A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

Embodiments of the present disclosure provide a flexible acoustic-electric substrate and a preparation method thereof, and a flexible acoustic-electric device. The preparation method of a flexible acoustic-electric substrate includes: forming a flexible substrate; forming a plurality of piezoelectric components on the flexible substrate; and forming a plurality of chambers on the flexible substrate in a one-to-one correspondence relationship with the plurality of piezoelectric components, and the plurality of chambers are located on a side of the flexible substrate away from the plurality of piezoelectric components.

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

A frequency adjustment method of a vibrator element includes preparing a vibrator element that has a vibrating arm, a first weight placed on one principal surface of the vibrating arm, and a second weight placed on the other principal surface of the vibrating arm, in which the first weight has a non-overlapping region which does not overlap the second weight in a plan view in a normal direction of the principal surface, preparing a substrate including a wiring portion, and fixing the vibrator element to the substrate by causing the other principal surface side of the vibrator element to face the substrate side, and irradiating the non-overlapping region of the first weight with an energy ray from one principal surface side, removing a portion of the non-overlapping region of the first weight, and adjusting a resonance frequency of the vibrating arm.

This disclosure provides methods of fabricating a transducer array. The methods can included creating a lens shaped depression in a backing material, printing an electrode, printing a thick layer of lead zirconate titanate material, printing a ground electrode, and placing a plurality of equally spaced cuts into the depression.

Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.

Disclosed is an integrated circuit (IC) comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising at least one sensor electrode portion (20) and a bond pad portion (22), at least the at least one sensor electrode portion of said patterned upper metallization layer being covered by a moisture barrier film (23); a passivation stack (24, 26, 28) covering the metallization stack, said passivation stack comprising a first trench (32) exposing the at least one sensor electrode portion and a second trench (34) exposing the bond pad portion; said first trench being filled with a sensor active material (36). A method of manufacturing such an IC is also disclosed.

A fluidic device includes a base structure including at least one bulk acoustic wave (BAW) resonator structure having a fluidic passage containing at least one functionalized active region overlaid with functionalization material suitable to bind an analyte. One or more of a wall structure, a cover structure, or a portion of the base structure defining the fluidic passage includes additional functionalization material to form at least one absorber configured to bind at least one analyte. The dynamic measurement range of a BAW resonator structure is increased when the at least one absorber is placed upstream of the at least one functionalized active region.

A vibrator includes: a base portion; a vibrating arm including an arm portion which extends from the base portion, and a weight portion which is located on a tip end side of the arm portion and which has a first main surface and a second main surface that are in a front-back relationship; and a weight film disposed at the first main surface of the weight portion. The first main surface includes a first planar surface, a second planar surface which is located closer to the second main surface than is the first planar surface and which is parallel to the first planar surface, and an inclined surface which couples the first planar surface and the second planar surface and which forms an angle of 100° or less with the first planar surface. A method for manufacturing a vibrator includes: a preparation step of preparing the above-described vibrator; and a removing step of removing a part of the weight film by emitting an energy ray to the weight film from a normal direction of the first planar surface.

A device includes a pair of substrate layer corresponding to a carrier substrate, an intermediary layer disposed on the pair of substrate layers, a cavity region disposed between the pair of substrate layers underneath the intermediary layer, a piezoelectric layer including a lithium-based film disposed on the intermediary layer, and a plurality of interdigital transducer electrodes disposed on the piezoelectric layer. The plurality of interdigital transducer electrodes includes an outer signal electrode, an inner signal electrode, an outer ground electrode and an inner ground electrode.