Patent classifications
H01L41/273
MULTILAYER PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATION APPARATUS, AND ELECTRONIC DEVICE
In an embodiment, a multilayer piezoelectric element includes a multilayer piezoelectric body and multiple internal electrodes. The multilayer piezoelectric body has a pair of principal faces in a first-axis direction, a pair of end faces in a second-axis direction crossing at right angles with the first-axis direction and defining the longitudinal direction, and a pair of side faces in a third-axis direction crossing at right angles with the first-axis direction and second-axis direction. The multiple internal electrodes are placed inside the multilayer piezoelectric body and stacked in the first-axis direction. Among the multiple internal electrodes, a center internal electrode placed at the center part of the multilayer piezoelectric body is such that its first cross-sectional shape, as viewed from the third-axis direction, has undulations greater than the undulations of the second cross-sectional shape of the center internal electrode as viewed from the second-axis direction.
Method for producing an electric component and electric component
A method for producing an electric component (19) is specified, wherein in a step A) a body (1) having at least one cavity (7, 8) is provided. In a step B), the cavity (7, 8) is at least partly filled with a liquid insulation material (13) by means of capillary forces. Furthermore, an electric component (19) is specified wherein a cavity (7, 8) is at least partly filled with an insulation material (13). The insulation material (13) is introduced into the cavity (7, 8) by means of capillary forces. Furthermore, an electric component (19) is specified wherein a cavity (7, 8) is at least partly filled with an organic insulation material (13) and wherein the cavity is at least partly covered by a fired external contacting (17, 18).
PIEZOELECTRIC ELEMENT, VIBRATOR, VIBRATION WAVE MOTOR, OPTICAL DEVICE, AND ELECTRONIC DEVICE
A piezoelectric element, in which a piezoelectric material layer has a plurality of crystal particles and a plurality of void portions and, in at least one of two or more of the piezoelectric material layers, when the average thickness in the lamination direction of the piezoelectric material layer is defined as T.sub.P, the average circle-equivalent diameter of the plurality of crystal particles is defined as D.sub.G, the maximum length in the lamination direction of the plurality of void portions not contacting the electrode layers is defined as L.sub.V, and the average thickness of the electrode layers contacting the at least one piezoelectric material layer is defined as T.sub.E, 0.07T.sub.PD.sub.G0.33T.sub.P and T.sub.EL.sub.V0.3T.sub.P are established and the lead content is less than 1000 ppm.
Method of manufacturing a multi-layer PZT microactuator using wafer-level processing
A multi-level piezoelectric actuator is manufactured using wafer level processing. Two PZT wafers are formed and separately metallized for electrodes. The metallization on the second wafer is patterned, and holes that will become electrical vias are formed in the second wafer. The wafers are then stacked and sintered, then the devices are poled as a group and then singulated to form nearly complete individual PZT actuators. Conductive epoxy is added into the holes at the product placement step in order to both adhere the actuator within its environment and to complete the electrical via thus completing the device. Alternatively: the first wafer is metallized; then the second wafer having holes therethrough but no metallization is stacked and sintered to the first wafer; and patterned metallization is applied to the second wafer to both form electrodes and to complete the vias. The devices are then poled as a group, and singulated.
Method for producing an electric contact connection of a multilayer component
A method for producing an electric contact-connection of a multilayer component is disclosed. In an embodiment, the method includes providing a main body of the multilayer component having internal electrode layers, applying an electrically conductive material and applying a photosensitive material on the electrically conductive material. The method further includes structuring the electrically conductive material via the photosensitive material such that the internal electrode layers alternatingly are covered and uncovered by the electrically conductive material and applying an insulating material after structuring the electrically conductive material such that the internal electrode layers are alternatingly covered by the electrically conductive material and by the insulating material.
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.
INTERDIGITATED ELECTRODE PATTERNED MULTI-LAYERED PIEZOELECTRIC LAMINATE STRUCTURE
An interdigitated electrode patterned multi-layered piezoelectric laminate structure is provided, which comprises: N vertically stacked piezoelectric stacks (N is the integer of 2 or above); wherein the each piezoelectric stack comprises: a piezoelectric sheet; a top electrode pattern on a top of the piezoelectric sheet; and a bottom electrode pattern on a bottom of the piezoelectric sheet, wherein each of the top and bottom electrode patterns has first and second sub-electrode patterns, wherein the first and second sub-electrode patterns are electrically insulated from each other, wherein the first and second sub-electrode patterns are horizontally interdigitated with each other, wherein the first sub-electrode patterns of the top and bottom electrode patterns vertically overlap with each other, wherein the second sub-electrode patterns of the top and bottom electrode patterns vertically overlap with each other, wherein the bottom electrode of the Nth piezoelectric stack is the top electrode of the N-1th piezoelectric stack.
PIEZO-ELECTRIC ACTUATORS
There is provided a piezo-electric actuator comprising an assembly comprising a first electrode, a second electrode, and at least one piezoelectric layer located between said first electrode and said second electrode, wherein at least one of the first electrode and the second electrode is split into at least two different sub-electrodes, wherein at least part of the assembly is configured to move along an axis perpendicular to a surface of the assembly, in response to an electrical stimulus applied to at least one of said first and second electrodes.
PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, AND ELECTRONIC APPARATUS
The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80?x?0.94 and 0.83?y?0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.
Multilayer piezoelectric ceramic electronic component and method for manufacturing multilayer piezoelectric ceramic electronic component
A multilayer sintered body having alternately stacked Ni-based inner electrodes and piezoelectric ceramic layers. The piezoelectric ceramic layers contain a main ingredient of a perovskite compound containing Nb, K, Na, and Li, at least one element M1 selected from Nd and Dy, and at least one element M2 selected from Ga and Al. The element M2 content is 0.071 parts by mole or less per 1 part by mole of the Nb in a solution obtained through a dissolution process. This multilayer piezoelectric ceramic electronic component is manufactured through the cofiring of conductive films as a precursor of the inner electrodes and ceramic green sheets as a precursor of the piezoelectric ceramic layers in a reducing atmosphere in which the oxidation of Ni is inhibited.