H01L41/273

Method for producing piezoelectric multi-layered components
10686121 · 2020-06-16 · ·

The present invention relates to a method for producing piezoelectric multi-layered components (2), which comprises the following steps: applying an electrode material (5) to green sheets (3) containing a piezoelectric material, applying a layer of a first auxiliary material (9) to at least one green sheet (3) containing the piezoelectric material, forming a stack (1), in which the green sheets (3), to which electrode material (5) is applied, are arranged one on top of another, wherein at least one ply of the green sheet (3), to which the layer of the first auxiliary material (9) is applied, is arranged in the stack (1), sintering the stack (1), wherein the layer of the first auxiliary material (9) is thinned, and firing the stack (1), wherein the stack (1) is singulated along the at least one ply into at least two multi-layered components (2).

Method for producing ceramic multi-layer components

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

PIEZOELECTRIC COMPONENT, SENSOR, AND ACTUATOR
20200176668 · 2020-06-04 ·

A piezoelectric component that has a piezoelectric element including a piezoelectric ceramic layer and a sintered metal layer on at least a first main surface of the piezoelectric ceramic layer and containing a non-precious metal, and a protective layer containing an elastic body covering first and second opposed main surfaces of the piezoelectric element. The piezoelectric ceramic layer contains 90 mol % or more of a perovskite compound that contains niobium, an alkali metal, and oxygen. A thickness of the piezoelectric element is 100 m or less.

PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, AND ELECTRONIC EQUIPMENT

A piezoelectric material includes: an oxide containing Na, Ba, Nb, Ti, and Mn, in which the oxide has a perovskite-type structure, a total amount of metal elements other than Na, Ba, Nb, Ti, and Mn contained in the piezoelectric material is 0.5 mol % or less with respect to a total amount of Na, Ba, Nb, Ti, and Mn, a molar ratio x of Ti to a total molar amount of Nb and Ti is 0.05x0.12, a molar ratio y of Na to Nb is 0.93y0.98, a molar ratio z of Ba to Ti is 1.09z1.60, a molar ratio m of Mn to the total molar amount of Nb and Ti is 0.0006m0.0030, and 1.07yz1.50 is satisfied.

PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, AND ELECTRONIC EQUIPMENT

Provided is a lead-free piezoelectric material reduced in dielectric loss tangent, and achieving both a large piezoelectric constant and a large mechanical quality factor. A piezoelectric material according to at least one embodiment of the present disclosure is a piezoelectric material including a main component formed of a perovskite-type metal oxide represented by the general formula (1): Na.sub.x+s(1y)(Bi.sub.wBa.sub.1sw).sub.1yNb.sub.yTi.sub.1yO.sub.3 (where 0.84x0.92, 0.84y0.92, 0.002(w+s)(1y)0.035, and 0.9w/s1.1), and a Mn component, wherein the content of the Mn is 0.01 mol % or more and 1.00 mol % or less with respect to the perovskite-type metal oxide.

PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, AND ELECTRONIC EQUIPMENT

A lead-free piezoelectric material includes perovskite-type metal oxide containing Na, Nb, Ba, Ti, and Mg and indicates excellent piezoelectric properties. The piezoelectric material satisfies the following relational expression (1): 0.430a0.460, 0.433b0.479, 0.040c0.070, 0.0125d0.0650, 0.0015e0.0092, 0.93ecd1.13e, a+b+c+d+e=1, where a, b, c, d, and e denote the relative numbers of Na, Nb, Ba, Ti, and Mg atoms, respectively.

Methods of Forming Group III Piezoelectric Thin Films Via Removal of Portions of First Sputtered Material

A method of forming a piezoelectric thin film includes sputtering a first surface of a substrate to provide a piezoelectric thin film comprising AlN, AlScN, AlCrN, HfMgAlN, or ZrMgAlN thereon, processing a second surface of the substrate that is opposite the first surface of the substrate to provide an exposed surface of the piezoelectric thin film from beneath the second surface of the substrate, wherein the exposed surface of the piezoelectric thin film includes a first crystalline quality portion, removing a portion of the exposed surface of the piezoelectric thin film to access a second crystalline quality portion that is covered by the first crystalline quality portion, wherein the second crystalline quality portion has a higher quality than the first crystalline quality portion and processing the second crystalline quality portion to provide an acoustic resonator device on the second crystalline quality portion.

Hard PZT Ceramic, Piezoelectric Multilayer Component and Method for Producing a Piezoelectric Mulitlayer Component

A hard lead zirconate titanate (PZT) ceramic has an ABO.sub.3 structure with A sites and B sites. The PZT ceramic is doped with Mn and with Nb on the B sites and the ratio Nb/Mn is <2. A piezoelectric multilayer component having such a PZT ceramic and also a method for producing a piezoelectric multilayer component are also disclosed.

Stacked piezoelectric ceramic element

The present invention relates to a stacked piezoelectric ceramic element and can provide a stacked piezoelectric ceramic element produced by stacking two or more ceramic green sheets, the stacked piezoelectric ceramic element having a structure in which a ceramic porous or defective part constituting the stacked piezoelectric ceramic element is impregnated with an organic resin, thereby improving waterproof performance capable of preventing the deterioration of insulation resistance in a highly humid environment.

Method for manufacturing multilayer components, and multilayer component
10608161 · 2020-03-31 · ·

A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.