film or a photovoltaic film, disposed on the edge surface. To form the reflectivity-reducing film, curable material can be disposed onto a dissolvable film. The curable material can be cured while disposed on the dissolvable film such that the cured material forms a reflectivity-reducing structure on the dissolvable film. The dissolvable film can be dissolved such that the reflectivity-reducing structure remains intact as a reflectivity-reducing film that can be adhered to the edge surface, such as with a primer layer. The edge surface can include nanostructures, sized smaller than half a wavelength of the guided light, that can reduce a reflectivity of the edge surface.

An augmented reality system can include a waveguide having an edge surface that extends between opposing light-guiding surfaces. The waveguide can guide light toward the edge surface. The waveguide can include a reflectivity-reducing film, such as an absorptive film or a photovoltaic film, disposed on the edge surface. To form the reflectivity-reducing film, curable material can be disposed onto a dissolvable film. The curable material can be cured while disposed on the dissolvable film such that the cured material forms a reflectivity-reducing structure on the dissolvable film. The dissolvable film can be dissolved such that the reflectivity-reducing structure remains intact as a reflectivity-reducing film that can be adhered to the edge surface, such as with a primer layer. The edge surface can include nanostructures, sized smaller than half a wavelength of the guided light, that can reduce a reflectivity of the edge surface.