An integrated circuit having a CML driver including a driver biasing network. A first output pad and a second output pad are connected to a voltage pad. A first driver is connected to the first output pad and the voltage pad. A second driver is connected to the second output pad and the voltage pad. A first ESD circuit is connected to the voltage pad, the first output pad, and the first driver. A second ESD circuit is connected to the voltage pad, the second output pad, and the second driver. The first ESD circuit biases the first driver toward a voltage of the voltage pad when an ESD event occurs at the first output pad, and the second ESD circuit biases the second driver toward the voltage of the voltage pad when an ESD event occurs at the second output pad.

An integrated circuit is formed on a substrate containing a semiconductor material having a first conductivity type. A deep well having a second, opposite, conductivity type is formed in the semiconductor material of the first conductivity type. A deep isolation trench is formed in the substrate through the deep well so as separate an unused portion of the deep well from a functional portion of the deep well. The functional portion of the deep well contains an active circuit element of the integrated circuit. The separated portion of the deep well does not contain an active circuit element. A contact region having the second conductivity type and a higher average doping density than the deep well is formed in the separated portion of the deep well. The contact region is connected to a voltage terminal of the integrated circuit.

A multilayer semiconductor device structure having different circuit functions on different semiconductor device layers is provided. The semiconductor structure comprises a first semiconductor device layer fabricated on a bulk substrate. The first semiconductor device layer comprises a first semiconductor device for performing a first circuit function. The first semiconductor device layer includes a patterned top surface of different materials. The semiconductor structure further comprises a second semiconductor device layer fabricated on a semiconductor-on-insulator (SOI) substrate. The second semiconductor device layer comprises a second semiconductor device for performing a second circuit function. The second circuit function is different from the first circuit function. A bonding surface coupled between the patterned top surface of the first semiconductor device layer and a bottom surface of the SOI substrate is included. The bottom surface of the SOI substrate is bonded to the patterned top surface of the first semiconductor device layer via the bonding surface.

An overvoltage protection portion (14) includes a transistor (P1) that achieves continuity with an input voltage (VIN) used as an output voltage (VOUT) to an internal circuit when the input voltage (VIN) applied to an external terminal (T1) is not in an overvoltage state. The overvoltage protection portion (14) also includes: a transistor (P2) operating as a short circuit that short-circuits the source and the gate of the transistor (P1) and that interrupts the input voltage (VIN) when the input voltage (VIN) is in the overvoltage state; a resistor (R2); and a Zener diode (ZD1). The overvoltage protection portion (14) also includes: a transistor (NTr1) operating as a bypass circuit that supplies a constant output voltage (VOUT) from the external terminal (T1) to the internal circuit when the input voltage (VIN) is brought into the overvoltage state; a resistor (R3); and a Zener diode (ZD2).

Three-dimensional electrostatic discharge (ESD) semiconductor devices are fabricated together with three-dimensional non-ESD semiconductor devices. For example, an ESD diode and FinFET are fabricated on the same bulk semiconductor substrate. A spacer merger technique is used in the ESD portion of a substrate to create double-width fins on which the ESD devices can be made larger to handle more current.

An integrated circuit having a CML driver including a driver biasing network. A first output pad and a second output pad are connected to a voltage pad. A first driver is connected to the first output pad and the voltage pad. A second driver is connected to the second output pad and the voltage pad. A first ESD circuit is connected to the voltage pad, the first output pad, and the first driver. A second ESD circuit is connected to the voltage pad, the second output pad, and the second driver. The first ESD circuit biases the first driver toward a voltage of the voltage pad when an ESD event occurs at the first output pad, and the second ESD circuit biases the second driver toward the voltage of the voltage pad when an ESD event occurs at the second output pad.

A semiconductor device includes high-voltage (HV) and low-voltage (LV) MOS's formed in a substrate. The HV MOS includes a first semiconductor region having a first-type conductivity and a first doping level, a second semiconductor region having the first-type conductivity and a second doping level lower than the first doping level, a third semiconductor region having a second-type conductivity, and a fourth semiconductor region having the first-type conductivity. The first, second, third, and fourth semiconductor regions are arranged along a first direction, and are drain, drift, channel, and source regions, respectively, of the HV MOS. The LV MOS includes the fourth semiconductor region, a fifth semiconductor region having the second-type conductivity, and a sixth semiconductor region having the first-type conductivity. The fourth, fifth, and sixth semiconductor regions are arranged along a second direction different from the first direction, and are drain, channel, and source regions, respectively, of the LV MOS.

A power MOSFET and a sense MOSFET for detecting a current of the power MOSFET are formed in a semiconductor chip, and a source pad and a Kelvin pad are formed of a source electrode for the power MOSFET. The source pad is a pad for outputting the current flowing to the power MOSFET, and the Kelvin pad is a pad for detecting a source potential of the power MOSFET. The source electrode has a slit, and at least a part of the slit is arranged between the source pad and the Kelvin pad when seen in a plan view.

An electrostatic discharge (ESD) logging system includes ESD detection circuitry having at least one input electrically connected coupled to a node of an ESD protection circuit. The ESD detection circuitry provides a detector signal in response to detecting an ESD event at the node of the ESD protection circuit. Capture circuitry is electrically connected to an output of the ESD detection circuitry. The capture circuitry asserts a capture signal to indicate the occurrence of the ESD event in response to the detector signal. A logic circuit provides a logic output in response to the capture signal.

An electronic device for generating an error signal in response to an electrostatic discharge perturbation is described. The device may comprise: a detection unit for generating a detection signal in response to said electrostatic discharge perturbation, said detection signal correlating in time with said electrostatic discharge perturbation; a clock for generating a clock signal having a clock period; and a protection unit for generating an error signal in response to said detection signal only when a duration of said detection signal exceeds a predefined multiple of said clock period. A method of generating an error signal in response to an electrostatic discharge perturbation, for protecting electronic circuitry, is also disclosed.