An optical sensor arrangement (10) comprises a light sensor (11) that is connected to a summation node (13) and is designed for generating a sensor current (S2), a current source (S2) connected to the summation node (13) and designed to provide a source current (S3), and an integrator (21) that is coupled to the summation node (13) and is designed for generating a first value (VP1) of an integrator signal (S6) by integrating during a first phase (P1) and for generating a second value (VP2) of the integrator signal (S6) by integrating during a second phase (P2). The optical sensor arrangement (10) comprises a sum and hold circuit (31) that is coupled to the integrator (21) and is designed to generate an analog output signal (S7) as a function of a difference of the first value (VP1) and the second value (VP2) of the integrator signal (S6).

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

The semiconductor device comprises a semiconductor substrate (1), a sensor or sensor array (2) arranged at a main surface (10) of the substrate, an integrated circuit (3) arranged at or above the main surface, and a focusing element (17) comprising recesses (4) formed within a further main surface (11) of the substrate opposite the main surface. The focusing element may be arranged opposite the sensor or sensor array (2), which may be a photosensor or photodetector or an array of photosensors or photodetectors, for instance. The focusing element (17) is formed by etching the recesses (4) into the semiconductor material.

The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy.

A positioning method of a photoelectric conversion device (an imaging device) includes irradiating an optical member with light and receiving light which passes through an opening of a light shielding member and the optical member with the photoelectric conversion device. The photoelectric conversion device is moved in a direction orthogonal to an optical axis of the optical member and a first position at which the photoelectric conversion device detects a side of an opening and a second position at which the photoelectric conversion device detects another side opposing the side are acquired. A position of the photoelectric conversion device at which a center of the opening and a center position of the photoelectric conversion device are aligned based on the first position and the second position is determined. The photoelectric conversion device is fixed at the determined position.

A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

A photoelectric conversion device is provided. The device includes a pixel array in which pixels are arranged, a drive controller configured to drive the pixel array, a horizontal transfer unit configured to sequentially output analog signals respectively output from columns of the pixel array, an AD converter configured to convert an analog signal output from the horizontal transfer unit into a digital signal, a first clock generator configured to generate a clock signal used to control an operation of the drive controller, and a second clock generator configured to generate a clock signal used to control the horizontal transfer unit and the AD converter. A clock tree in which a clock signal is distributed from the first clock generator and a clock tree in which a clock signal is distributed from the second clock generator form clock trees different from each other.

A light detecting device includes: a light detector; a heat exchanger thermally connected to the light detector; a coolant flow channel configured to be connected to the heat exchanger and allow a coolant for cooling the light detector to flow; a pump configured to cause the coolant to flow in the coolant flow channel; and a control unit that controls the pump. The control unit performs control such that a first drive power is supplied to the pump during a detection period in which the light detector performs light detection, and a second drive power is supplied to the pump during a standby period in which the light detector stands by without performing light detection, and the first drive power is smaller than the second drive power.

Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.

A solar array, comprising: at least one solar panel comprising a primary surface and a secondary surface; the primary surface having a group of direct solar cells disposed thereon, each of the direct solar cells configured to receive direct sunlight and to provide electrical power to a respective portion of a substantially flat flexible circuit; and the secondary surface having a group of indirect solar cells disposed thereon, each of the indirect solar cells configured to receive reflected sunlight and to provide electrical power to a respective portion of a substantially flat flexible circuit.