A plurality of parts built, in an electronic apparatus (1) are attached to a frame (20). Further, the frame (20) has a peripheral wall portion (21, 22, 23) formed along an outer peripheral face of the electronic apparatus (1). An upper cover (30) has a rear face portion (32) attached to a rear wall portion (23) of the frame (20) by a screw. Further, a lower cover (40) has a rear face portion (43) attached to the rear wall portion (23) of the frame (20) by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.

A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Disclosed is a display device that includes a display panel and a multi-layered panel provided adjacent the display panel. The multi-layered panel may include a front plate located toward the display panel, a rear plate provided parallel to the front plate, and a honeycomb mesh interposed between the front plate and the rear plate. The honeycomb mesh may have a plurality of hexagonal cells. A metal plate may be coupled to a rear surface of the multi-layered panel and a drive board may be seated on the metal plate. At least one of the front plate or the rear plate may include at least one opening that extends parallel to a shorter side of the display device.

To prevent a crack from being transferred to the side surface of a housing by concentrating stress in a notch when an impact is applied to a control apparatus so that the crack develops in the coupling position of the first bracket. This protects the housing and protects the circuit board from a fire hazard, thereby ensuring the control of an air bag during a collision and the reading of an air bag operation record after a collision.

A housing for receiving electronic components includes a housing body and a housing cover. The housing body and the housing cover are connected to one another at multiple fastening points. At least one of the fastening points is surrounded by recesses at least in part on the housing body or on the housing cover so that in the event of an internal pressure p.sub.in in the housing exceeding a predetermined threshold value p.sub.max the housing body or the housing cover deforms in the region of the at least one fastening point and a gap is formed between the housing body and the housing cover.

A panel structure of a power apparatus is provided. The power apparatus includes a case. The front of the case is longitudinally provided with a panel. The panel is transversely formed with at least two parallel heat dissipation holes. The panel is formed with a connecting portion between the heat dissipation holes. A heat dissipation net is provided on the heat dissipation holes. The heat dissipation net is formed with a plurality of openings corresponding to the connecting portion. A reinforcement rib is provided on the connecting portion, preventing the panel from collapsing or deforming. The durability of the panel is increased, and the appearance of the panel is pleasing to the eye.

Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and second sections, a module housing, a circuit carrier having a dielectric insulation carrier and an upper metallization layer on an upper side of the insulation carrier, and a semiconductor component; fitting the semiconductor component on the circuit carrier; producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section; producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section; and arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing so the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing.

A cover covers a fuse unit to which a terminal is fixed in a manner such that a nut is fastened onto a bolt placed with the tip thereof facing outward. The cover is provided, on the inner surface thereof in a position corresponding to the nut, with a protrusion having a height set in a manner such that the protrusion does not interfere with the nut located in a fastened position, but interferes with the nut located in another position other than the fastened position. A thin portion is formed on the circumference of the protrusion.

Provided is a display device. The display device includes a display module, which includes a flat display area and a first side display area that is bent from a first side of the flat display area, a frame under the display module, and includes a flat surface support portion that is overlapped with the flat display area, a first side surface support portion that is overlapped with the first side display area, and a coupling portion, and a bracket under the frame being detachably coupled to the frame through the coupling portion.