Disclosed structures include a semiconductor controlled rectifier or bi-directional semiconductor controlled rectifier with a trigger voltage (Vtrig) that is tunable. Some structures include a semiconductor controlled rectifier with an Nwell and Pwell in a semiconductor layer, with a P-type diffusion region in the Nwell, and with an N-type diffusion region in the Pwell. Gate(s) on the well(s) are separated from the junction between the wells and from the diffusion regions. Other structures include a bidirectional semiconductor controlled rectifier with a Pwell between first and second Nwells in a semiconductor layer, with first P-type and N-type diffusion regions in the first Nwell, and with second P-type and N-type diffusion regions in the second Nwell. Gate(s) on the well(s) are separated from junctions between the Nwells and the Pwell and from any diffusion regions. In these structures, the gate(s) can be left floating or biased to tune Vtrig using gate leakage current.

A bidirectional transient voltage suppressor (TVS) protection circuit includes two sets of steering diodes with a clamp device merged with a steering diode in each set. In one embodiment, the protection circuit includes a first high-side diode integrated with a first silicon controlled rectifier (SCR), a first low-side diode, a second high-side diode integrated with a second SCR, and a second low-side diode. In another embodiment, the protection circuit includes a first high-side diode, a first low-side diode integrated with a first SCR, a second high-side diode, and a second low-side diode integrated with a second SCR. In some embodiments, the TVS protection circuit realizes low capacitance at the protected nodes by fully or almost completely depleting the P-N junction connected to the protected nodes in the operating voltage range.

A bidirectional transient voltage suppressor (TVS) protection circuit includes two sets of steering diodes with a clamp device merged with a steering diode in each set. In one embodiment, the protection circuit includes a first high-side diode integrated with a first silicon controlled rectifier (SCR), a first low-side diode, a second high-side diode integrated with a second SCR, and a second low-side diode. In another embodiment, the protection circuit includes a first high-side diode, a first low-side diode integrated with a first SCR, a second high-side diode, and a second low-side diode integrated with a second SCR. In some embodiments, the TVS protection circuit realizes low capacitance at the protected nodes by fully or almost completely depleting the P-N junction connected to the protected nodes in the operating voltage range.

A semiconductor device includes a first to sixth regions, a first gate, a first metal contact and a second metal contact. The second region is disposed opposite to the first region with respect to the first gate. The first metal contact couples the first region to the second region. The fourth region is disposed opposite to the third region with respect to the first gate. The second metal contact is coupling the third region to the fourth region. The fifth region is disposed between the first gate and the second region, and is disconnected from the first metal contact and the second metal contact. The sixth region is disposed between the first gate and the first region, and is disconnected from the first metal contact and the second metal contact.

A semiconductor device includes a first to sixth regions, a first gate, a first metal contact and a second metal contact. The second region is disposed opposite to the first region with respect to the first gate. The first metal contact couples the first region to the second region. The fourth region is disposed opposite to the third region with respect to the first gate. The second metal contact is coupling the third region to the fourth region. The fifth region is disposed between the first gate and the second region, and is disconnected from the first metal contact and the second metal contact. The sixth region is disposed between the first gate and the first region, and is disconnected from the first metal contact and the second metal contact.

A transient voltage suppression device, apparatus, structure and associated methods thereof. The device includes a first voltage suppression device having a substrate, a first base layer, and a second base layer. The substrate is coupled to the first base layer, and to the second base layer. The device includes a second voltage suppression device having a substrate, a first base layer, a second base layer, and a third base layer. The second voltage suppression device substrate is coupled to the second voltage suppression device first, second and third base layers. The second voltage suppression device first base layer includes one or more first regions. The second voltage suppression device includes a doping region disposed across at least portions of the second voltage suppression device first base layer and the second voltage suppression device substrate. The first voltage suppression device is coupled to the second voltage suppression device.

A multilayered semiconductor diode device can include a substrate including silicon carbide (SiC) with an epitaxial drift layer including a first semiconductor oxide material above the SiC substrate with respect to a growth direction. The multilayered semiconductor diode device can further include a polar nitride layer including a polar semiconductor nitride material above the epitaxial drift layer with respect to the growth direction, and a metal layer above the polar nitride layer with respect to the growth direction.

A transient voltage suppression device includes at least one N-type lightly-doped structure, a first P-type well, a second P-type well, a first N-type heavily-doped area, and a second N-type heavily-doped area. The first P-type well and the second P-type well are formed in the N-type lightly-doped structure. The first N-type heavily-doped area and the second N-type heavily-doped area are respectively formed in the first P-type well and the second P-type well. The doping concentration of the first P-type well is higher than that of the second P-type well. The first P-type well and the second P-type well can be replaced with P-type lightly-doped wells respectively having P-type heavily-doped areas under the N-type heavily-doped areas.

Provided is a semiconductor device including: a plurality of trench portions which are provided to positions below a base region from an upper surface of a semiconductor substrate and are arranged next to one another in a first direction on the upper surface of the semiconductor substrate; a first lower end region of a second conductivity type, which is arranged at a first depth position and is provided in contact with a lower end of two or more of the trench portions; and a second lower end region which is arranged at the first depth position and is arranged at a position not overlapping with the first lower end region, in which the second lower end region includes at least one of a region of a first conductivity type or a region of a second conductivity type which has a lower doping concentration than the first lower end region.

The present disclosure relates to semiconductor structures and, more particularly, to silicon control rectifiers and methods of manufacture. The structure includes: a first well in a semiconductor substrate; a second well in the semiconductor substrate; a third well in the semiconductor substrate which isolates the first well from the second well; and a first diffusion region at a surface of the semiconductor substrate and which extends into the first well and the second well, the first diffusion region includes a same polarity as the third well.