A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.

The optical film with a pressure sensitive adhesive on both sides includes a first pressure sensitive adhesive layer having a thickness of 3 μm to 30 μm on first main surface of an optical film, and a second pressure sensitive adhesive layer having a thickness of 50 μm or more on second main surface of the optical film. A first protective sheet and a second protective sheet are releasably attached on the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, respectively. The residual stress of the second pressure sensitive adhesive layer S.sub.2 (N/cm.sup.2), the thickness of the first protective sheet Y (μm); and the thickness of the second protective sheet Z (μm) satisfy the following relationship: 20≦Y≦80; 45≦Z; and Y+0.17 Z+10.6 S.sub.2≧63.

The invention relates to an adhesive tape comprising an adhesive tape comprising a layer A comprising at least one anisotropic tape, wherein said tape comprises ultrahigh molecular weight polyethylene; and a layer B comprising a first adhesive being a pressure sensitive adhesive, wherein layer A covers at least 60% of the surface area of layer B. The invention also relates to the use of said adhesive tape in different applications.

Provided are a surface protection film which would stably display an image, and would stably attain a mirror state, and which would be stably operated without inhibiting display operability.

Disclosed is a surface protection film including a resin film and a pressure-sensitive adhesive layer, in which the relative permittivity of the resin film is of 1.0 to 5.0, the reflectance is set to a value within the range of 20% to 80%, and the transmittance for light is of 20% to 80%.

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application.

A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.014 by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.

The invention relates to a novel, reactive 2-component adhesive system, preferably in film form, for adhering diverse materials, such as for example, metal, wood, glass and/or plastic.

Crosslinked pressure-sensitive adhesives (PSAs) based on polymers of branched macromolecules each comprising a main chain and one or more sidechains pendent to the main chain, the constitutional units thereof originating from a) X wt % of one or more acrylic and/or methacrylic esters, with 80<=X<=99.5; b) Y wt % of radically copolymerizable monomers having at least one acid function, with 0.5<=Y<=15; c) Z wt % of vinyl compounds, with 0<=Z<=5, at least one sidechain pendent to the main chain having a number-average molar mass >=1000 g/mol, and the respective amounts of constitutional units originating from a), b) and c) can be the same in each case or differ by not more than 1%, and where a), b) and c) may in each case be the same or different monomers, have detachment properties which can be set independently of one another.

A pressure-sensitive adhesive tape that uses, as a plasticizer, an alternative compound to bis(2-ethylhexyl) phthalate (DOP) and dibutyl phthalate (DBP), having excellent tackiness, and can be unwound satisfactorily, where DOP and DBP are to be restricted under the REACH regulation. The pressure-sensitive adhesive tape includes a poly(vinyl chloride) substrate and a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed on or over one side of the substrate. The poly(vinyl chloride) substrate contains 10 to 40 percent by weight of bis(2-ethylhexyl) terephthalate. The pressure-sensitive adhesive tape preferably has an unwinding force of 0.4 N/20 mm or less at a tensile speed of 0.3 m/min and an unwinding force of 1.2 N/20 mm or less at a tensile speed of 30 m/min.

To provide a radiation-curable silicone composition which provides a cured product whose odor is decreased, particularly is odorless, and has excellent curability and releasing properties. A radiation-curable silicone composition including the following components (A) and (B): (A) an epoxy group-containing cation-polymerizable organopolysiloxane which is represented by the following average composition formula (1): R.sup.1.sub.aR.sup.2.sub.bSiO.sub.(4-a-b)/2 (1) and (B) an iodonium salt having a cation moiety represented by the following general formula (2) in an effective amount to cure said component (A), [(R.sup.3)—I—(R.sup.3)].sup.+ (2) wherein R.sup.3 is, independently of each other, a substituted or unsubstituted monovalent aromatic hydrocarbon group having 15 to 26 carbon atoms, wherein said component (A) may be accompanied by any other compounds volatilizing during heating at 105 degrees C. for 3 hours, a content of said compounds is at most 2.0 mass %, based on a total amount of component (A) and said compound.