H10F19/20

Foil-based metallization of solar cells

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

WAFER-INTEGRATED, ULTRA-LOW PROFILE CONCENTRATED PHOTOVOLTAICS (CPV) FOR SPACE APPLICATIONS

A concentrator-type photovoltaic module includes a plurality of photovoltaic cells having respective surface areas of less than about 4 square millimeters (mm) electrically interconnected in series and/or parallel on a backplane surface, and an array of concentrating optical elements having respective aperture dimensions of less than about 30 mm and respective focal lengths of less than about 50 mm. The array of concentrating optical elements is positioned over the photovoltaic cells based on the respective focal lengths to concentrate incident light on the photovoltaic cells, and is integrated on the backplane surface by at least one spacer structure on the backplane surface. Related devices, operations, and fabrication methods are also discussed.

PHOTOELECTRIC CONVERSION ELEMENT, SOLAR BATTERY, SOLAR BATTERY MODULE, AND SOLAR POWER GENERATION SYSTEM

A photoelectric conversion element of an embodiment includes a first electrode, a second electrode, and a light-absorbing layer containing a chalcopyrite-type compound containing a group Ib element, a group IIIb element, and a group VIb element between the first electrode and the second electrode. A region in which concentration of the group Ib element in the light-absorbing layer is from 0.1 to 10 atom %, both inclusive, is included in a region up to a depth of 10 nm in a direction from a principal plane of the light-absorbing layer on a side of the second electrode to a side of the first electrode.

SOLAR CELL HAVING A PLURALITY OF SUB-CELLS COUPLED BY A METALLIZATION STRUCTURE
20170062640 · 2017-03-02 ·

Solar cells having a plurality of sub-cells coupled by metallization structures, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, a solar cell, includes a plurality of sub-cells, each of the sub-cells having a singulated and physically separated semiconductor substrate portion. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between. The solar cell also includes a monolithic metallization structure. A portion of the monolithic metallization structure couples ones of the plurality of sub-cells. The groove between adjacent ones of the singulated and physically separated semiconductor substrate portions exposes a portion of the monolithic metallization structure.

Sensor package structure

A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

Sensor package structure

A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

SOLAR CELL AND PHOTOVOLTAIC MODULE
20250081665 · 2025-03-06 ·

The present disclosure relates to the technical field of photovoltaic modules, and in particular, to a solar cell and a photovoltaic module. The solar cell includes a substrate and a positive gate line and a negative gate line that are arranged on a back surface of the substrate, wherein the positive gate line and the negative gate line are alternately arranged and are not connected. An edge portion of at least one side of the back surface in at least one direction is an insulating portionoverlap with one anotheroverlap with one another.

Solar cell panels and method of fabricating same

A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each cathode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.

SOLAR CELL MODULE
20250133861 · 2025-04-24 · ·

A solar cell module having a design region corresponding to a power-generating cell, wherein the design region consists of one unit region or a repeat of two or more unit regions, the unit region consists of a plurality of partial regions having different average transmittances throughout the entire design region, and the average transmittance throughout the entire design region and the area fraction in the unit region, of each of the partial regions are set to satisfy Formula 1 in which the average transmittance of the design region is not less than an arbitrary constant:

[00001] [ Math . 1 ] T d = .Math. m = 1 n ( T a _ m .Math. R p _ m ) C Formula 1

SOLAR CELL MODULE
20250133861 · 2025-04-24 · ·

A solar cell module having a design region corresponding to a power-generating cell, wherein the design region consists of one unit region or a repeat of two or more unit regions, the unit region consists of a plurality of partial regions having different average transmittances throughout the entire design region, and the average transmittance throughout the entire design region and the area fraction in the unit region, of each of the partial regions are set to satisfy Formula 1 in which the average transmittance of the design region is not less than an arbitrary constant:

[00001] [ Math . 1 ] T d = .Math. m = 1 n ( T a _ m .Math. R p _ m ) C Formula 1