Patent classifications
H10F10/146
SOLAR CELL AND METHOD FOR FORMING THE SAME
A method for manufacturing a solar cell, the method comprising providing a substrate, arranging a passivation region on a surface of the substrate and arranging a collector layer on a surface of the passivation region, the step of arranging the passivation region comprises; depositing a first passivation layer on the surface of the substrate using a first gas; and, depositing a second passivation layer onto the surface of the first passivation layer using a second gas; wherein the first and second gases each comprise hydrogen gas and a silicon-based gas, wherein the ratio of hydrogen gas to silicon-based gas of the second gas is up to 2.5, and at least 0.4, times the ratio of hydrogen gas to silicon-based gas of the first gas.
Solar cells having hybrid architectures including differentiated p-type and n-type regions with offset contacts
A solar cell, and methods of fabricating said solar cell, are disclosed. The solar cell can include a first emitter region over a substrate, the first emitter region having a perimeter around a portion of the substrate. A first conductive contact is electrically coupled to the first emitter region at a location outside of the perimeter of the first emitter region.
Solar cell and photovoltaic module
Provided is a solar cell and a photovoltaic module. The solar cell includes a silicon substrate, and the silicon substrate includes a front surface and a back surface arranged opposite to each other. P-type conductive regions and N-type conductive regions are alternately arranged on the back surface of the silicon substrate. Front surface field regions are located on the front surface of the silicon substrate and spaced from each other. The front surface field regions each corresponds to one of the P-type conductive regions or one of the N-type conductive regions. At least one front passivation layer is located on the front surface of the silicon substrate. At least one back passivation layer is located on surfaces of the P-type conductive regions and N-type conductive regions.
ROLL-TO-ROLL METALLIZATION OF SOLAR CELLS
Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.
PHOTOVOLTAIC MODULE
Disclosed is a photovoltaic module (1,2) comprising several serially connected IBC solar cells (100,200,300), wherein each IBC solar cell (100,200,300) has an electrode structure (110,210,310) comprising both a P-type contact electrode structure including at least one P-busbar (112,114,212, 214,312,314) and an N-type electrode structure including at least one N-busbar (116,118,216,218,316,318), wherein at least two of the IBC solar cells (100,200,300) are arranged relative to each other in a partly overlapping manner so that a first region of a back side of a first IBC solar cell (100) is arranged on top of a first region of a front side of a second IBC solar cell (200) and thus creates an overlap region (10,20), wherein at least sections of both the at least one P-busbar (112,114,212,214,312,314) and the at least one N-busbar (116,118,216,218,316,318) of the electrode structure of said first IBC solar cell (100) are located outside of the overlap region (10,30).
SOLAR CELL, PREPARATION METHOD THEREOF, AND PHOTOVOLTAIC MODULE
The present disclosure relates to a solar cell, a preparation method thereof, and a photovoltaic module. The solar cell includes a semiconductor substrate, passivating contact structures, a dielectric layer, and first electrodes. The semiconductor substrate includes a first surface and a second surface opposite to each other. The semiconductor substrate includes passivation regions and passivated contact regions, which are alternately arranged along a first direction. The first direction is perpendicular to a thickness direction of the semiconductor substrate. The passivating contact structures are disposed on the second surface and correspondingly disposed on the passivated contact regions. Each passivating contact structure includes an electrically conductive passivation layer. The dielectric layer at least covers the second surface in the passivation regions. The first electrodes are disposed on the passivating contact structures at a side away from the semiconductor substrate. Each passivating contact structure is provided with at least one first electrode.
Trench process and structure for backside contact solar cells with polysilicon doped regions
A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. A trench structure separates the P-type doped region from the N-type doped region. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. The trench structure may include a textured surface for increased solar radiation collection. Among other advantages, the resulting structure increases efficiency by providing isolation between adjacent P-type and N-type doped regions, thereby preventing recombination in a space charge region where the doped regions would have touched.
Emitter wrap-through solar cell and method of preparing the same
The present invention relates to an emitter wrap-through solar cell and a method for preparing the same. The solar cell according to the present invention has a structure that may minimize generation of leakage current and minimize energy conversion efficiency measurement error. And, the preparation method of a solar cell according to the present invention may easily confirm the alignment state of the electrode, and thus, provide more improved productivity.
FIRING METAL WITH SUPPORT
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a paste, a first metal, and a first conductive portion that includes a conductive alloy formed from the first metal at an interface of the substrate and the semiconductor region.
Method for fabricating a solar module of rear contact solar cells using linear ribbon-type connector strips and respective solar module
A solar module and a method for fabricating a solar module comprising a plurality of rear contact solar cells are described. Rear contact solar cells (1) are provided with a large size of e.g. 156156 mm.sup.2. Soldering pad arrangements (13, 15) applied on emitter contacts (5) and base contacts (7) are provided with one or more soldering pads (9, 11) arranged linearly. The soldering pad arrangements (13, 15) are arranged asymmetrically with respect to a longitudinal axis (17). Each solar cell (1) is then separated into first and second cell portions (19, 21) along a line (23) perpendicular to the longitudinal axis (17). Due to such cell separation and the asymmetrical design of the soldering pad arrangements (13, 15), the first and second cell portions (19, 21) may then be arranged alternately along a line with each second cell portion (21) arranged in a 180-orientation with respect to the first cell portions (19) and such that emitter soldering pad arrangements (13) of a first cell portion (19) are aligned with base soldering pad arrangements (15) of neighboring second cell portions (21), and vice versa. Simple linear ribbon-type connector strips (25) may be used for interconnecting the cell portions (19, 21) by soldering onto the underlying aligned emitter and base soldering pad arrangements (13, 15). The interconnection approach enables using standard ribbon-type connector strips (25) while reducing any bow as well as reducing series resistance losses.