Patent classifications
H01L35/02
Thermoelectric device having circuitry with structural rigidity
A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly. The first plate has a layer with a plurality of electrically conductive first portions and a plurality of electrically insulating second portions separating the first portions from one another. The at least one thermoelectric sub-assembly includes a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The plurality of thermoelectric elements is in electrical communication with the plurality of electrically conductive portions of the first plate, in electrical communication with electrically conductive portions of the second plate, and in thermal communication with the first plate and the second plate. The plurality of electrically insulating second portions includes a plurality of segments at least partially outside the region, the segments configured to avoid degradation of a structural rigidity of the first plate.
THERMO-ELECTRIC GENERATOR, ASSOCIATED IMPLANTABLE DEVICE AND METHOD
Thermo-electric generator which is intended to be immersed in a fluid which contains at least one chemical species, comprising two electrodes each having a first end and a second end, the first ends being connected to each other, the generator being configured to generate an electrical voltage between the two ends when a temperature difference is imposed between each first end and the corresponding second end, the temperature difference being such that one end, referred to as the “hot end”, of each electrode has a temperature which is strictly greater than the temperature of the other end. The hot end of at least one electrode comprises a micro-organism or an enzyme which is capable of causing at least one exothermic reaction involving the chemical species.
THERMOELECTRIC MODULE
A thermoelectric module according to one embodiment of the present invention comprises: a first metal substrate; a thermoelectric element; and a second metal substrate, wherein the thermoelectric element comprises a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes and a second resin layer, wherein the width of the first metal substrate is greater than the width of the second metal substrate, and the first metal substrate comprises a first surface in direct contact with the first resin layer and a second surface opposite to the first surface, and further comprises: a first support spaced apart from the thermoelectric element and a side surface of the second metal substrate on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate; and a sealing material spaced apart from the thermoelectric element and the side surface of the second metal substrate, on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate.
Thermoelectric Device with Flexible Heatsink
A thermoelectric device suitable for power generation by the Seebeck effect or heating and cooling by the Peltier effect includes a flexible thermoelectric layer with a flexible heatsink layer. A thermally conductive layer can optionally be included on the side of the thermoelectric layer opposite the flexible heatsink layer. Because of its flexibility and durability, the thermoelectric device can be utilized for products such as a thermoelectric generator or cooling/heating system for consumer products, such as a bedding, clothing, hats, seat cushions, and personal portable devices.
Vehicle battery thermoelectric device with integrated cold plate assembly and method of assembling same
A cooling system for thermally conditioning a component which includes a battery and a heat spreader supporting the battery. Multiple thermoelectric devices are bonded to the heat spreader, for example, using solder or braze, which provides improved heat transfer. A cold plate assembly operatively thermally engages the thermoelectric devices.
TEMPERATURE CONTROL DEVICE FOR CHEMICAL LIQUID USED IN SEMICONDUCTOR MANUFACTURING PROCESS
The present invention relates to a temperature control device for a chemical liquid used in a semiconductor manufacturing process, which is located on a chemical liquid circulating and supplying tube to control a temperature of the chemical liquid. The device includes: a first heat sink having a cooling water flow path formed therein; a plurality of thermoelectric modules coming into contact with both side surfaces of the first heat sink, respectively; and a second heat sink coming into contact with the thermoelectric modules, while placing the first heat sink between the thermoelectric modules, and having a plurality of chemical liquid flow path tubes adapted to flow the chemical liquid therealong.
SYSTEM AND METHOD FOR ADJUSTING PROPERTIES OF SEAT FOR VEHICLES
A system for adjusting properties of a seat for a vehicle, may include thermoelement modules configured to have a structure in which a plurality of flexible thermoelements is connected by conductive wires to each other, and mounted in a seat foam pad of the seat; a property adjustment region input unit configured to select a property adjustment region of the seat foam pad; a property adjustment amount input unit configured to input a target property adjustment amount of the seat foam pad; and a controller connected to the thermoelement modules, the property adjustment region input unit and the property adjustment amount input unit, and configured to control an amount of current supplied to some or all of the flexible thermoelements according to output signals from the property adjustment region input unit and the property adjustment amount input unit
System For Controlling Localized Heating And Cooling
A thermal control system includes a component having a surface. A plurality of thermal generating devices include a first conductive plate, second and third conductive plates, a first semiconductor device arranged between the first conductive plate and the second conductive plate, and a second semiconductor device arranged between the first conductive plate and the third conductive plate. The first semiconductor device and the second semiconductor device have different types of doping. First ones of the plurality of thermal generating devices are arranged with the first conductive plate located adjacent to the surface of the component. Second ones of the plurality of thermal generating devices are arranged with the second and third conductive plates located adjacent to the surface of the component. The first ones and the second ones of plurality of thermal generating devices perform heating and cooling of the surface, respectively.
THREE-DIMENSIONAL MEASUREMENT DEVICE
A system and method of determining three-dimensional coordinates is provided. The method includes, with a projector, projecting onto an object a projection pattern that includes collection of object spots. With a first camera, a first image is captured that includes first-image spots. With a second camera, a second image is captured that includes second-image spots. Each first-image spot is divided into first-image spot rows. Each second-image spot is divided into second-image spot rows. Central values are determined for each first-image and second-image spot row. A correspondence is determined among first-image and second-image spot rows, the corresponding first-image and second-image spot rows being a spot-row image pair. Tach spot-row image pair having a corresponding object spot row on the object. Three-dimensional (3D) coordinates of each object spot row are determined on the central values of the corresponding spot-row image pairs. The 3D coordinates of the object spot rows are stored.
Thermoelectric device having a plurality of sealing materials
A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly comprises a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The at least one thermoelectric sub-assembly further includes a first material along a first portion of a perimeter of the region and having a first stiffness and a second material along a second portion of the perimeter of the region and having a second stiffness less than the first stiffness.